The present disclosure relates to a connector assembly, in particular to an electrical connector assembly with lockable structures.
With the increase of the network age, the requirements on data processing and transmission speed are increased, the performance and device density of the corresponding servers, workstations and CPUs in the I/O memory are synchronously improved, and certain challenges are brought to the device size and the heat dissipation of the servers. Generally, the heat sink occupies a large space on the printed circuit board, and the space between the heat sink and the printed circuit board in the height direction is small, such that the conventional connector cannot be arranged below the heat sink, and it is difficult to utilize the redundant space below the heat sink, resulting in wasted space of the printed circuit board is wasted.
The present disclosure provides a high-speed connector on a high-density MINI version chip side, which has small size and the height of less than 3.7 mm, can be placed under a heat sink of a chip, and has the transmission speed up to 56 Gbit/s. The space of the board end is utilized to the maximum extent, and the problem that the CPU occupies the space of the board end due to the size expansion of the radiating module is solved.
To achieve the above object, the present disclosure provides a high-speed connector on a high-density MINI version chip side, comprising: a board end connector, a wire end connector and a printed circuit board; the board end connector is arranged on the printed circuit board; the board end connector comprises a board end connector shell and a board end connector body arranged in the board end connector shell; the wire end connector comprises a wire end case and a tongue plate fixed to the wire end case; wherein at least one guide piece extends from the board end connector shell, and the wire end case is provided with at least one guide slot for creating a butt joint with the guide piece.
The present disclosure also provides a printed circuit board layout structure, comprising: a connector, a chip and a heat sink arranged on the chip, the connector is arranged below the heat sink, the connector comprises: a board end connector, a wire end connector and a printed circuit board; the board end connector is arranged on the printed circuit board; the board end connector comprises a board end connector shell and a board end connector body arranged in the hoard end connector shell; the wire end connector comprises a wire end case and a tongue plate fixed to the wire end case; wherein at least one guide piece extends from the board end connector shell, and the wire end case is provided with at least one guide slot for creating a butt joint with the guide piece.
The beneficial effects of the present disclosure are: the space of the board end is utilized to the maximum extent, the problem that the CPU occupies the space of the board end due to the increased size of the heat dissipation module is solved, and high-speed data transmission can be realized.
The present disclosure will be described in detail below with reference to the following drawings and embodiments, but the present disclosure is not limited thereto.
The structural principle and the operational principle of the present disclosure will be described in detail below with reference to the attached drawings:
The board end connector 106 is mounted on the printed circuit board 109 and comprises a board end connector shell 101 and a board end connector body 102 embedded in the board end connector shell 101.
The wire end connector 107 comprises a wire end case 103, a tongue plate 104, a wire end body (not shown) and a lockable snap 105. The tongue plate 104 is covered by the wire end body, the wire end case 103 covers the wire end body and is fixed to the wire end body, and the lockable snap 105 is arranged at both sides of the wire end case 103.
When inserting the wire end connector 107 into the board end connector 106, the wire end connector 107 should be inserted into the board end connector 106 after aligning the two guide pieces 110 of the board end connector 106 with the guide slots 112 of the wire end connector 107. During the plugging process, the guide pieces 110, the guide projection 111 and the guide slots 112 are matched with each other, to provide a plugging alignment mechanism for the wire end connector 107 and the board end connector 106, and prevent improper plugging in the wrong direction.
When the wire end connector 107 is inserted into the board end connector 106, the guide piece 110 is inserted into the guide slot 112, such that the guide piece 110 is disposed between the wire end case 103 and the guide projection 111, the guide projection 111 located on both sides of the guide piece 110 abuts against the guide piece 110, so it is possible to prevent the wire end connector 107 from applying an improper force in a direction other than the abutting direction due to the wire bending, and to reduce the damage when the board end connector 106 is butt jointed with the wire end connector 107.
In addition, a welding foot 113 is disposed at one end of the guide piece 110, and the welding foot 113 is formed by the extension of the guide piece 110 and is integrally formed with the guide piece 110. The welding foot 113 can also be extended from the board end connector shell 101 and disposed front than the guide piece 110 along a rear-to-front direction away from the board end connector body 102. The welding foot 113 is inserted to the printed circuit board 109 and can serve to fix the guide piece 110 to enhance the fixing strength of the guide piece 110. The welding foot 113 can be directly fixed to the printed circuit board 109 or be fixed to the printed circuit board 109 via a soldering or welding material.
The lockable snap 105 is movable between a first position (see
The present disclosure may be embodied in other forms, various changes and modifications may be made by one skilled in the art without departing from the spirit or essence of the invention, and the corresponding changes and modifications will fall into the scope of the invention as defined by the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
201820826642.0 | May 2018 | CN | national |
This application is a continuation of U.S. patent application Ser. No. 16/397,406, filed Apr. 29, 2019, which is in condition for allowance and claims priority under 35 U.S.C. § 119(a) on Patent Application No. 201820826642.0 filed in P.R. China on May 30, 2018, the entire contents of which are hereby incorporated by reference. Some references, if any, which may include patents, patent applications and various publications, may be cited and discussed in the description of this invention. The citation and/or discussion of such references, if any, is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the invention described herein. All references listed, cited and/or discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.
Number | Date | Country | |
---|---|---|---|
Parent | 16397406 | Apr 2019 | US |
Child | 17036413 | US |