1. FIELD OF THE INVENTION
The present invention relates to an electrical connector, and more particularly to an electrical connector is easy to fabricate.
2. DESCRIPTION OF RELATED ART
In the end of 2008, USB Implementers Forum (USB-IF) released USB 3.0 specification. The USB 3.0 electrical connector adds two pair of differential contacts and a grounding contact to the USB 2.0 for increasing the speed rate up to 5 GB/s and is backward compatible with USB 2.0. With the development of electronic industry, USB 3.0 can't meet the requirements of consumer. Thus, USB-IF announced USB Type-C connectors which is reversible so that it can be used in any orientation. Moreover, it gets faster and EMI of which is improved. However, USB C-type connector is complicated and challenges the manufacturing and the assembling ability.
Hence, it is desired to provide an electrical connector to overcome the problems mentioned above.
Accordingly, an object of the present invention is to provide an electrical connector which facilitates to manufacture and has improved transmitting speed.
The present invention is directed to an electrical connector mounting to a mother board and mating with a plug, comprises an internal circuit board including a plurality of first golden fingers at a front end thereof and a plurality of conductive traces corresponding to the first golden fingers and connected with the first golden fingers respectively, a shielding assembly having a first shell and a second shell together covering top and bottom surfaces of the internal circuit board, and a contact module electrically connected with the internal circuit board.
The present invention is directed to an electrical connector for mounting to a mother board and mating with a plug, comprises an internal circuit board including a plurality of first golden fingers at a front end thereof and a plurality of conductive traces connected with the first golden fingers, a shielding assembly including a first shell, a second shell and a third shell, the first and second shell surrounding the top and bottom surfaces of the internal circuit board, a contact module including a plurality of electrical contacts electrically connected with the first golden fingers and the conductive traces of the internal circuit board, and a base securing the electrical contacts, and an insulative housing surrounding the first shell, the second shell and the contact module. The third shell surrounds a rear portion of the insulative housing.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
Reference will be made to the drawing figures to describe the present invention in detail, wherein depicted elements are not necessarily shown to scale and wherein like of similar elements are designated by same or similar reference numeral through the several views and same or similar terminology.
Please referring to
Please refer to
The configuration of the electrical connector 100 conforms to USB Type-C, and the first golden fingers 11 and the conductive traces are arranged on both top and bottom surface of the internal circuit board 1. The second golden fingers 121 are arranged in the bottom surface of the internal circuit board 1 and the soldering holes 122 extend through the internal circuit board 1. A pair of notches 19 is provided on opposite sides of the internal circuit board 1.
The internal circuit board 1 has a top layer 13, a bottom layer 14, and a grounding layer 15 located between the top layer 13 and the bottom layer 14. The first golden fingers 11, the second golden fingers 121/soldering holes 122 and the conductive traces are disposed on the top and bottom layers 13, 14. The bottom layer 14 and the top layer 13 each include two grounding circuits 101 at outermost sides and a plurality of signal circuits located between the grounding circuits 101. The signal circuits includes two pair of high frequency signal circuits adjacent to the grounding circuits 101 respectively, two power circuits 102 at inner side of the high frequency signal circuits and four low frequency signal circuits located between the two power circuits 102. The electrical circuits on the top layer 13 and the bottom layer 14 are similar but disposed in opposite directions.
The grounding layer 15 has two grounding copper foils 151 at opposite sides thereof and a middle copper foil 152 located between the grounding copper foils 151. The grounding copper foils 15 are sandwiched by the high frequency signal circuits and the grounding circuits 101 of the top layer 13 and the bottom layer 14 thereby preventing crosstalk between the top layer 13 and the bottom layer 14. The grounding copper foils 151 extend into the notches 19 so as to contact with grounding tabs (not shown) of the complementary plug. Furthermore, the grounding circuits 101 of the top and bottom layers 13, 14 electrically connected with the grounding copper foils 151 via a plurality of plated-through holes (not labeled) to establish a grounding path and improve shielding.
The middle copper foil 152 is sandwiched by the power circuits 102 of the top layer 13 and the bottom layer 14. The middle copper foil 152 contacts with the power circuits 102 respectively via plated-through holes (not labeled) thereby form two parallel power paths between the top and bottom layers 13, 14 and decrease the resistance for transmitting biggish current. The present invention is provided with an internal circuit board which facilitates to manufacture and has improved transmitting speed.
Please further refer to
Please refer to
The first shell 21 has an upper plate 211 covering the top surface of the internal circuit board 1, two pair of grounding tails 212 extending downwardly from opposite sides of the upper plate 211 and a plurality of tabs 213 projecting upwardly from a rear edge of the upper plate 211. The upper plate 211 is provided a slant face 2111 at a front edge thereof for guiding the mating connector inserted therein. The upper plate 211 has a pair of gaps 2112 so that plastic is embedded therein when the first shell 21 injection molding with the insulative housing 4. The first shell 21 defines a pair of cutouts 2121 on the top of the grounding tails 212. Each of the grounding tails 212 has a pair of notches 2122 for receiving soldering materials therein when the electrical connector 100 is soldered to the mother board.
The second shell 22 has a lower plate 221 covering the bottom surface of the internal circuit board 1 and a pair of retention tabs 222 at opposite sides of the lower plate 221 and inserted into the pair of cutouts 2121 of the first shell 21. The first shell 21 and the second shell 22 of the present invention are independent, as alternative; they also could be integrated and surround the internal circuit board 1.
The insulative housing 4 is injection molding with the internal circuit board 1, the first shell 21 and the second shell 22 and the contact module 3. The insulative housing 4 has a base 41 surrounding rear ends of the first and second shells 21, 22 and the contact module 3, and a front portion 42 formed at two sides of the first and second shells 21, 22. The base 41 has a stop face at a front end thereof for abutting against the mating electrical connector. A pair of blocks 412 protrudes outwardly from two opposite sidewalls of the base 41.
The third shell 23 of the shielding assembly 2 is attached to the insulative housing 4 and has a connecting section 231, a pair of retention sections 232 bending downwardly from opposite sides of the connecting section 231, a covering section 233 bending downwardly from a rear edge of the connecting section 231 and a plurality of grounding tails 234 extending downwardly from the covering section 233 for soldering to the mother board. The retention section 232 is provided with a retention hole 2321 for engaging with the block 412 of the insulative housing 4.
After assembling, the first shell 21 and the second shell 22 project out of the insulative housing 4 and are exposed to an exterior. The tabs 213 are exposed to a top surface of the base 41 and contact the connecting section 231 thereby forms a grounding path between the first shell 21 and the third shell 23. The first shell 21 and the second shell 22 are located at top and bottom sides of the internal circuit board 1 and cover the conductive traces of the internal circuit board 1. The internal circuit board 1 projects forwardly beyond the first shell 21 and the second shell 22 with the first golden fingers 11 exposed to the exterior.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201510082932.X | Feb 2015 | CN | national |