Patent Application
20240429650
The invention relates to electrical connector assemblies, particularly electrical connector assemblies configured to accommodate a variety of different modular cooling features.
High power electrical connector assemblies, such as those used with fast charging systems for electrical vehicles must be designed to carry 90 kilowatts of electrical power or more. Contact resistance between electrical terminal elements in the electrical connector assembly may cause power losses which are converted to thermal energy within the connector assembly. This thermal energy can cause a temperature rise within the electrical connector assembly that may damage the assembly if thermal limits are exceeded.
Previous approaches to electrical connector assemblies have focused on providing protection for electrical terminals within a connector housing while also managing heat generated within the cavity. Various designs have incorporated covers to enclose the cavity and shield the electrical terminal from external elements. These covers have typically been constructed from materials with insulating properties to prevent heat transfer and protect the terminal from environmental factors. However, such designs have often struggled to effectively dissipate heat generated by the electrical terminal during operation, leading to potential overheating issues and reduced performance.
Efforts to address thermal management within electrical connector assemblies have included the integration of passive cooling mechanisms such as heat sinks or fins on the cover to enhance heat dissipation. While these approaches have shown some improvement in managing heat within the cavity, they have not always been sufficient to adequately regulate temperature and prevent overheating of the electrical terminal. Additionally, passive cooling mechanisms may not provide dynamic control over the thermal conditions within the cavity, limiting their effectiveness in maintaining optimal operating temperatures for the electrical components.
Furthermore, some existing electrical connector assemblies have attempted to incorporate airflow systems for thermal management purposes. These systems have typically utilized fans or vents to facilitate air circulation within the cavity and dissipate heat generated by the electrical terminal. However, these designs have often been complex and prone to mechanical failures, resulting in unreliable thermal management and potential risks to the electrical components. Despite these efforts, existing approaches have struggled to achieve a comprehensive solution that effectively protects the electrical terminal while efficiently managing heat within the cavity. However, none of these approaches have provided a comprehensive solution that combines the features described in this disclosure.
The subject matter discussed in the background section should not be assumed to be prior art merely as a result of its mention in the background section. Similarly, a problem mentioned in the background section or associated with the subject matter of the background section should not be assumed to have been previously recognized in the prior art. The subject matter in the background section merely represents different approaches, which in and of themselves may also be inventions.
According to one or more aspects of the present disclosure, an electrical connector assembly includes a connector housing defining a cavity in which a pair of electrical terminals is disposed and a cover that is configured to enclose the cavity, thereby protecting the pair of electrical terminals and thermally manage heat within the cavity. The cover has a thermal management mechanism including one or more liquid ports configured to receive a liquid coolant flow.
In one or more embodiments of the electrical connector assembly according to the previous paragraph, the cover includes a coolant duct having a liquid inlet port and a liquid outlet port configured to carry the liquid coolant flow therethrough.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the coolant duct is characterized as following a serpentine path through the cover.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cover is formed of an electrically nonconductive material.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cover is formed of a thermally conductive polymer.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cover includes a top cover having a liquid inlet port and a liquid outlet port and a bottom cover that defines a coolant duct.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the top cover is formed of a polymeric material.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the bottom cover is formed of a metallic material.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the bottom cover includes a plurality of cooling fins that define a plurality of coolant channels within the coolant duct.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the electrical connector assembly further includes a dielectric thermal interface material layer in direct contact with the pair of electrical terminals. The dielectric thermal interface material layer is disposed between the bottom cover and the pair of electrical terminals.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the dielectric thermal interface material layer is in direct contact with the bottom cover.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the electrical connector assembly further includes an additional dielectric material layer intermediate the dielectric thermal interface material layer and the plurality of coolant channels.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the electrical connector assembly further includes a primary coolant seal between the top cover and the bottom cover.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the electrical connector assembly further includes a secondary seal between the cover and the cavity.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the liquid inlet port and the liquid outlet port are interconnected to a liquid cooling system of an electrically propelled vehicle.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cover is formed of a thermally conductive material.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cavity is filled with a thermally conductive potting material in thermal communication with the cover.
In one or more embodiments of the electrical connector assembly according to any one of the previous paragraphs, the cavity is filled with a phase changing material in thermal communication with the cover.
The present invention will now be described, by way of example with reference to the accompanying drawings, in which:
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the various described embodiments. However, it will be apparent to one of ordinary skill in the art that the various described embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.
As shown in
The housing 16 is designed to receive and accommodate several different cover configurations 100, 200, 300, 400, 500. Each of the cover configurations 100, 200, 300, 400, 500 uses a different thermal management mechanism to thermally manage heat within the cavity 18. The cover configurations 100, 200, 300, 400, 500 include active thermal management mechanisms such as one or more liquid ports that are configured to receive a liquid coolant flow within the cavity 18, one or more thermoelectric cooling plates, and/or one or more airflow ports that are configured to receive an airflow within the cavity 18 and/or passive thermal management mechanisms, such as one or more cooling fins 502 projecting from the cover 500.
In a first cover configuration 100 having an active thermal management mechanism shown in
According to a second cover configuration 200 an active thermal management mechanism shown in
In a third cover configuration 300 an active thermal management mechanism illustrated in
A fourth cover configuration 400 having an active thermal management mechanism is illustrated in
A fifth cover configuration 500 having passive thermal management mechanism is illustrated in
In an alternative embodiment, the cavity 18 may be filled with a dielectric phase changing material (PCM). A PCM is a substance with a high heat of fusion, e.g., paraffins or lipids. The PCM melts and solidifies at a near constant temperature and can store and releasing large amounts of thermal energy. Heat is absorbed within the cavity 18 as the PCM gradually changes from a solid state to a liquid state when power is flowing through the terminals 14, 20 and then heat is gradually released through the cover 500 as the PCM changes from the liquid state back to the solid state when power is no longer flowing through the terminals 14, 20.
The potting material 504 and the phase change material used must have a breakdown voltage that is higher than the charging voltage of the vehicle charging system to which the assembly 10 is connected.
Alternative embodiments of the assembly 10 may be envisioned combining various clements described above. For example, the thermal potting material 504 or PCM of the fifth cover configuration 500 may be incorporated into the first, second or third cover configurations 100, 200, 300. In alternative embodiments, the cooling fins 502 of the fifth cover configuration 500 could be integrated into the first, second, third, or fourth cover configuration 100, 200, 300, 400.
In a sixth cover configuration 600, an active thermal management mechanism illustrated in
As shown in
The cover 600 also includes a primary coolant seal 638 between the top cover 626 and the bottom cover 628 and a secondary seal 640 between the cover 600 and the cavity 18 to ensure that the liquid coolant does not enter the cavity 18. Entry of the liquid coolant into the cavity 18 could cause a short circuit between the DC terminals 14.
Experimental results of the cooling performance of the cover 600 are shown in
Alternative embodiments may be envisioned which include features of several of the embodiments described above. Table I below describes at least some of the possible combinations.
While the illustrated example of the electrical connecter assembly 10 is a vehicle charging port, other embodiments of this invention may be envisioned for many other types of electrical connector assemblies.
Accordingly, an electrical connector assembly 10 is provided. The assembly 10 provides the benefits of thermally managing the temperature of the assembly 10. The assembly 10 also provides a common housing 16 that accepts number of cover configurations 100, 200, 300, 400, 500, 600 with different thermal management mechanisms, allowing the assembly 10 to be customized based on the thermal load and cooling infrastructure, e.g., liquid coolant availability, airflow availability, for the particular application of the assembly 10.
While this invention has been described in terms of the preferred embodiments thereof, it is not intended to be so limited, but rather only to the extent set forth in the claims that follow. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to configure a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments and are by no means limiting and are merely prototypical embodiments.
Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the following claims, along with the full scope of equivalents to which such claims are entitled.
As used herein, ‘one or more’ includes a function being performed by one element, a function being performed by more than one element, e.g., in a distributed fashion, several functions being performed by one element, several functions being performed by several elements, or any combination of the above.
It will also be understood that, although the terms first, second, etc. are, in some instances, used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first contact could be termed a second contact, and, similarly, a second contact could be termed a first contact, without departing from the scope of the various described embodiments. The first contact and the second contact are both contacts, but they are not the same contact.
The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term “and/or” as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms “includes,” “including,” “comprises,” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
As used herein, the term “if” is, optionally, construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context. Similarly, the phrase “if it is determined” or “if [a stated condition or event] is detected” is, optionally, construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context.
Additionally, while terms of ordinance or orientation may be used herein these elements should not be limited by these terms. All terms of ordinance or orientation, unless stated otherwise, are used for purposes distinguishing one element from another, and do not denote any particular order, order of operations, direction or orientation unless stated otherwise.
This application is a continuation application and claims the benefit of co-pending application U.S. patent application Ser. No. 17/726,818 filed on Apr. 22, 2022, which was a continuation of U.S. patent application Ser. No. 16/792,929, now U.S. Pat. No. 11,387,598, filed on Feb. 18, 2020, which claimed the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 62/807,267 filed on Feb. 19, 2019,U.S. Provisional Patent Application No. 62/827,425 filed on Apr. 1, 2019, and U.S. Provisional Patent Application No. 62/897,571 filed on Sep. 9, 2019, the entire disclosure of each of which is hereby incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| 62807267 | Feb 2019 | US | |
| 62827425 | Apr 2019 | US | |
| 62897571 | Sep 2019 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17726818 | Apr 2022 | US |
| Child | 18816766 | US | |
| Parent | 16792929 | Feb 2020 | US |
| Child | 17726818 | US |
