1. Field of the Invention
The present invention relates to an electrical connector, and particularly to an electrical connector electrically connecting an electronic package such as an IC package to a circuit board.
2. Description of Related Art
An electrical connector comprises a housing having a plurality of contacts, a stiffener surrounding the housing and formed with an engaging portion, a cover rotatably mounted on the housing and having a tongue portion, and an L-shaped lever mounted along outer sides of the housing and engaging with the tongue portion of the cover. When an IC package is positioned on the housing, the cover is rotated from an open position to a closed position and fasten the IC package at the closed position via an engagement between the lever and the engaging portion.
The cover could fasten the IC package at the closed position, when the lever is rotated to the closed position and engages with the engaging portion of the stiffener. It is complicated to assemble the lever onto the housing and rotate the lever between the open position and the closed position. Simultaneously, the lever is assembled along the outer sides of the housing and would take up a certain extra space. It is therefore hard to realize the miniaturization of the electrical connector.
Hence, an improved electrical connector is required to overcome the above-mentioned disadvantages of the related art.
An object of the present invention is to provide an minimized electrical connector which is easy to assemble.
To achieve the aforementioned objects, an electrical connector adapted for electrically connecting an IC package includes a housing, a cover and a locking mechanism. The housing has a bottom wall, a number of rising walls rising from the bottom wall and a receiving space defined therebetween. The cover is attached to a top portion of the housing and has a pair of downwardly extending side walls. The locking mechanism includes a locking groove defined on one of the rising walls of the housing, and a locking post formed on corresponding side wall of the cover and slidable in the locking groove between a locked position and a released position.
The cover could be locked on the housing to fasten the IC package or be released from the housing to remove the IC package, via the engagement or disengagement of the locking mechanism. The locking post is formed on the primary wall of the housing and the locking groove is defined on the side wall of the cover. The assembly of the electrical connector has been simplified since it doesn't need to the assemble the locking mechanism onto the housing. Additionally, it is easy to realize the miniaturization of the electrical connector, since the locking mechanism would not occupy extra space.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of a preferred embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawing figures to describe the present invention in detail. Referring to
Referring to
The primary wall 22 has a substantially heart-shaped locking groove 220 defined at an outer surface thereof. The locking groove 220 comprises an L-shaped guiding groove 222, an L-shaped releasing groove 223 communicating with the guiding groove 222, and a fixing groove 221 defined between the guiding groove 222 and the releasing groove 223. The fixing groove 221 is connected with a lower end of the guiding groove 222 and a lower end of the releasing groove 223. The lower end of the releasing groove 223 is deeper than the lower end of the guiding groove 222.
Referring to
In conjunction with
When the IC package needs to be removed from the housing 2, the cover 3 is depressed downwardly and the locking post 35 slides into the releasing groove 223 from the fixing groove 221. The locking post 35 escapes from the releasing groove 223 and restores itself to a released position. The cover 3 is released from the housing 2 and the IC package could be removed from the receiving space 27.
It is easy to lock the IC package on the housing 2 and release the IC package from the housing 2, if only depressing the cover 3 to drive the locking mechanism. The locking mechanism is formed on the primary wall 22 of the housing 2 and the side wall 35 of the cover 3 and doesn't occupy extra space.
However, the disclosure is illustrative only, changes may be made in detail, especially in matter of shape, size, and arrangement of parts within the principles of the invention.
Number | Date | Country | Kind |
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200720039009.9 | Jun 2007 | CN | national |