1. Field of the Invention
The present invention relates to the art of electrical connectors. In detail, the present invention relates to a central processing unit (CPU) socket and an assembly using the same.
2. Background of the Invention
CPU sockets are widely used for establishing electrical connection between CPU and a printed circuit board (PCB)/motherboard. Therefore, CPU sockets are mounted on motherboards and hold CPUs execution of programs. Several types of CPU sockets are available with different structures. For example, type of Land Grid Array (LGA) sockets, which are found in U.S. Pat. No. 7,044,746 issued to Copper on May 16, 2006, and U.S. Pat. No. 6,908,313 issued to Walkup on Jun. 21, 2005. For example, type of Pin Grid Array (PGA) socket, which is found in U.S. Pat. No. 6,663,409 issued to Liao on Dec. 16, 2003.
Electrical connection between an electrical contact of a LGA socket and an IC package (e.g. CPU) is established by a pressing manner. The electrical contact of a LGA socket generally comprises a long resilient arm extending out of passageway of an insulative housing of the socket. The resilient arm has a contacting portion, and the IC package has a conductive pad corresponding to the contacting portion. Pad of the IC package is contacting with the contacting portion in a space out of the passageway of the insulative housing. The LGA socket has an advantage of easily using, easily to get a high-density layout of the contacts. But the LGA socket has a disadvantage of hardly to meet the trend of miniaturization of the socket.
A typical PGA socket is different from a LGA socket. In a PGA socket, an electrical contact is generally received in a passageway entirely, and the IC package has pin to be inserted into the passageway. The insulative housing of the PGA socket has an advantage of miniaturization; but PGA socket is hardly to provide a high-density layout of the contacts because of the contact received in the housing requiring a large cavity.
In view of foregoing, a new electrical connector system is needed to overcome the above-mentioned shortcomings.
Accordingly, an object of the present invention is to provide an electrical connector that maximizes the quantity of contacts and reduces the size of the housing.
To achieve the above-mentioned object, in a preferred embodiment of the present invention, the present invention provides an electrical connector system comprising an IC package (e.g. CPU) and an electrical connector. The electrical connector comprises a base defining a plurality of passageways, a plurality of contacts each received in a passageway, and a cover mounted on the base and moveable relative to the base from a first position to a second position. The cover defines a plurality of through holes corresponding to the plurality of contacts of the base; and the plurality of contacts each have a resilient arm extending out of the passageway and extending in a space defined by a lower surface of the cover and a mating surface of the base. The IC package is mounted on an upper surface of the cover, defining a plurality of pins through the through holes of the cover. During the movement of the cover from the first position to the second position, the pins of the IC package press on a surface of the resilient arm of the contact in a vertical direction, and the resilient arms deflect toward an adjacent passageway. Thus electrical engagement between the pins and the resilient arms occurs in the vertical direction in the space defined by the lower surface of the cover and the mating surface of the base.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made to accompany drawings to describe the present invention in detail.
Referring to
The electrical connector 1 comprises base 10, a plurality of contacts 12 received in the base 10, and a cover 14. The base 10 has a mating surface 100 with a plurality of passageways 102. Each of he plurality of contacts 12 is received in a passageway 102, and has a resilient arm 120 extending out of the passageway 102. The resilient arm 120 extends toward an adjacent passageway 102 and defines a lower end for electrically connecting with the PCB via soldering art.
The cover 14 is moveably mounted upon the base 10, defining a bottom surface 140 corresponding to the mating surface 100 of the base 10 and an upper surface 142 opposite to the bottom surface 140. A plurality of through holes 146 extends through both the upper surface 142 and the bottom surface 140. Each of the plurality of through holes 146 is configured to ensure a pin 20 of the IC package 2 to be inserted into. The plurality of through holes 146 each define a guiding slot (not labeled), which is formed by a chamfer arranged at a position near the upper surface 142.
After the cover 14 is assembled to the base 10, the resilient arms 120 of the contacts 12 are extending in a space defined by the mating surface 100 of the base 10 and the bottom surface 140 of the cover 14.
It is needed to point out; an actuator (not shown) will be arranged between the base 10 and the cover 14. As a conventional PGA socket, the actuator may be an eccentric cam or an operating lever. The actuator is used for driving the cover 14 to slide relative to the base 10 from a first position to a second position, which is well know to a people having ordinary skill in the art.
The IC package 2 is mounted upon the upper surface 142 of the cover and has a plurality of pins 20 corresponding to the through holes 146.
Referring to the
According to the preferred embodiment of the present invention, the pins 20 of the IC package contact with the resilient arm 120 of the contact 12. The pins need not to be inserted into the passageway 102. Thus, the contacts 12 do not need a large cavity arranged in the passageway 102. The engagement part of the contacts 12 is a plurality of resilient arm 120, thus a high-density layout of the contacts 12 is provided.
Although the present invention has been described with reference to the accompanying drawings, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims. Such modifications and alterations that may be apparent to a person skilled in the art are intended to be included within the scope of this invention as defined in by the accompanying claims.
Number | Date | Country | Kind |
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200720041466.1 | Aug 2007 | CN | national |