Patent Application
20230389240
An embodiment of the present invention relates to an electric power conversion apparatus.
In the related art, an electric power control apparatus in which a heat release fin is provided on a housing which accommodates an electronic device is known. The electric power conversion apparatus includes, for example, a heat sink on a heat release substrate on which a plurality of switching elements that are heat sources are mounted and thereby cools the plurality of switching elements.
However, in the electric power conversion apparatus, since heat generation occurs in accordance with a heat transfer or an electric power distribution amount even in a path for electric power distribution such as a metal conductor or an electric wire connected to the plurality of switching elements, there is a possibility that an abnormality caused by a temperature increase may occur.
A problem to be solved by the present invention is to provide an electric power conversion apparatus capable of improving a heat release capability.
An electric power conversion apparatus of an embodiment includes a DC-side terminal and a heat release member. The heat release member is electrically conductive. The heat release member is provided on the DC-side terminal.
Hereinafter, an electric power conversion apparatus according to an embodiment will be described with reference to the drawings.
Hereinafter, each axis direction of the X-axis, the Y-axis, and the Z-axis orthogonal to one another in a three-dimensional space is in a direction parallel to each axis. For example, as shown in
The electric power conversion apparatus 10 is, for example, a board provided on an electrical facility or the like. The board is a switchboard, a distribution board, a control board, and the like that constitute an electric power supply apparatus, a motor drive apparatus, and the like.
The electric power conversion apparatus 10 includes, for example, a variety of circuit components such as a semiconductor element, a conductor, a fuse, a capacitor, a transformer, a switch, a circuit breaker, and a measurement device that constitute an electric power converter such as an inverter.
As shown in
The multiple-phase semiconductor stacks 11 are, for example, three-phase semiconductor stacks 11 of an R-phase, S-phase, and a T-phase. The three-phase semiconductor stacks 11 are arranged, for example, on a first end part among both end parts in a thickness direction of the electric power conversion apparatus 10. The first end part is, for example, an end part on a positive direction side of the Z-axis direction. The three-phase semiconductor stacks 11 are arranged, for example, to be aligned on a line along the X-axis direction.
As shown in
The bridge circuit includes a plurality of pairs of high-side-arm and low-side-arm transistors H and L. The bridge circuit includes a reflux diode D that is connected in a forward direction from an emitter toward a collector between the collector and the emitter of each transistor H and L.
A collector of the high-side-arm transistor H of each phase is connected to a positive terminal PR, PS, and PT of each phase. An emitter of the low-side-arm transistor L of each phase is connected to a negative terminal NR, NS, and NT of each phase. An emitter of the high-side-arm transistor H of each phase and a collector of the low-side-arm transistor L of each phase are connected to an AC-side terminal R, S, and T of each phase.
As shown in
As shown in
The positive-electrode bus bar 15P is a conductor connected commonly to multiple-phase positive-electrode terminals PR, PS, and PT of each phase. The negative-electrode bus bar 15N is a conductor connected commonly to the multiple-phase negative-electrode terminals NR, NS, and NT of each phase.
As shown in
The positive-electrode-side connection member 17P and the negative-electrode-side connection member 17N are, for example, a conductor having a plate shape. The positive-electrode-side connection member 17P and the negative-electrode-side connection member 17N are arranged, for example, to be laminated in the Z-axis direction with each other between the multiple-phase semiconductor stack 11 and the plurality of capacitors 13.
As shown in
The negative-electrode-side connection member 17N connects a multiple-phase negative terminal NR, NS, and NT to the negative-electrode-side terminal CN of the multiple-phase capacitor 13.
The positive-electrode-side connection member 17P and the negative-electrode-side connection member 17N connect the multiple-phase capacitors 13 in parallel.
As shown in
The outer shape of each of the multiple-phase positive-electrode heat release member and the multiple-phase negative-electrode heat release member is, for example, a plate shape. Each positive-electrode heat release member and each negative-electrode heat release member is arranged, for example, so as to protrude in the Z-axis direction from the positive-electrode-side connection member 17P and the negative-electrode-side connection member 17N. Each positive-electrode heat release member and each negative-electrode heat release member is formed of, for example, a material having an electrical conductivity and a thermal conductivity such as a metal.
The multiple-phase positive-electrode heat release members of each phase are, for example, an R-phase positive-electrode heat release member 21P, an S-phase positive-electrode heat release member 21P, and a T-phase positive-electrode heat release member 21P.
The multiple-phase negative-electrode heat release members of each phase are, for example, an R-phase negative-electrode heat release member 21N, an S-phase negative-electrode heat release member 23N, and a T-phase negative-electrode heat release member 25N.
The positive-electrode heat release member 21P, 23P, and 25P of each phase and the negative-electrode heat release member 21N, 23N, and 25N of each phase are connected, for example, to the positive terminal PR, PS, and PT of each phase and the negative terminal NR, NS, and NT of each phase at a middle part in the Y-axis direction of the electric power conversion apparatus 10. The positive-electrode heat release member 21P, 23P, and 25P of each phase and the negative-electrode heat release member 21N, 23N, and 25N of each phase extend, for example, from the middle part in the Y-axis direction of the electric power conversion apparatus 10 toward one end part and are connected to the positive-electrode bus bar 15P and the negative-electrode bus bar 15N.
For example, the R-phase positive-electrode heat release member 21P includes a first positive-electrode heat release member 21Pa and a second positive-electrode heat release member 21Pb. The R-phase negative-electrode heat release member 21N includes a first negative-electrode heat release member (not shown) and a second negative-electrode heat release member (not shown). Each of the R-phase first positive-electrode heat release member 21Pa and the R-phase first negative-electrode heat release member extends from the middle part in the Y-axis direction of the electric power conversion apparatus 10 toward one end part. Each of the R-phase second positive-electrode heat release member 21Pb and the R-phase second negative-electrode heat release member extends from a first end part of both end parts in the X-axis direction toward the middle part along an inner wall surface of a housing 31.
For example, the T-phase positive-electrode heat release member 25P includes a first positive-electrode heat release member 25Pa and a second positive-electrode heat release member 25Pb. The T-phase negative-electrode heat release member 25N includes a first negative electrode heat release member (not shown) and a second negative-electrode heat release member (not shown). Each of the T-phase first positive-electrode heat release member 25Pa and the T-phase first negative-electrode heat release member extends from the middle part in the Y-axis direction of the electric power conversion apparatus 10 toward one end part. Each of the T-phase second positive-electrode heat release member 25Pb and the T-phase second negative-electrode heat release member extends from a second end part of both end parts in the X-axis direction toward the middle part along the inner wall surface of the housing 31.
According to the embodiment described above, by including each positive-electrode heat release member 21P, 23P, and 25P and each negative-electrode heat release member 21N, 23N, and 25N that are provided on each positive terminal PR, PS, and PT and each negative terminal NR, NS, and NT which are DC-side terminals of each phase of the three phases, it is possible to improve the heat release capability. Each heat release member 21P, 23P, 25P, 21N, 23N, and 25N is connected via each terminal PR, PS, PT, NR, NS, and NT to each semiconductor stack 11 which is a heat source and can thereby prompt the heat release of the heat source and prevent a temperature increase of the electric power distribution path.
Each positive-electrode heat release member 21P, 23P, and 25P and each negative-electrode heat release member 21N, 23N, and 25N is connected to the positive-electrode bus bar 15P and the negative-electrode bus bar 15N, and thereby, it is possible to promote the heat transfer to each of the positive-electrode bus bar 15P and the negative-electrode bus bar 15N from the semiconductor stack 11 of each phase. By connecting the semiconductor stack 11 of each phase via no other phases directly to the positive-electrode bus bar 15P and the negative-electrode bus bar 15N, it is possible to improve the heat release of the semiconductor stack 11 of each phase, and it is possible to prevent a local temperature increase of the electric power distribution path.
By including the positive-electrode-side connection member 17P and the negative-electrode-side connection member 17N that connect the multiple-phase capacitors 13 in parallel, it is possible to easily ensure a voltage balance property among the multiple-phases capacitors.
By including the R-phase second positive-electrode heat release member 21Pb, the R-phase second negative-electrode heat release member, the T-phase second positive-electrode heat release member 25Pb, and the T-phase second negative-electrode heat release member that are arranged along the inner wall surface of the housing 31, it is possible to improve the heat release of the R-phase and T-phase semiconductor stacks 11.
When the electric power conversion apparatus 10 is used in a reactive power compensation apparatus, the positive-electrode bus bar 15P and the negative-electrode bus bar 15N can function as a heat release member in which no current flows, and it is possible to increase the device capacity.
Hereinafter, a modification example is described.
The above embodiment is described using an example in which the electric power conversion apparatus 10 includes the positive-electrode heat release member 21P, 23P, and 25P of each phase and the negative-electrode heat release member 21N, 23N, and 25N of each phase that are connected to the positive-electrode bus bar 15P and the negative-electrode bus bar 15N; however, the embodiment is not limited thereto. For example, at least one of the positive-electrode heat release members 21P, 23P, and 25P of the three phases and at least one of the negative-electrode heat release members 21N, 23N, and 25N of the three phases may be connected to the positive-electrode bus bar 15P and the negative-electrode bus bar 15N.
As shown in
In the electric power conversion apparatus 10A of the modified example, the R-phase and T-phase positive terminals PR and PT are connected indirectly to the positive-electrode bus bar 15P via the positive-electrode-side connection member 17P and the S-phase positive-electrode heat release member 23P. The R-phase and T-phase negative terminals NR and NT are connected indirectly to the negative-electrode bus bar 15N via the negative-electrode-side connection member 17N and the S-phase negative-electrode heat release member 23N.
The above embodiment is described using an example in which the positive-electrode bus bar 15P and the negative-electrode bus bar 15N are arranged at the middle part in the X-axis direction at one end part in the Y-axis direction of the electric power conversion apparatus 10; however, the embodiment is not limited thereto. The positive-electrode bus bar 15P and the negative-electrode bus bar 15N may be arranged at a suitable position in the electric power conversion apparatus 10.
According to at least one embodiment described above, by including each positive-electrode heat release member 21P, 23P, and 25P and each negative-electrode heat release member 21N, 23N, and 25N that are provided on each positive terminal PR, PS, and PT and each negative terminal NR, NS, and NT which are DC-side terminals of each phase of the three phases, it is possible to improve the heat release capability. Each heat release member 21P, 23P, 25P, 21N, 23N, and 25N is connected via each terminal PR, PS, PT, NR, NS, and NT to each semiconductor stack 11 which is a heat source and can thereby prompt the heat release of the heat source and prevent a temperature increase of the electric power distribution path.
Although some embodiments of the present invention have been described, these embodiments are presented as an example and do not limit the scope of the invention. These embodiments can be implemented in various other forms, and a variety of omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and variations thereof are included in the scope and gist of the invention and are also included in the scope of the invention described in the appended claims and equivalence thereof.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2021/037374 | 10/8/2021 | WO |
