1. Field of the Invention
The present invention relates generally to electrical connector, and more particularly to a connector having improved electrical contacts.
2. Description of Related Art
Electrical connectors are typically used to couple PCB (Printed Circuit Board) which have numerous electrical devices. Some electrical connectors have a mating end wherein conductive terminals are exposed for engagement with the terminals of a mating connector. When mating the connectors, opposite charges at the connector interface may result in an ESD between the two connectors. In fact, electrostatic discharges can be generated simply by a person approaching or touching the connector interface or touching the terminal contacts. As known, when the ambient relative humidity drops to fifty percent or below, the human body accumulates a large electrical charge which can be in excess of 20,000 volts. Generally, very little current is associated with an electrostatic discharge; however, the voltage can be high enough to damage or destroy certain types of electrical devices such as semiconductor devices. Consequently, when the connector contacts or terminals are electrically associated with such devices on a circuit board, the electrostatic discharge may damage or destroy the electrical devices on the circuit board.
In order to alleviate the electrostatic discharge problem, some electrical connectors include features to provide ESD protection. In at least some connectors, ESD protection is provided with a shield in the form of a plate, bar, or the like located in close proximity to the connector interface and connected to ground in close proximity to the connector. But in some cases, the electrostatic discharge also occurs at the signal contacts. Please refer to
Hence, it is desired to provide an electrical connector to overcome the problems mentioned above.
Accordingly, an object of the present invention is to provide an electrical connector having improved electrical contacts for ESD protection.
The present invention is directed to an electrical connector for receiving a plug, comprising an insulative housing, a set of first contacts and a set of second contacts attached to the insulative housing. The insulative housing comprises a base portion and a wafer, and a latch mechanism fastened the wafer to the base portion. The insulative housing defines a mating direction for engaging with the plug. Each electrical contact is attached to the insulative housing and comprises a contact section connecting with the plug and a mounting section extending out of the insulative housing. The contact sections of the first contacts are staggered with the contact sections of the second contacts along the mating direction, and wherein the contacts section of the first contacts are closed to a front edge thereof.
The first contacts can be inserted in the wafer by insert molding. The first contacts also can be pressed into the wafer. The first contacts and the wafer constitute an insert module attached to the base portion simultaneously. The second contacts are inserted into the base portion and the wafer simultaneously. The wafer encloses the first contacts at a front edge thereof to avoid the first contacts connecting with the plug.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
FIG 18 is a perspective view of the electrical connector of
Reference will be made to the drawing figures to describe the present invention in detail, wherein depicted elements are not necessarily shown to scale and wherein like of similar elements are designated by same or similar reference numeral through the several views and same or similar terminology.
Referring to
While the drawings display a dual stacked connector system 100, the present invention could be used with any type of electrical connector. While each receptacle is shown with nine contacts 20 in a group, the invention can be employed with any desired number of contacts 20 in a group. Similarly, while two receptacles 11, 12 are shown, the invention can be employed with a single receptacle or any desired number of stacked receptacles.
Referring to
As illustrated in
Each wafer 14, 15 comprises a tongue 140 and a retention portion 141 extending into the receiving space 131 of base portion 13. The tongue 140 and the base portion 13 defines the receiving opening 11, 12. The wafer 14, 15 comprises a top wall 142 and a front wall 143 perpendicular thereto. The tongue 140 defines a plurality of grooves 145 corresponding to the passageways 134 and a plurality of recesses 147 corresponding to the receiving space 131. An inner bar 146 locates between the grooves 145 and the recesses 147. The latch mechanism comprises a protrusion 133 disposed in the receiving space 131 of the base portion 13 and a recess 144 defining on the retention portion 141 of the wafer 14, 15 to engage with each other, thereby latching the base portion 13 and the wafers 14, 15 together.
As illustrated in
The upper contacts 21 are inserted in the wafer 14, 15 by insert molding and each includes a body section 211 engaging with the wafer 14, 15 at an upper side thereof, a connect section 212 bending from one end of the body section 211, and a mounting section 213 extending from the other end of the body section 211. The connect section 212 is extending from a front edge of the body section 211 to a lower side of the wafer 14, 15. A flat non-elastic contact section 214 is extending forwardly from the connect section 212 and parallel to the body section 211. The body section 211 is on top of the contact section 214.
Referring to
During manufacturing, firstly, form the wafer 14, 15 on the upper contacts 21 by insert molding and constitute a insert module, wherein the upper contacts 21 are straight at that time. Secondly, press the insert module including the upper contacts 21 and the wafer 14, 15 into the base portion 13 from a front side thereof simultaneously. Thirdly, insert the lower contacts 22 to the passageways 134 of base portion 13 and further disposed on the wafer 14 from a rear side of the base portion 13 at one time. Finally, bend the upper contacts 21 with the mounting sections 213 thereof extending out of the base portion 13. A spacer 50 is attached to the base portion 13 for positioning the upper and lower contact 21, 22 at a mounting end.
After assembly, the contact sections 214 of the upper contacts 21 are disposed in the recesses 147 and expose to a bottom face of the wafer 14, 15. The front wall 143 encloses the upper contacts 21 from an exterior at the front edge of the wafer 14, 15. The contact sections 222 of the lower contacts 22 are arranged in the grooves 145 and project out of the bottom face of the wafer 14, 15. The inner bar 146 separates the contacts sections 214 of the upper contacts 21 from the contact sections 222 of the lower contacts 22 along the mating direction.
Next referring to
The lower contacts 22′ are inserted into the base portion 13′ and the wafer 14′, 15′ and each includes a body section 221′ engaging with the insulative housing 10′. An elastic contact section 222′ extends from one end of the body section 221′ along a mating direction of the electrical connector 100′ and has a convex bend 223′. The lower contacts 22′ also include a mounting section 224′ extending from the other end of the body section 221′ for mounting to the PCB. The upper contacts 21′ are attached to the wafer 14′, 15′ by insert molding and each includes a body section 211′ engaging with the wafer 14′, 15′ at an upper side thereof, a connect section 212′ bending from one end of the body section 211′, and a mounting section 213′ extending from the other end of the body section 211′. The body section 211′ is on top of the contact section 214′. The contact portions 214′, 222′ of the upper contacts 21′ and the lower contacts 22′ are located on the lower side of the wafer 14′, 15′ and staggered along the mating direction of the electrical connector 100′. The contact portions 214′ of the upper contacts 21′ are arranged in a front position of the insulative housing and closer to a front edge of the wafer 14′, 15′ than the contact sections 222′ of the lower contacts 22′. The contact points, namely the contact sections 214′ and the convex bends 223′ also staggered along a vertical direction thereby to mating with the plug at different height.
The electrical connector 100′ is similar to the electrical connector 100 except the wafer 14′, 15′ and the base portion 13′. The base portion 13′ comprises a rectangular body 130′ provided with two receiving spaces 131′ therein and a plurality of passageways 134′ below the receiving spaces 131′. Each wafer 14′, 15′ comprises a tongue 140′ and a retention portion 141′ extending into the receiving space 131′ of base portion 13′. The wafer 14′, 15′ comprises a top wall 142′ and a front wall 143′ perpendicular thereto.
The tongue 140′ defines a plurality of grooves 145′ corresponding to the passageways 134′ and a plurality of recesses 147′ corresponding to the receiving space 131′. An inner bar 146′ separates the contact sections 214′ of the upper contacts 21′ from the contact sections 222′ of the lower contacts 22′ along the mating direction. The latch mechanism comprises a spring arm 144′ arranged on the retention portion 141′, and a retention section 133′ arranged on the base portion 13′ engaging with each other.
As illustrated in
The electrical contact 20″ also includes a set of upper contacts 21″ and a set of lower contacts 22″. Each upper contact 21″ comprises a contact section 214″ exposed to a receiving space for receiving the plug 200 and a mounting section 213″ extending out of the base portion 13″. Each lower electrical contact 22″ comprises an elastic contact section 223∝ extending into the receiving space and a mounting section 224″ extending out of the base portion 13″.
The base portion 13″ comprises a rectangular body 130″ provided with two receiving spaces 131″ and a support plate 135″ projecting from the body and provided with a plurality of passageways 134″. The support plate 135″ is located at a lower side of the wafer 14″, 15″ and the contacts sections 222″ of the lower contacts 22″ are received therein.
Each wafer 14″, 15″ comprises a tongue 140″ and a retention portion 141″ extending into the receiving space 131″ of base portion 13″. The wafer 14″, 15″ comprises a top wall 142″ and a front wall 143″ perpendicular thereto. The tongue 140′ defines a plurality of grooves 148″ corresponding to the receiving space 131″ and a plurality of recesses 147″ corresponding to the grooves 148″. An inner bar 146″ separates the contact sections 214″ of the upper contacts 21″ from the contact sections 222″ of the lower contacts 22″ along the mating direction. The latch mechanism comprises a spring arm 144″ arranged on the retention portion 141″, and a retention section 133″ arranged on a rear side of the base portion 13″ engaging with each other.
Each upper contact 21″ is pressed into the grooves 148″ and includes a retention section 215″ for engaging therewith. The contact sections 214″ of the upper contacts 21″ are disposed in the recesses 147″ and exposed to a bottom face of the wafer 14″, 15″. The front wall 143″ encloses the upper contacts 21″ from an exterior at a front edge of the wafer 14″, 15″.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Name | Date | Kind |
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5947773 | Karam | Sep 1999 | A |
6019631 | Chen | Feb 2000 | A |
6106338 | Wu et al. | Aug 2000 | A |
6315609 | Chung | Nov 2001 | B1 |
Number | Date | Country | |
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20090130913 A1 | May 2009 | US |