The present invention relates to an elastic wave device.
Elastic wave devices are in widespread use, for example in filters in cellular phones. Japanese Unexamined Patent Application Publication No. 2006-295976, below, discloses an example of an elastic wave device. This elastic wave device includes a piezoelectric substrate made of LiNbO3. On the piezoelectric substrate, interdigital transducer (IDT) electrodes are provided that are primarily a metal whose density is higher than that of Al. On the piezoelectric substrate, a dielectric layer covers the IDT electrodes. In Japanese Unexamined Patent Application Publication No. 2006-295976, the thickness of the metal film forming the IDT electrodes and the Euler angles of the piezoelectric substrate are set within predetermined ranges so that the electromechanical coupling coefficient will be large for the elastic waves to be used and small for unwanted waves.
In recent years, there is a need for even smaller elastic wave devices. For the elastic wave device described in Japanese Unexamined Patent Application Publication No. 2006-295976, however, reducing its size requires increasing the electrode thickness, and the increased thickness leads to a larger fractional bandwidth of unwanted waves, which affects bandpass characteristics. As this shows, it is difficult to reduce the size of an elastic wave device while limiting unwanted waves and maintaining bandpass characteristics.
Preferred embodiments of the present invention provide elastic wave devices that are each able to be reduced in size while reducing unwanted waves.
An elastic wave device according to a preferred embodiment of the present invention includes a piezoelectric substrate made of LiNbO3; interdigital transducer (IDT) electrodes on the piezoelectric substrate; and a first dielectric film on the piezoelectric substrate, the first dielectric film covering the IDT electrodes and made of a silicon oxide. The IDT electrodes include a first metal film made of one metal selected from Pt, Cu, Mo, Au, W, and Ta. The Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are Euler angles (about 0°±5°, about −90°≤θ≤−70°, about) 0°±5°. When the wavelength, determined by the finger pitch of the IDT electrodes, is denoted by λ, and the thickness of the first metal film normalized by the wavelength λ is denoted by hm/λ (%), the metal for the first metal film and the thickness hm/λ (%) match any of the combinations listed in Table 1 below:
7 ≤ hm/λ ≤ 25
An elastic wave device according to a preferred embodiment of the present invention includes a piezoelectric substrate made of LiNbO3; IDT electrodes on the piezoelectric substrate; and a first dielectric film on the piezoelectric substrate, the first dielectric film covering the IDT electrodes and made of a silicon oxide. The IDT electrodes include a first metal film made of one metal selected from Pt, Cu, and Mo. The Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are Euler angles (about 0°±5°, about −90°≤θ≤−27.5°, about 0°±5°). When the wavelength, determined by the finger pitch of the IDT electrodes, is denoted by λ, the thickness of the first metal film normalized by the wavelength λ is denoted by hm/λ (%), and the thickness of the first dielectric film normalized by the wavelength λ is denoted by hs/λ (%), the metal for the first metal film, the thickness hm/λ (%), the thickness hs/λ (%), and θ of the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate match any of the combinations listed in Tables 2 to 9 below:
7 ≤ hm/λ ≤ 9.4
10 ≤ hm/λ ≤ 18.8
7 ≤ hm/λ ≤ 8.4
6 ≤ hm/λ ≤ 8.1
6 ≤ hm/λ ≤ 7.9
7 ≤ hm/λ ≤ 7.5
6 ≤ hm/λ ≤ 7.7
6 ≤ hm/λ ≤ 7.4
6 ≤ hm/λ ≤ 7.2
6 ≤ hm/λ ≤ 6.5
30.7 ≤ hm/λ ≤ 31.8
33.3 ≤ hm/λ ≤ 36.7
25.6 ≤ hm/λ ≤ 33.9
21.9 ≤ hm/λ ≤ 32.2
21.1 ≤ hm/λ ≤ 30.4
21.5 ≤ hm/λ ≤ 29.5
33.7 ≤ hm/λ ≤ 40.3
19.6 ≤ hm/λ ≤ 36.3
18.6 ≤ hm/λ ≤ 35.5
18.5 ≤ hm/λ ≤ 34.6
20.5 ≤ hm/λ ≤ 29.5
43.92 ≤ hm/λ ≤ 44.15
41.4 ≤ hm/λ ≤ 41.7
41.4 ≤ hm/λ ≤ 41.8
35 ≤ hm/λ ≤ 40
41.4 ≤ hm/λ ≤ 41.9
34.5 ≤ hm/λ ≤ 39.9
17.1 ≤ hm/λ ≤ 23.5
44.5 ≤ hm/λ ≤ 44.6
34.5 ≤ hm/λ ≤ 39.2
35 ≤ hm/λ ≤ 36
29.6 ≤ hm/λ ≤ 40.4
41.5 ≤ hm/λ ≤ 45.6
21.1 ≤ hm/λ ≤ 40.5
17.3 ≤ hm/λ ≤ 44.7
40.4 ≤ hm/λ ≤ 44.2
15.7 ≤ hm/λ ≤ 20.5
16 ≤ hm/λ ≤ 17.5
43 ≤ hm/λ ≤ 53.6
13 ≤ hm/λ ≤ 14.5
18 ≤ hm/λ ≤ 63.5
13 ≤ hm/λ ≤ 16.5
13 ≤ hm/λ ≤ 15.5
13 ≤ hm/λ ≤ 14.3
17 ≤ hm/λ ≤ 77.6
16 ≤ hm/λ ≤ 28.5
72 ≤ hm/λ ≤ 76.5
An elastic wave device according to a preferred embodiment of the present invention includes an intermediate film made of a dielectric material between the piezoelectric substrate and the IDT electrodes. This enables the elastic wave device to be customized in terms of electromechanical coupling coefficient, and therefore, in terms of fractional bandwidth, with reduced unwanted waves.
In an elastic wave device according to a preferred embodiment of the present invention, the IDT electrodes include a second metal film having higher electrical conductivity than the first metal film. When the piezoelectric substrate side of the IDT electrodes is defined as the lower side and an opposite side is defined as the higher side, the first metal film is higher than the second metal film. This further reduces the impact of the thickness of the first dielectric film on the fractional bandwidth of unwanted waves.
In an elastic wave device according to a preferred embodiment of the f the present invention, a second dielectric film is provided on the first dielectric film. This makes the device easy to customize in terms of frequency.
In an elastic wave device according to a preferred embodiment of the present invention, the device uses shear horizontal (SH) waves. This makes a preferred embodiment of the present invention particularly advantageous.
The preferred embodiments of present invention each provide an elastic wave device that is able to be reduced in size while reducing unwanted waves.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
Preferred embodiments of the present invention will be described with reference to the drawings to make the present invention clearly understood.
It is to be noted that the preferred embodiments set forth herein are illustrative and partial replacement or combination of the configurations between different preferred embodiments is possible.
The elastic wave device 1 illustrated in
Interdigital transducer (IDT) electrodes 3 are provided on the piezoelectric substrate 2. The IDT electrodes 3 include multiple fingers 3a. On the piezoelectric substrate 2, a first dielectric film 4 covers the IDT electrodes 3. In the present preferred embodiment, the first dielectric film 4 is made of SiO2.
The material for the first dielectric film 4 may alternatively be a silicon oxide other than SiO2. The silicon oxide does not need to be SiO2 and is expressed as SiOx (x is an integer).
On the first dielectric film 4 is a second dielectric film 5. In the present preferred embodiment, the second dielectric film 5 is preferably made of SiN, for example. By including the second dielectric film 5, the device is easy to customize in terms of frequency. The material for the second dielectric film 5 does not need to be the one named above. Even if made of a material other than SiN, the second dielectric film 5 is advantageous because it improves, for example, the moisture resistance of the elastic wave device 1. The second dielectric film 5, however, is optional.
As illustrated in
The fourth electrode layer 3a4 is the first metal film. The IDT electrodes 3 only need to include at least the fourth electrode layer 3a4 as the first metal film. The first metal film is the primary electrode in the IDT electrodes 3. The primary electrode herein is the electrode layer that is predominant in the excitation of elastic waves.
The first electrode layer 3a1 illustrated in
The fourth electrode layer 3a4 is preferably made of one metal selected from Pt, Cu, Mo, Au, W, and Ta, for example. Here, when the wavelength, determined by the finger pitch of the IDT electrodes 3, is denoted by λ, and the thickness of the fourth electrode layer 3a4 normalized by the wavelength λ is denoted by hm/λ (%), the metal for and the thickness hm/λ (%) of the fourth electrode layer 3a4 match any of the combinations listed in Table 10 below. That is, if the fourth electrode layer 3a4 is made of Pt, the thickness hm/λ (%) is about 6.5% or more and about 25% or less. If the fourth electrode layer 3a4 is made of Cu, the thickness hm/λ (%) is about 13% or more and about 25% or less. If the fourth electrode layer 3a4 is made of Mo, the thickness hm/λ (%) is about 15.5% or more and about 25% or less. If the fourth electrode layer 3a4 is made of Au, the thickness hm/λ (%) is about 6.5% or more and about 25% or less. If the fourth electrode layer 3a4 is made of W, the thickness hm/λ (%) is about 7.5% or more and about 25% or less. If the fourth electrode layer 3a4 is made of Ta, the thickness hm/λ (%) is about 7% or more and about 25% or less.
The fifth electrode layer 3a5 is preferably made of Ti, for example. The fifth electrode layer 3a5 is a protective layer. By virtue of having the fifth electrode layer 3a5, the IDT electrodes 3 are highly resistant to, for example, moisture.
In the present preferred embodiment, 1) the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate 2 are preferably Euler angles (0°, −90°≤θ≤−70°, 0°), for example, and 2) the metal for and the thickness hm/λ (%) of the first metal film, in the IDT electrodes 3 match any of the combinations listed in Table 10. These enable an elastic wave device to be smaller with reduced unwanted waves. The following explains this, taking as an example a case in which the first metal film is made of Pt.
As seen in
For example, in the related art, the thickness of the first metal film may be approximately 3.5%. As shown in
In the Preferred Embodiment 1, moreover, the thickness of the first metal film is preferably about 25% or less. This ensures high productivity.
Thickening a metal film in IDT electrodes, however, may increase the fractional bandwidth of unwanted waves. The following explains this using a Comparative Example 1. The Comparative Example 1 is different from the Preferred Embodiment 1 in that the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are Euler angles (0°, −10°, 0°).
As shown in
In the Preferred Embodiment 1, the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are preferably Euler angles (0°, −90°≤θ≤−70°, 0°). This ensures a small fractional bandwidth of unwanted waves. The following explains this by comparing Preferred the Embodiment 1 and a Comparative Example 2 in
In
As seen in
In the Comparative Example 2, incidentally, it is difficult to greatly reduce the size of the elastic wave device because the first metal film is thin. In the configuration of the Comparative Example 1 in
The following describes configurations of the Preferred Embodiment 1 in which the first metal film is preferably made of a metal other than Pt, i.e., one metal selected from Cu, Mo, Au, W, and Ta. Each configuration of the Comparative Example 1 described below is the same or substantially the same as that of the Comparative Example 1 in
As seen in
In
As shown in
Moreover, as shown in
As shown in
Moreover, as shown in
As shown in
Moreover, as shown in
As shown in
Moreover, as shown in
As shown in
Moreover, as shown in
To summarize, the Preferred Embodiment 1, even with a first metal film made of a metal other than Pt, or one metal selected from Cu, Mo, Au, W, and Ta, enables elastic wave devices to be greatly reduced in size with reduced unwanted waves, as in the case in which the first metal film is made of Pt.
Moreover, even if the first metal film is made of a metal other than Pt, or one metal selected from Cu, Mo, Au, W, and Ta, productivity is high because the thickness of the first metal film is preferably about 25% or less, for example.
The present preferred embodiment offers the same advantage even if the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are Euler angles (0°±5°, θ, 0°±5°). The term 0°±5° herein means that the value falls within the range of about 0°±5°.
The elastic wave device of a variation of the Preferred Embodiment 1 includes an intermediate film 16 made of a dielectric material between the piezoelectric substrate 2 and the IDT electrodes 3. In this variation, the thickness of the intermediate film 16 is preferably about 10 nm, for example. This, however, is not the only possible thickness of the intermediate film 16.
As shown in
Here, the piezoelectric substrate 2 side of the IDT electrodes 3 is defined as the lower side, and the opposite side is defined as the higher side. Referring back to
The following describes a Preferred Embodiment 2 of the present invention.
An elastic wave device according to the Preferred Embodiment 2 is different from the Preferred Embodiment 1 in the combination of the metal for and the thickness of the first metal film in the IDT electrodes and the thickness of the first dielectric film. Except for this, the elastic wave device according to the Preferred Embodiment 2 has the same or substantially the same structure as the elastic wave device 1 according to the Preferred Embodiment 1, illustrated in
To be more specific, the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are preferably Euler angles (0°, −90°≤θ−27.5°, 0°), for example. The first metal film, in the IDT electrodes, is preferably made of one metal selected from Pt, Cu, and Mo, for example.
When the thickness of the first dielectric film normalized by the wavelength λ is denoted by hs/λ (%), the metal for and the thickness hm/λ (%) of the first metal film, the thickness hs/λ (%) of the first dielectric film, and θ of the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate match any of the combinations listed in Tables 11 to 18 below.
In the Preferred Embodiment 1, described above, the thickness of the first dielectric film has little impact on the fractional bandwidth of unwanted waves. In the present preferred embodiment, each range of the thickness of the first metal film and the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate include a value falling out of the range in the Preferred Embodiment 1, but the thickness of the first dielectric film falls within the range in Tables 11 to 18 below. This ensures that the elastic wave device is able to be reduced in size with reduced unwanted waves.
As shown in
The following specifically demonstrates, by using
As shown in
As shown in
As shown in
The present preferred embodiment provides the same or substantially the same advantages even if the Euler angles (ϕ, θ, ψ) of the piezoelectric substrate are Euler angles (0°±5°, θ, 0°±5°).
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Number | Date | Country | Kind |
---|---|---|---|
2016-223710 | Nov 2016 | JP | national |
This application claims the benefit of priority to Japanese Patent Application No. 2016-223710 filed on Nov. 17, 2016 and is a Continuation Application of PCT Application No. PCT/JP2017/036681 filed on Oct. 10, 2017. The entire contents of each of these applications are hereby incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
Parent | PCT/JP2017/036681 | Oct 2017 | US |
Child | 16400051 | US |