This Nonprovisional application claims priority under 35 U.S.C. ยง119(a) on Patent Application No. 91215898 filed in TAIWAN on Oct. 8, 2002, the entire contents of which are hereby incorporated by reference.
The invention relates to an electrical connection device, and in particular, to a structural improvement for an electrical connection device that provide an electrical connection between a pin-type IC device and a circuit board.
Since long time ago, there are two kinds of traditional manner to place integrated circuit package (abbreviated as IC package) on a circuit board (or called main board): one manner is directly welding wherein the IC package can not be pulled out, and another manner is replaceable wherein the IC package can be pulled out. The replaceable assembly device of an electrical connection device and a circuit board is usually adapted for IC package that needs upgrade or renew. And, when one of the circuit board or the IC package is out of order, another element still be remained for continuous usage. The assembly device of a socket and a circuit board for central processing unit (abbreviated as CPU) plugged in computer is a typical example.
Please refer to FIG. 1 and
As regarding to be plugged through the pin 111 of the prior IC package 11 and have the replaceable function, the prior pin-type electric connector 13 currently used all includes following components: a socket 132, which has plural pinholes 131 and is welded on the circuit board 12; a sliding plate 133, which is arranged over the top face of the socket 132 by a linearly sliding manner; and a long pulling rod 134, which is arranged at one side of the socket 132 for driving the sliding plate 133 to proceed a slight slide. In each pinhole 131 of the socket 132, a holder 137 is arranged. And, there is a solder pad 135 formed at the bottom of the pinhole 131. The lower end of the holder 137 is extended out of the bottom of the pinhole 131 to form pin 1371 that will be plugged into the penetration hole 121 of the circuit board 12. A conducting layer 122 is arranged in the penetration hole 121 of the circuit board 12 for being electrically connected to the pin 1371. On the upper surface of the circuit board 122, solder mask 124 is used to define the penetration hole 121 and the contact pad 1221 thereon. The pin 1371 together with the socket 13 is welded fixedly upon the circuit board 12 by solder material 123, 125. A lightly larger opening (not shown in the figures) is arranged at the position corresponding to the pin 131 on the sliding plate 133. Pressing down the long pulling rod 134 will make it rotate around the rod axis 136 until it is horizontal to the socket 132, such that the sliding plate 133 proceeds a slightly sliding movement to fix the pin 111 of the IC package 11 into the pinhole 131. When the IC package 11 is going to be pulled out, then it is necessary to rotate the long pulling rod 134 to become 90 degrees vertically to the socket 132, such that the pin 111 will be loosened to take out the IC package 11.
Please refer to FIG. 3 and
The main objective of the invention is to provide an electrical connection device, wherein by the appropriately structural design of a conductive holder, the electrical connection device can provide preferable electric characteristic and co-planarity between the electrical connection part at the lower end of the holder and a circuit board to increase production efficiency, and production yield.
The secondary objective of the invention is to provide an electrical connection device, wherein by filling a resin material in the electrical connection part arranged at the lower end of the holder, the electrical connection device can provide preferable structural strength between the holder and a circuit board.
To achieve aforementioned objective, an electrical connection device according to the invention is provided for an electric connection of an outside pin-typed IC package. The electrical connection device at least includes a conductive holder made by bending a metallic piece into a single component. The holder further includes an extension part, a holding part, and an electrical connection part. The holding part is located at one end of the extension part and is shown a preset angle with the extension part. By bending the holding part, an opening is formed to receive a pin plugged and contacted. The electrical connection part is located at another end of the extension part and is shown as a hollow structure having an accommodation inner space.
The electrical connection device further includes a socket with a plurality of pinholes arranged inside and corresponding to those pins of the IC package. And a plurality of the holders are respectively arranged in the pinholes.
For your esteemed members of reviewing committee to further understand and recognize the invention, a detailed description together with corresponding drawings are presented as follows.
Several preferable embodiments are proposed thereinafter to describe the detailed means, action manners, achievable functions, and other technical characteristics of the electrical connection device and its using method according to the invention in detailed way.
Please refer to
The electrical connection device 30 includes: a socket 39, a sliding cover mechanism 35, plural conductive holders 34. In the preferable embodiment according to the invention, plural pinholes 33 corresponding to the sliding cover mechanism 35 are arranged upon the socket 39, and the positions of these pinholes 33 are also corresponding to those of plural pins 111 of the IC package 11, such that the IC package 11 be plugged into the pins 33 of the socket 39 and, if necessary, the IC package can be pulled out of the socket 39 as well.
Each of plural holders 34 is respectively accommodated in each corresponding plural pinhole 33. And, each holder 34 is made by bending a metallic piece into one single element. In the preferable embodiment according to the invention, the holder 34 be made of materials, such as; nickel, gold, chromium, copper, iron, aluminum, titanium, lead, tin, or other preferable alloy, etc., and its surface be plated with different metallic materials as well. Each holder 34 is respectively comprised of an extension part 341, a holding part 342, and an electrical connection part 343. The extension part 341 is arranged and extended along the extending direction of the pinhole 33. Several claw-wedging structures 3412 formed in concave-convex-shape are arranged at appropriate position of the extension part 341. The claw-wedging structure 3412 provides a clawing force at the inside wall surface of the pinhole 33 of the socket 39, such that it prevents the holder 34 from dropping off or displacing from the pinhole 33. The holding part 342 located at one end (top end) of the extension part 341 having a predetermined angle (for example, vertical angle) with the extension part 341 and is provided for the pin 111 to be plugged therein. As shown in
By sliding manner, the sliding cover mechanism 35 is arranged upon the side surface, of the socket 39, facing the IC package 11. When the outside pin-typed IC package 11 is plugged into the pinhole 33 of the socket 39, the sliding cover mechanism 35 make limited sliding displacement to push the pin 111 from the position of the accommodation opening 3421 toward the holding side 3422, such that the IC package 11 is fixed and positioned on the socket 39. Since the choice and application of aforementioned sliding cover mechanism 35 is similar to the structures of the sliding plate and the long pulling rod according to the prior arts shown in FIG. 1 and is not the technical characteristic pursued by the invention, so the detailed construction of the sliding cover mechanism is not presented hereinafter.
One upper surface of the circuit board 40 is electrically connected to the electrical connection device 30. In the preferable embodiment according to the invention, plural solder pads 42 are formed at top side of the circuit board 40 to provide the connection of the corresponding electrical connection parts 343. The positions of the plural solder pads 42 are corresponding to those of the plural pins 33. A non-conducting mask layer 44 is distributed upon the upper surface of the circuit board 40. The mask layer 44 is used to define the position of each solder pad 42, such that each solder pad 42 will not be covered by the mask layer 44 and is exposed to provide the connection with the electrical connection part 343. In other preferable embodiments of the invention described thereinafter, since most parts of the elements are the same as or similar to those described there before, so each of the same elements will be directly assigned with the same name or number, and each of the similar elements will be then assigned with the same name but, for the distinguishing purpose, an English character appended to the previous number.
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Number | Date | Country | Kind |
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91215898 U | Oct 2002 | TW | national |
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5791929 | Banakis et al. | Aug 1998 | A |
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6142810 | Hsiao et al. | Nov 2000 | A |
6572397 | Ju | Jun 2003 | B2 |
6702594 | Lee et al. | Mar 2004 | B2 |
6774314 | Toyoshima et al. | Aug 2004 | B2 |
Number | Date | Country | |
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20040072462 A1 | Apr 2004 | US |