Patent Application
20220368086
This application claims the benefit of the filing date under 35 U.S.C. ยง 119(a)-(d) of Chinese Patent Application No. 202110521458.1, filed on May 13, 2021.
Embodiments of the present disclosure relate generally to an electric connector, and particularly to an electric connector assembly which is capable of transmitting data at a high-frequency data transmission rate.
A conventional high-speed electric connector assembly generally includes a plastic housing and contact terminals (including signal terminals and ground terminals) assembled in the plastic housing. Two circuit boards are connected to each other through these contact terminals. In order to ensure the transmission performance of high-frequency signals, the conventional electric connector assembly has very high requirements on the manufacturing tolerance of the plastic housing. When conventional manufacturing technology is used, requirements for manufacturing accuracy will be very strict, thereby increasing manufacturing difficulty and cost. In addition, resonance generated during transmission of the high-frequency signals in the conventional high-speed electric connector assembly also needs to be alleviated.
An electric connector assembly includes an insulating housing, a plurality of rows of contact terminals disposed in the insulating housing and including a plurality of signal terminals and a plurality of ground terminals, and a conductive shell assembled on the insulating housing. The conductive shell contacts and is connected with the ground terminals to electrically connect the ground terminals together.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
and
The technical solutions of the present disclosure will be further specifically described below with reference to embodiments in conjunction with the drawings. The same or similar elements are indicated by the same or similar reference signs in the description. The following description of the embodiments of the present disclosure with reference to the drawings is intended to explain the general inventive concept of the present disclosure and should not be construed as a limitation on the present disclosure.
In addition, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent, however, that one or more embodiments may be implemented without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
It should be noted that each kind of components/structures (such as first ground terminals, second ground terminals, first conductive protrusions, second conductive protrusions, upright walls, terminal passages) in the electric connector assembly according to the present disclosure are presented in multiple components/structures, and for the purpose of clear illustration in the drawings, only one or two of each kind of components/structures are indicated by reference signs. For example, only one first ground terminal 221, one second ground terminal 222, one first conductive protrusion 311, one second conductive protrusion 312, one upright with 320, and one terminal passage 340 are indicated in
As shown in the embodiment of
The conductive shell 300 is assembled on the insulating housing 100. The conductive shell 300 is respectively contacted and connected with the corresponding plurality of ground terminals 221, 222 to electrically connect the plurality of ground terminals 221, 222 together. As shown in
In the electric connector assembly 1000, the conductive shell 300 is formed on the basis of the insulating housing 100, and all of the ground terminals 221, 222 are connected together in such a way that the conductive shell 300 contacts the ground terminals 221, 222. Thereby, the electrical performance of the entire electric connector assembly 1000 is improved. In addition, the transmission performance of the electric connector assembly 1000 for high-frequency signals is improved, and at the same time, the high requirements on the manufacturing tolerance of the housing 100 which are imposed in order to ensure the transmission performance of the high-frequency signals in the related art are relatively reduced, thus alleviating the influence of the manufacturing tolerances of the insulating housing 100 and all of components (such as the terminals) on the transmission of the high-frequency signals.
As shown in
In an embodiment, the conductive shell 300 may be formed integrally with the plurality of conductive protrusions 311, 312 to simplify the manufacturing process.
As shown in the embodiment of
As shown in
Each of the plurality of first conductive protrusions 311 is contacted and connected with a corresponding one of the plurality of first ground terminals 221, and each of the plurality of second conductive protrusions 312 is contacted and connected with a corresponding one of the plurality of second ground terminals 222. In other words, the ground terminals 221 and 222 are arranged around each pair of signal terminals 210, and the ground terminals arranged around each pair of signal terminals 210 are electrically connected together through the conductive protrusions 311 or 312 to provide improved electric shielding performance for each pair of signal terminals 210. Therefore, with the electric connector assembly 1000, the resonance generated during transmission of the high-frequency signals is also alleviated, so that the signals are transmitted more stably.
In the shown embodiment, the first conductive protrusion 311 has a different shape from the second conductive protrusion 312. Specifically, in the embodiment shown in
In the shown embodiment, the first ground terminal 221 has a different shape from the second ground terminal 222. Specifically, in the embodiment shown in
In addition, as shown in
In an embodiment, a plurality of conductive shells 300 are formed side by side and parallel to each other on the insulating housing 100. As shown in
In an embodiment, the conductive shell 300 is formed by a Physical Vapor Deposition (PVD) technology or a Molded Interconnect Device (MID) technology, and is assembled on the insulating housing 100. The MID technology refers to a technology of fabricating or mounting a component with an electrical function on a surface of an injection-molded plastic housing 100, so as to combine the electrical interconnection function of the component with the mechanical support function of the plastic housing 100. Of course, in other embodiments, any other technologies capable of metallizing the surface of the plastic insulating housing 100 may also be used to form the conductive shell 300 on the insulating housing 100.
The insulating housing 100 includes a plastic housing, and the conductive shell 300 includes a metallized shell formed by depositing a layer of metal on the plastic housing. In an exemplary embodiment, the conductive shell 300 may be made by depositing a layer of nickel on the plastic housing. Of course, in other embodiments, the conductive shell 300 may also be made by depositing any other conducting metal material, or may also be made of any other conducting pure metal material by die casting or casting.
As shown in
It should be appreciated by those skilled in the art that the embodiments described above are all exemplary, and the structures described in the various embodiments can be freely combined unless they conflict in terms of structure or principle. Although the embodiments of the present disclosure have been described with reference to the drawings, the embodiments shown in the drawings are intended to illustrate embodiments of the present disclosure and shall not be construed as a limitation on the present disclosure. Although some embodiments of the present general inventive concept have been shown and described, it would be understood by those skilled in the art that changes may be made therein without departing from the principles and spirit of the present general inventive concept. The scope of the present disclosure is defined in the appended claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110521458.1 | May 2021 | CN | national |
