Referring to
Referring to
The operating member 11 comprises a locating member 111 in the corner thereof for receiving the chip module 2 thereon and a plurality of receiving slots 110 for receiving the terminals 13.
The rectangular cover 12 comprises a frame 121 and a locking member 122 for locking the cover 12 on the housing 10.
Referring to
The contact engaging portion 131 received in the receiving hole 110 of the operating member 11 is conventionally planar and further comprises an opening 1310 for receiving the solder ball 20 disposed on a lower surface of the chip module 2.
The retaining portion 132 comprises a neck portion 134, a lead-portion 135, an elastic portion 136 received in the second passageway 1002 and a connecting portion 137 for connecting the leading portion 135 and the elastic portion 136. The leading portion 135 is inserted into the first passageways 1001. The elastic portion 136 is C-shaped and inserted into the second passageways 1002 providing an elastic deformation for altering the length of the contact engaging portion 131 inserted into the passageways 100. The connecting portion 137 defines a pair of second projections 1371 for controlling the deformation of the elastic portion, and the projections only move in the second passageways 1002, which can not move into the first passageways.
The tail 133 for connecting with the printed circuit board comprises a third projection 1331 disposed below the second passageways for limiting the movement of the tail 133.
Referring to
In assembly, the terminals 13 are firstly inserted into the housing 10, at this moment, the contact engaging portion 131 defining the opening 1310 is received in the receiving holes, the first projection 1341 of the first neck portion 134 is disposed between the operating member 11 and the housing 10, the leading portion is received in the first passageways 1001, the second projection 1371 of the elastic portion 136 and the second connecting portion 137 is disposed in the second passageways 1002, the third projection 1331 is disposed below the housing 10. Then, the operating member 11 and the chip module 2 are mounted on the housing 10. The solder balls 20 of the chip module 2 are inserted into the receiving holes 110. Sequentially, the cover 12 is pivotally mounted on the housing 10 and locked on the housing 10 by the locking member 122. When the cover 12 presses the chip module 2 downwardly, the contact engaging portion 122 of terminals 13 is inserted through the passageways 100 and beyond the operating member 11. However, the first projection 1341 disposed on a lower end of the operating member 11 can limit the protruding length of the contact engaging portion 131. The chip module 2 and the terminals 13 can attain a well electrical connection.
It will be understood that the invention may be embodied in other specific forms without departing from the spirit or central characteristics thereof. The present examples and embodiments, therefore, are to be considered in all respects as illustrative and not restrictive, and the invention is not be limited to the details given herein.
Number | Date | Country | Kind |
---|---|---|---|
95206935 | Apr 2006 | TW | national |