The present invention relates to electrical connections, and more particularly to electrical connections suitable for withstanding harsh conditions.
Electrical connections that can withstand harsh conditions, for example high pressures and exposure to high flow, are utilized in various applications. For example, in drilling applications, such as gas, oil or geothermal drilling, down hole environments can be exposed to pressures of 1,000 to 20,000 psi and flows containing muddy and/or rocky materials. It is often desirable to employ electronic sensing equipment in down hole environments to provide information about the conditions to a drill operator. Reliable electrical connections are important to ensure that information is reliably transmitted.
Some methods have been developed to create connections between an insulated wire and a socket, suitable for harsh applications, but the methods require, for example, creating a solder joint or crimping the socket to an exposed portion of the wire to make the electrical connection. These types of connection methods create assemblies that contain wire disposed between very rigid areas, such as insulation and the socket. A wire so disposed can be susceptible to failure from bending or tensile loads.
Hence, there exists a need to provide electrical connections which exhibit excellent strength characteristics. There also exists a need to create assemblies of a wire and a socket that are strong enough to absorb bending forces while ensuring excellent electrical conductivity. Finally, there is an on-going demand for providing electrical connections which remain functional for long periods of time under harsh conditions.
These needs and others are met by the methods and apparatuses of the present invention. The apparatuses basically comprise a socket which has at least two contiguous passages formed therein which are adapted to receive exposed wire and/or insulated wire such that forces exerted on the exposed wire are minimized. As such, it is an objective of the present invention to substantially disperse bending and tensile forces to areas of the electrical assemblies such as the wire insulation, bonding materials, and crimp joints. In one embodiment, electrical connection assemblies are provided, which comprise an electrically conductive wire encapsulated by a sheath of insulating material, the insulating sheath having a first end, a first portion of the wire extending beyond the first end of the insulated sheath; and a socket having first and second contiguous passages formed therein, the first passage being of larger diameter than the second passage, the first portion of the wire being disposed in the second passage, the first end of the insulating sheath being disposed in the first passage. In other embodiments, the assemblies further comprise electrically conductive bonding material disposed in the first and second passages. The electrically conductive bonding material bonds the first portion of the wire to the second passage the first end of the insulating sheath to the second passage.
Yet other embodiments have at least one crimp joint formed between the socket and either the exposed wire or the insulated wire. For example, a crimp joint can be formed between the first passage and first end of the insulating sheath. Another desirable crimp joint can be formed, alone or in combination with the crimp joint associated with the insulated sheath, between the second passage and the first portion of the wire. Further, in conjunction with one or more crimp joints, conductive bonding materials can also be used with the assemblies as described above.
For applications where the assemblies are exposed to, for example, mud and moisture, the assemblies can further comprise a boot surrounding the socket and a portion of the insulated sheath. In conjunction with the boot, it is optional to provide a coating of grease on an outer wall of the socket to facilitate overlaying the boot around the socket and portion of insulated wire.
In harsh environments, such as down holes of oil drilling applications, electrical assemblies in accordance with the present invention can include the wire being located in a subsurface environment and the socket being connected to a processor, wherein the processor is at substantially atmospheric conditions. In some cases, the wire is an antenna. The processor, thus, can process signals from the wire and send information about the down hole conditions to an operator at the surface.
Kits are also provided by the present invention which comprise an electrical socket having first and second contiguous passages formed therein, the first passage being of a larger diameter than the second passage, an electrically conductive bonding material, and instructions for creating an electrical connection with an insulated wire. In some instances, the kits can further comprise a boot.
Methods of making electrical connections are provided which comprise providing an electrically conductive wire encapsulated by a sheath of insulating material, wherein the insulating sheath has a first end and a first portion of the wire extends beyond said first end of said insulated sheath; providing a socket having first and second contiguous passages where the first passage has a larger diameter than the second passage; and inserting the first portion of the wire into the second passage and inserting the first end of the insulated sheath into the first passage.
The methods can further comprise inserting an electrically conductive bonding material into the first and second passages, wherein the electrically conductive bonding material bonds the first portion of the wire to the second passage and the first end of the insulating sheath to the second passage.
Other methods further comprise crimping the socket in the vicinity of the first passage so as to form a crimp joint between the first passage and first end of the insulating sheath. Also, it may be desirable, either alone or in combination with crimping the area of the first passage and insulated wire, to crimp the socket in the vicinity of the second passage so as to form a crimp joint between the second passage and the first portion of the wire. Further, methods can include inserting an electrically conductive bonding material into the socket passages in conjunction with one or more crimp joints.
In some embodiments, the method the steps of forming the crimp joint between the first passage and the first end of the insulating sheath are performed at a first gauge setting and the step of forming the crimp joint between the second passage and the first portion of the wire is performed at a second gauge setting which is set for a smaller diameter wire than the first gauge setting.
With respect to the sockets, in some instances sockets come in standard configurations which have a single passage, typically adapted to contain an exposed wire, formed therein. As such, methods in accordance with the present invention can further comprise counterboring the sockets to create an additional passage which is adapted to receive an insulated wire.
Yet other methods include inserting the socket and a portion of the insulated sheath into a boot. In addition, methods can further comprise coating an outer wall of the socket with grease.
In harsh environments, such as down holes of oil drilling applications, methods in accordance with the present invention can include transmitting information from a subsurface environment to a processor which is at substantially atmospheric conditions via an electrical connection.
The present invention will be better understood, and its objectives and advantages will become apparent to those skilled in the art by reference to the following detailed description when taken in conjunction with the following drawings, in which:
Referring to the drawings wherein the same reference numerals in different figures refer to like elements,
According to the current invention, the electrical connection is made by stripping a portion of the insulation 3 so as to expose the end of the conductive wire 1. The portion of the exposed wire 1 is inserted into the passage 9 and the adjacent portion of the insulation 3 is inserted into the larger passage 7.
With reference to
An electrically conductive bonding material 15, for example, electrically conductive epoxy LOCITE® 3880 (Supplied by Locite Corp., Hartford, Conn.), can be inserted into the socket and come in substantial contact with the exposed wire and the portion of insulated wire that is located in the socket. The bonding material provides electrical contact while providing a bond between the wire and the socket and between the insulated portion and the socket, which provides added strength to the connection assembly. Although not depicted in the figures, it is conventional to have a weep hole that passes through the socket wall to the passage area of the socket. Upon crimping, epoxy typically oozes out of the weep hole and around the insulated wire.
With reference to
In some circumstances, such as when the electrical connection is part of the antenna of a downhole assembly in a drill string, it is desirable to place a support under the boot and adjacent insulated wire and to encapsulate the assembly in RTV. A metal cover plate is secured around the assembly.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof an, accordingly, reference should be made to the appended claims, rather the foregoing specification, as indicating the scope of the invention.
Number | Name | Date | Kind |
---|---|---|---|
3753193 | Teagno et al. | Aug 1973 | A |
4482296 | Wassell et al. | Nov 1984 | A |
4482297 | Mosimann et al. | Nov 1984 | A |
4684326 | Wassell et al. | Aug 1987 | A |
4779352 | Lang | Oct 1988 | A |
5126564 | Perry et al. | Jun 1992 | A |
5134285 | Perry et al. | Jul 1992 | A |
5134783 | Perry | Aug 1992 | A |
5135059 | Turner et al. | Aug 1992 | A |
5144126 | Perry et al. | Sep 1992 | A |
5216242 | Perry et al. | Jun 1993 | A |
5226332 | Wassell | Jul 1993 | A |
5251708 | Perry et al. | Oct 1993 | A |
6102681 | Turner | Aug 2000 | A |
6105690 | Biglin, Jr. et al. | Aug 2000 | A |
6123561 | Turner et al. | Sep 2000 | A |
6134892 | Turner et al. | Oct 2000 | A |
6257356 | Wassell | Jul 2001 | B1 |
6285014 | Beck et al. | Sep 2001 | B1 |
6491546 | Perry | Dec 2002 | B1 |
6507401 | Turner et al. | Jan 2003 | B1 |
6547016 | Wassell | Apr 2003 | B2 |
6622803 | Harvey et al. | Sep 2003 | B2 |
6634427 | Turner et al. | Oct 2003 | B1 |
6707556 | Turner et al. | Mar 2004 | B2 |
6714138 | Turner et al. | Mar 2004 | B1 |
20020011358 | Wassell | Jan 2002 | A1 |
20050142937 | Lin | Jun 2005 | A1 |
20050181667 | Kao | Aug 2005 | A1 |
20050181669 | Holland | Aug 2005 | A1 |
20050221669 | Kodaira | Oct 2005 | A1 |