Patent Application
20130203271
Some electronic assemblies include circuits disposed on separate circuit carriers. The carriers and/or the circuits disposed thereon can lie in different planes. For example, touch screens typically involve an ultra-thin array of sensing electrodes disposed on a glass or plastic touch substrate. The sensing electrodes can be printed or otherwise disposed directly on the touch substrate, or they can be disposed on a thin, typically flexible, intermediate carrier that, in turn, is disposed on the touch substrate. The sensing electrodes terminate at or otherwise are connected to bonding pads to enable connection of the sensing electrodes to a control circuit. The control circuit typically is located on another substrate, for example, a printed wiring board, that is attached to or otherwise associated with the touch substrate. Portions of the control circuit to be connected to the sensing electrodes also terminate at or otherwise are connected to bonding pads to enable connection of the control circuit to the sensing electrodes.
The control circuit substrate could be attached to the touch substrate adjacent the array of sensing electrodes. However, because the thickness of the control circuit substrate typically is substantially greater than the thickness of the sensing electrodes and any intermediate carrier they might be disposed on, the bonding pads connected to the sensing electrodes typically lie in a substantially different plane than do the bonding pads connected to the control circuit. As such, the respective bonding pads may lie at substantially different perpendicular distances from the surface of the touch substrate upon which they or their respective carriers/substrates are disposed. Conventional means for interconnecting bonding pads located in different planes often are difficult to realize.
a is a detail view of a portion of
First substrate 12 and second substrate 16 could be made of any material or materials suitable for use as an electrical circuit platform, as would be understood by one skilled in the art. For example, first substrate 12 could be a printed wiring board made of FR4 or another material, a flexible circuit carrier or a piece of glass or plastic forming a portion of a touch screen assembly, another form of user interface or a circuit platform. Second substrate 16 could be embodied in any of the foregoing forms. In an illustrative embodiment, at least a portion of surface 12S and at least a portion of surface 16S are substantially planar. Either or both of first substrate 12 and second substrate 16 could be embodied in numerous other ways and made of other materials, as would be recognized by one skilled in the art.
First circuit 14 could be disposed directly first substrate 12 in any suitable form and using any suitable technique. For example, first circuit 14 could be an array of sensing electrodes connected directly or indirectly to one or more bonding pads 14BP. Bonding pads 14BP could, but need not, be disposed on a substantially planar portion of surface 12S of first substrate 12. Alternatively or additionally, first circuit 14 could include other electrical/electronic components (not shown) and electrical traces (not shown), among other elements.
First circuit 14 could be formed by printing conductive ink directly onto first substrate 12, by plating, patterning and etching first substrate 12, or by other suitable means, as would be understood by one skilled in the art. In other embodiments, first circuit 14 could take other forms, and it could be disposed on first substrate 12 in other ways, as would be understood by one skilled in the art. For example, first circuit 14 could be disposed an intervening circuit carrier (not shown) that would, in turn, be disposed on first substrate 12. Such an intervening circuit carrier could be made of any suitable material, for example, flexible polyester or any other material suitable for use as a circuit carrier, as would be recognized by one skilled in the art. It could be attached to first substrate 12 using an adhesive or other suitable means.
Second circuit 20 could be disposed directly or indirectly on second substrate 16 in any suitable form and using any suitable technique, for example, any of the forms and techniques discussed above. Second circuit 20 could include, for example, bonding pads 20BP, electrical traces (not shown) and various electrical/electronic components (not shown), among other components. Bonding pads 20BP could, but need not, be disposed on a substantially planar portion of surface 16S of second substrate 16.
As best illustrated in
Undercuts 36 provide clearance for the foot or flange 42 of body 26, as will be discussed further below. In embodiments wherein sufficient clearance exists between first substrate 12 and second substrate 16 to receive foot or flange 42 of body 26 therebetween, as discussed further below, undercut 36 could be omitted. Such clearance could be provided by means of shims or spacers (for example, a sufficiently thick adhesive layer 18) disposed between first substrate 12 and second substrate 16.
Slots 32 and/or countersunk portions 36 could be molded or machined into second substrate 16. In other embodiments, second substrate 16 could define more or fewer than two slots 32 and countersunk portion 36 could be embodied in other forms. In further embodiments, one or more slots similar to slots 32 could be defined by another substrate or structure (not shown), for example, a stand off attached to first substrate 12 and adapted to receive or retain a portion of interconnect apparatus 22. Such structure could, but need not, include an undercut similar to undercut 36. In embodiments including such a stand off or similar structure, slots 32 and countersunk portions 36 need not be provided in second substrate 16.
As discussed above and illustrated in
In the illustrated embodiment, body 26 includes a generally elongated core portion 38 having an upper side 46, a lower side 48, a first end 50 and a second end 52. A first leg 40 depends generally perpendicularly from lower side 48 of core portion 38 at or near first end 50 thereof, and a second leg 40 depends generally perpendicularly from lower side 48 of core portion 38 at or near second end 52 thereof. In other embodiments, core portion 38 could have other shapes, and legs 40 could depend from other regions of core portion 38, and in other orientations. For example, legs 40 could depend from regions of core portion 38 intermediate first and second ends 50, 52 thereof. Also, legs 40 could depend from core portion 38 in an angular orientation or another orientation not generally perpendicular to core portion 38. A foot or flange 42 extends laterally from the free end of each leg 40.
Each leg 40 is configured such that at least a portion thereof may be received by a corresponding slot 32 of second substrate 16. Also, each foot or flange 42 is configured such that at least a portion thereof may be received by a corresponding countersunk portion 36 of second substrate 16. More particularly, at least a portion of each leg 40 can be inserted into a corresponding slot 32, and at least a portion of each foot 42 can be inserted into countersunk portion 36 such that the flange 42 is disposed between upper surface 12S of first substrate 12 and countersunk portion 36 of second substrate 16, thereby holding interconnect apparatus 22 in place. In embodiments not including countersunk portion 36, as discussed above, each foot or flange 40 could simply be disposed between upper surface 12S first substrate 12 and lower surface 16S′ of second substrate 16.
In embodiments having slot structure and countersunk portions independent of second substrate 16, as discussed above, legs 40 and feet 42 of body 26 could be mechanically engaged with such structure instead of with second substrate 16.
Snap geometry, for example, ramps 44 as shown in
As discussed above, spring elements 24 extend from body 26. Each spring element 24 has a center section 24C, a first end section 28 extending outwardly from one end of center section 24C, and a second end section 30 extending outwardly from the other end of center section 24C. Center section 24C is retained by or connected to core portion 38 of body 26, and first and second end sections 28, 30 extend outwardly from core portion 38 of body 26. Core portion 38 could retain center section 24C in any number of ways. For example, core portion 38 could be partially or completely molded about center section 24C, or core portion 38 could be formed in two or more pieces that are post-assembled about center section 24C. Alternatively, center portion 24C could be connected to upper or lower side 46, 48 of core 38 using screws, rivets or other fasteners, or by another suitable technique, as would be recognized by one skilled in the art.
First end section 28 includes a first contact point 28CP. First contact point 28CP may be located at or near the terminal end of first end section 28 or at another point between the terminal end thereof and center section 24. First end section 28 and first contact point 28CP are configured so that first contact point 28CP can make good electrical contact with an applicable portion, for example, bonding pad 14BP, of first circuit 14, as discussed further below. Similarly, second end section 30 includes a second contact point 30CP. Second contact point 30CP may be located at or near the terminal end of second end section 30 or at another point between the terminal end thereof and center section 24. Second end section 30 and second contact point 30CP are configured so that second contact point 3CP can make good electrical contact with an applicable portion, for example, bonding pad 20BP, of second circuit 20, as discussed further below.
The lengths and geometry of first and second end sections 28, 30 of springs 24 can be selected as desired for a particular application. For example, first and second end sections 28, 30 of spring elements 24 could have different lengths and extend from body 26 at different angles or in different orientations in order to facilitate engagement of spring elements 24 with circuits 14, 20 disposed on substrates 12, 16.
Also, the terminal ends of first and second end sections 28, 30 of spring elements 24 could be bent back upon themselves or in a dog-leg manner as shown in
The embodiments disclosed herein are merely illustrative, and they are not to be deemed to limit the scope of the present invention. One skilled in the art would recognize how to modify the disclosed embodiments or implement alternative embodiments without departing from the scope of the invention as defined in the claims below.
| Number | Date | Country | |
|---|---|---|---|
| 61595210 | Feb 2012 | US |
