As shown in
The high-speed backplane connector systems described below address these desires by providing electrical connector systems that are capable of operating at speeds of up to at least 20 Gbps.
In one aspect, an electrical connector system is disclosed. The system may include a plurality of wafer assemblies defining a mating end and a mounting end. Each of the wafer assemblies may include a first overmolded array of electrical contacts, a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, and a conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second array of electrical contacts.
The first overmolded array of electrical contacts define a plurality of apertures and each electrical contact of the first overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at the mating end of the wafer assembly. Similarly, the second overmolded array of electrical contacts define a plurality of apertures and each electrical contact of the second overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly.
The conductive ground bracket may define a first array of ridges on a first side of the conductive ground bracket, where each ridge of the first array of ridges is positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts. The conductive ground bracket may define a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket, where each ridge of the second array of ridges is positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts.
In another aspect, a wafer assembly is disclosed. The wafer assembly may include a first overmolded array of electrical contacts, a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, and a conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second array of electrical contacts.
The first overmolded array of electrical contacts define a plurality of apertures and each electrical contact of the first overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at a mating end of the wafer assembly. Similarly, the second overmolded array of electrical contacts define a plurality of apertures and each electrical contact of the second overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly.
The conductive ground bracket may define a first array of ridges on a first side of the conductive ground bracket, where each ridge of the first array of ridges is positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts. The conductive ground bracket may define a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket, where each ridge of the second array of ridges is positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts.
In yet another aspect, another wafer assembly is disclosed. The wafer assembly may include a first overmolded array of electrical contacts, a first ground shield, a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, a second ground shield, and a conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second array of electrical contacts.
The first overmolded array of electrical contacts may define a plurality of apertures and each electrical contact of the first overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at a mating end of the wafer assembly. The first ground shield is configured to be assembled with the first overmolded array of electrical contacts and may also define a plurality apertures.
The second overmolded array of electrical contacts may define a plurality of apertures and each electrical contact of the second overmolded array of electrical contacts may define an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly. The second ground shield is configured to be assembled with the second overmolded array of electrical contacts and may also define a plurality of apertures.
The conductive ground bracket may define a first array of ridges on a first side of the conductive bracket. Each ridge of the first array of ridges is positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the first ground shield.
The conductive ground bracket may define a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket. Each ridge of the second array of ridges is positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the second ground shield.
The conductive ground bracket, first ground shield, and second ground shield may provide the wafer assembly with a common ground.
The present disclosure is directed to high-speed backplane connector systems that are capable of operating at speeds of up to at least 20 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch. As will be explained in more detail below, implementations of the disclosed high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes, and minimize cross-talk, when the high-speed backplane connector systems operates at frequencies up to at least 20 Gbps. Further, as explained in more detail below, implementations of the disclosed high-speed connector systems may provide substantially identical geometry between each connector of an electrical connector pair to prevent longitudinal moding.
A high-speed backplane connector system 100 is described with respect to
Each wafer assembly 106 of the plurality of wafer assemblies 102 may include a first overmolded array of electrical contacts 108 (also known as a first lead frame assembly), a second overmolded array of electrical contacts 110 (also known as a second lead frame assembly), a first ground shield 112, a second ground shield 114, and a ground bracket 115. The first overmolded array of electrical contacts 108 includes a plurality of electrical contacts 116 surrounded by an insulating overmold 118, such as an overmolded plastic dielectric. The electrical contacts 116 may comprise, for example, any copper (Cu) alloy material.
The electrical contacts 116 define electrical mating connectors 120 that extend away from the insulating overmold 118 at a mating end 122 of the wafer assembly 106 and the electrical contacts define substrate engagement elements 124, such as electrical contact mounting pins, that extend away from the insulating overmold 118 at a mounting end 126 of the wafer assembly 106. In some implementations, the electrical mating connectors 120 are closed-band shaped as shown in
It will be appreciated that the tri-beam shaped, dual-beam shaped, or closed-band shaped electrical mating connectors 120 provide improved reliability in a dusty environment and provide improved performance in a non-stable environment, such as an environment with vibration or physical shock.
Referring to
The first overmolded array of electrical contacts 108 and the second overmolded array of electrical contacts 110 are configured to be assembled together as shown in
In some implementations, each electrical mating connector 120 of the first overmolded array of electrical contacts 108 mirrors an adjacent electrical mating connector 132 of the second overmolded array of electrical contacts 110. It will be appreciated that mirroring the electrical contacts of the electrical contact pair provides advantages in manufacturing as well as column-to-column consistency for high-speed electrical performance, while still providing a unique structure in pairs of two columns.
As shown in
Referring to
Similarly, the second overmolded array of electrical contacts 110 defines a plurality of apertures 142 configured to receive the second plurality of ridges 138 defined by the second side of the ground bracket 115. In one implementation, for each neighboring pair of electrical contacts 128 of the second overmolded array of electrical contacts 110, a ridge of the second plurality of ridges 138 of the ground bracket 115 passes through the second overmolded array of electrical contacts 110 and is positioned between the neighboring pair of electrical contacts.
The first ground shield 112 is configured to be assembled with the first overmolded array of electrical contacts 108 such that the first ground shield 112 is positioned at a side of the first overmolded array of electrical contacts 108 as shown in
When the first overmolded array of electrical contacts 108, second overmolded array of electrical contacts 110, first ground shield 112, second ground shield 114, and ground bracket 115 are assembled, the ends of the first plurality of ridges 136 are positioned in the wafer assembly 106 adjacent to the first ground shield 112 and the ends of the second plurality of ridges 138 are positioned in the wafer assembly 106 adjacent to the second ground shield 114. The positioning of the first ground shield 112, the second ground shield 114, and the ground bracket 115 assist in providing a common ground to the wafer assembly 106.
Additionally, it will be appreciated that the positioning of the first ground shield 112, the second ground shield 114, and the ground bracket 115 serve to electrically isolate each electrical contact pair 134 from neighboring electrical contacts pairs. For example, referring to
In some implementations, the ends of the first plurality of ridges 136 may abut and/or connect to the first ground shield 112 and the ends of the second plurality of ridges 138 may abut and/or connect to the second ground shield 114. Referring to
Referring to
Similar to the first ground shield 112, the second ground shield 114 may define a plurality of ground tab portions 148 at the mating end 122 of the wafer assembly and the second ground shield 114 may define a plurality of substrate engagement elements 150, such as ground mounting pins, at the mounting end 126 of the wafer assembly 106. In some implementations, when the second ground shield 114 is assembled to the second overmolded array of electrical contacts 110, a ground tab portion of the plurality of ground tab portions 148 of the second ground shield 114 is positioned above and/or below an electrical mating connectors 132 of the second overmolded array of electrical contacts 110.
When the wafer assembly 106 is assembled, each ground tab portion of the plurality of ground tab portions 144 of the first ground shield 112 may be positioned adjacent to a ground tab portion of the plurality of ground tab portions 148 of the second ground shield 114 to form a plurality of ground tabs 151. The positioning of the plurality of ground tab portions 144 of the first ground shield 112 adjacent to the plurality of ground tab portions 148 of the second ground shield 114 may assist in providing a common ground to the wafer assembly 106.
In some implementations, a ground tab portion 144 of the first ground shield 112 engages and/or abuts an adjacent ground tab portion 148 of the second ground shield 114. However, in other implementations, a ground tab portion 144 of the first ground shield 112 does not engage or abut an adjacent ground tab portion 148 of the second ground shield 114.
Referring to
When the wafer assembly 106 is assembled, an engagement element 152 of the first ground shield 112 may be positioned adjacent to an engagement element 154 of the second ground shield 114. The positioning of the engagement element 152 of the first ground shield 112 adjacent to the engagement element 154 of the second ground shield 114 may assist in providing the wafer assembly 106 with a common ground.
In some implementations, an engagement element 152 of the first ground shield 112 may abut and/or engage an adjacent engagement element 154 of the second ground shield. However, in other implementations, an engagement element 152 of the first ground shield 112 does not abut or engage an adjacent engagement element 154 of the second ground shield 114.
As shown in
The wafer housing 104 may be configured to mate with a header module, such as the header module described in U.S. patent application Ser. No. 12/474,568, filed May 29, 2009, the entirety of which is hereby incorporated by reference.
As shown in
While various high-speed backplane connector systems have been described with reference to particular embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
The present application is related to U.S. patent application Ser. No. ______ (Attorney Docket No. 12494/96 (CS-01322)), titled “Electrical Connector System,” filed Nov. 19, 2010, the entirety of which is hereby incorporated by reference.