Information
-
Patent Grant
-
6827611
-
Patent Number
6,827,611
-
Date Filed
Wednesday, June 18, 200321 years ago
-
Date Issued
Tuesday, December 7, 200419 years ago
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Inventors
-
Original Assignees
-
Examiners
Agents
- Teradyne Legal Department
-
CPC
-
US Classifications
Field of Search
-
International Classifications
-
Abstract
A shielded electrical connector in which multi-beam contacts are used to improve performance of the connector. The beams are positioned to create multiple current paths through a shield member, thereby increasing the effectiveness of the shield. These contacts are used in a connector that has individual shield strips running in parallel with signal conductors. Multiple contact tails are also used to create multiple current paths. Projections from the shield strips shield adjacent signal contacts and the contact portions are positioned to increase current flow through the projections. Structures to allow beam-type contacts to be formed in a small space are also disclosed. The contact structure also reduces the impedance of the ground path.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
Not Applicable.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
Not Applicable.
REFERENCE TO MICROFICHE APPENDIX
Not Applicable
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates generally to electrical connectors and more specifically to high-speed, high-density electrical connectors.
2. Description of Related Art
Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system on several printed circuit boards that are then joined together with electrical connectors. A traditional arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane. Other printed circuit boards, called daughter boards, are connected through the backplane.
A traditional backplane is a printed circuit board with many connectors. Conducting traces in the printed circuit board connect to signal pins in the connectors so that signals may be routed between the connectors. Other printed circuit boards, called “daughter boards” also contain connectors that are plugged into the connectors on the backplane. In this way, signals are routed among the daughter boards through the backplane. The daughter cards often plug into the backplane at a right angle. The connectors used for these applications contain a right angle bend and are often called “right angle connectors.”
Connectors are also used in other configurations for interconnecting printed circuit boards and even for connecting cables to printed circuit boards. Sometimes, one or more small printed circuit boards are connected to another larger printed circuit board. The larger printed circuit board is called a “mother board” and the printed circuit boards plugged into it are called daughter boards. Also, boards of the same size are sometimes aligned in parallel. Connectors used in these applications are sometimes called “stacking connectors” or “mezzanine connectors.”
Regardless of the exact application, electrical connector designs have generally needed to mirror trends in the electronics industry. Electronic systems generally have gotten smaller and faster. They also handle much more data than systems built just a few years ago. To meet the changing needs of these electronic systems, some electrical connectors include shield members. Depending on their configuration, the shields might control impedance or reduce cross talk so that the signal contacts can be placed closer together or carry higher speed signals with the required signal integrity.
U.S. Pat. No. 5,993,259 entitled High Speed, High Density Electrical Connector, to Stokoe et al. is an example of a shielded connector. The assignee of that patent, is Teradyne, Inc. sells a product known as VHDMe. Another example of a high speed, high density connector is described in U.S. Pat. No. 6,506,076 entitled Connector with Egg-Crate Shielding, to Cohen, et al. The assignee of that patent sells a product known as GbX®. A further example is U.S. Pat. No. 6,394,822 to McNamara entitled “Electrical Connector.” The assignee of that patent sells a product known as NexLev®.
It would be highly desirable to increase the speed or density of such a connector.
BRIEF SUMMARY OF THE INVENTION
With the foregoing background in mind, it is an object of the invention to provide an improved high speed, high density connector.
To achieve the foregoing object, as well as other objectives and advantages, separable contacts are made to increase the current flow through portions of the shield members. The preferred embodiment uses multiple beams. In one embodiment, the beams are formed to provide current flow in opposite directions in opposing beams.
In the preferred embodiment, the contacts are formed in a shield member that has a projection. The beams are attached to the shield member at different locations to provide multiple current paths through the shield member, thereby increasing current flow through the projection.
BRIEF DESCRIPTION OF THE DRAWINGS
Additional objects, advantages, and novel features of the invention will become apparent from a consideration of the ensuing description and drawings, in which
FIG. 1
is a sketch of a two-piece electrical connector;
FIG. 2A
is a sketch showing a signal lead frame used in the connector of
FIG. 1
;
FIG. 2B
is a sketch showing a signal lead subassembly used in the connector of
FIG. 1
;
FIG. 3A
is a sketch showing a shield lead frame used in the connector of
FIG. 1
;
FIG. 3B
is a sketch showing two shield lead frames used in the connector of
FIG. 1
;
FIG. 4
is a sketch showing a wafer subassembly used in the connector of
FIG. 1
;
FIG. 5A
is a sketch showing a backplane housing module used in the connector of
FIG. 1
;
FIG. 5B
is a sketch showing signal contacts used in the backplane housing module of
FIG. 5A
;
FIG. 5C
is a sketch showing a ground contact used in the backplane housing module of
FIG. 5A
;
FIG. 6A
is a sketch showing mated signal and ground contacts;
FIG. 6B
is a sketch illustrating the flow of current in a ground contact when mated; and
FIG. 7
is an alternative shield member that might be used in the wafer subassembly of FIG.
4
.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
FIG. 1
shows a connector
100
. In the embodiment of
FIG. 1
, connector
100
is a two-piece connector. The illustrated configuration is a board to board connector, with connector
100
pictured as a right angle connector. Here connector
100
includes a daughter card connector
110
and a backplane connector
150
.
Daughter card connector
110
includes a housing
126
, which in the preferred embodiment is made of an insulative material. Many suitable insulative materials are known in the art. In the illustrative embodiment, the insulative housing is formed by stacking a plurality of sub-elements side-by-side. Here, the sub-elements are wafers
118
and spacers
120
, which are held together by clip
124
.
Clip
124
is in the preferred embodiment a metal member having features formed therein that engage complementary features on housing
126
. The features are shown to be slots and hubs.
A plurality of conductive members are hold within the insulative housing. These conductive members make up contacts that carry signals, power or ground through the connector. In the illustrated embodiment, the conductive members are part of each wafer
118
. Contact tails
114
, which are a portion of the conductive members, extend from surface
112
.
In use, surface
1112
is adapted to be mated against a printed circuit board (not shown). Contact tails
114
connect to electrical traces inside the printed circuit board, allowing electrical signals to be transmitted to or from the printed circuit board through connector
100
. As pictured, contact tails
114
are surface mount contacts. Each contact tail is shaped with a flat region, such as a foot or pad. The connector can be mounted to a printed circuit board by placing solder paste on conductive pads on the surface of the printed circuit board. A silk-screening process, such as might be used to mount semiconductor devices to a printed circuit board, can be used to position the solder paste on the board, leaving what is sometimes referred to as a “brick” of solder paste.
The contact tails are positioned with each foot in a brick of solder paste. Then, the entire board assembly is heated to a temperature sufficient to melt the solder paste. This process is sometimes called “reflow.” When cooled, the solder paste forms a solder joint between the contact tail of the connector and the pad in the surface of the printed circuit board, thereby making an electrical connection between the contact and traces in the printed circuit board. The solder also forms a mechanical attachment.
In the illustrated embodiment, a connector mounting mechanism is used to hold the connector in place until the solder paste is reflowed. The connector mounting mechanism uses screws
116
passing through a printed circuit board that engage connector
110
, thereby holding connector
10
to the board with the force required to press the contact tails into the solder bricks during manufacture. However, the force generated should not be so strong that the contact tails displace the solder paste. If too much solder paste is displaced, there will be insufficient solder to make a reliable solder connection. Posts
122
fit into holes in the printed circuit board, thereby positioning the connector on the board and ensuring that the contact tails
114
align with solder bricks (not shown) on the surface of the printed circuit board.
In the illustrated embodiment, each contact tails also includes a curved or serpentine portion. The curve makes the contact tail “springy” or compliant. The compliance of the contact tail reduces the stress on the solder joint between the contact tail and the printed circuit board. In use, such stress might be generated by mating and unmating of connector pieces. Alternatively, it might be generated by thermal expansion or contraction. If the connector and printed circuit board expand or contract at different rates as the temperature changes, the joints between the two will be stressed.
Backplane connector
150
is adapted to mate to daughter card connector
110
. In the illustrated embodiment, backplane connector
150
is made of a plurality of subassemblies. Two backplane modules
152
are shown. The backplane modules are described in greater detail in connection with
FIG. 5C
, below.
Each back plane module
152
preferably contains an insulative housing that carries a plurality of conductive members. Each conductive member has a portion that mates to a corresponding conductive member in the daughter cared connector
110
. Each conductive member also has a contact tail that is electrically connected to a substrate, such as a printed circuit board. In this way, signals are carried through the connector from one substrate to another, such as between a backplane and a daughter card.
In the illustrated embodiment, backplane connector
150
also contains spacers
154
that align with spacers
126
in the daughter card connector
10
. Backplane spacers
154
contain posts
156
that align with holes in spacers
126
, thereby guiding the connector pieces into proper alignment as the two connector pieces are mated.
Spacers
154
also receive screws
158
. Screws
158
hold the backplane connector to the backplane As with screws
116
, screws
158
can be used to hold the connector to the board before reflow of the solder or could be added afterwards to reduce force on the solder joints during mating and unmating of the connector.
The individual subassemblies are held together. Here, clips
160
are used to hold the subassemblies together. Clips
160
have slots that engage projections, such as projections
162
, formed in the housing of the subassemblies.
Each of the backplane modules
152
contains ribs
164
in its side walls. Ribs
164
create channels in the sidewalls. These channels can receive tabs or other projecting members on daughter card connector
110
to provide fine alignment of the wafers
118
with the backplane modules.
Turning now to
FIG. 2A
, further details of the daughter card wafers are shown. In the preferred embodiment, each wafer is made up of two pieces. One piece holds a set of conductive members that are intended, in use, to carry high speed signals. For example, signals that have a switching speed of 1 to 3 GHz. A second piece of the wafer holds signal conductors that carry ground signals. For high speed signals, any conductor carrying essentially a DC signal can be considered a ground.
FIG. 2A
shows a lead frame
210
used to make the signal piece of the wafer. In the illustrated embodiment, each wafer
118
contains 14 signal conductors
260
. Each signal conductor
260
has a contact tail
212
. In
FIG. 2A
, each of the contact tails is shown bent into a pad that can soldered to the surface of a substrate, such as a printed circuit board.
Further, each signal contact has a mating contact portion
216
. In the illustrated embodiment, each mating contact portion is shaped into two parallel beams. The two beams provide redundant points of contact.
Each signal contact also has an intermediate portion
214
. In the illustrated embodiment, the connector is a right angle connector. Therefore, the intermediate portions
214
bend through an approximately 90° angle.
In a preferred embodiment, the leadframe likely contains one or more carrier strips, holding the individual signal conductors together. Carrier strips are known in the art and are therefore not shown for clarity. During the manufacture of the connector, the carrier strips are severed from the signal contacts at a convenient time.
FIG. 2B
shows the lead frame
210
formed into a signal subassembly. Preferably, subassembly
250
is formed by insert molding an insulative housing
252
around the lead frame. Insulative housing
252
holds the individual signal contacts together and also provides features that allow subassembly
250
to be attached to other pieces of the connector. Both insert molding and attachment features are known in the art. The molding operation leaves the contact tails
212
and the mating portions
216
exposed with sufficient clearance to allow them to move. Mating portions move freely to generate the required spring force to make a good electrical connection to conducting member in a mating connector. Contact tails move freely so that they can provide required compliance to prevent excessive force from being placed on the solder joints holding the tails to a substrate.
Electrical connector
100
is illustrated as a shielded connector. To incorporate shielding into wafers
118
, a shield subassembly (
410
,
FIG. 4
) is formed. In the illustrated embodiment, the shielding consists of multiple ground conductors
370
.
FIG. 3A
shows a lead frame
310
A formed of multiple ground conductors
370
connected to a carrier strip
340
. As with the signal conductors, each ground conductor
370
includes a conducting member to carry an electrical signal between a contact tail
312
and a mating portion
316
. Mating portions
316
make electrical connection to a conductor in backplane connector
150
. Preferred shapes of the mating contact portion
316
will be explained in greater detail below.
Each ground conductor
370
also has an intermediate portion
314
connecting the mating contact portion
316
with the contact tail
312
. Here, each contact tail is shown to have two pads for making a surface mounted connection to a pad on a printed circuit board. Preferably, each pad will connect to a separate pad on the surface of the printed circuit board.
Each ground conductor
370
also includes a projection
350
. Projection
350
is bent relative to the main body of each ground conductor and falls generally in the plane that is perpendicular to the line between adjacent ground conductors. In the preferred embodiment, each ground conductor has a generally right angle cross-section.
Lead frame
310
A is preferably stamped from a continuous sheet of conductive material such as metal. The features of each ground conductor
370
are then formed. Stamping and forming can be done in one step or in multiple steps. Preferably, many lead frames are formed on a continuous strip that can be processed according to a semi-continuous process.
In the illustrated embodiment, connector
100
is a single ended connector. In a single ended connector, each signal is represented by an electrical signal on one of the signal conductors. Usually, a signal is represented by the voltage difference between a signal conductor and a reference potential, such as ground. In contrast, a differential signal connector uses two signal conductors to represent each signal. The signal is represented by the voltage difference between the two signal conductors.
In a single ended connector, it is preferable that there be shielding between a signal conductor and every other adjacent signal conductor. Shielding is provided by the ground conductors. Therefore, in the preferred embodiment, there is one ground conductor associated with each signal conductor. Also, the projections
350
are positioned to be interposed between adjacent signal conductors.
In forming projections
350
by bending the material out of the plane of the sheet used to form the ground conductor lead frame, a space
352
is left between adjacent ground conductors. Also, it should be noted that in the illustrated embodiment there are fourteen signal conductors in a lead frame
210
, but only 7 ground conductors in a lead frame
310
A. In order to provide one ground conductor for each signal conductor, a separate ground conductor lead frame
310
B is overlaid on ground conductor lead frame
310
A. Ground conductor lead frame
310
B is similar to lead frame
310
A in that it contains similarly shaped ground conductors. However, in lead frame
310
B, the ground conductors are positioned to fit within the spaces
352
between the ground conductors of lead frame
310
A.
FIG. 3B
shows the ground conductors when a lead frame
310
A is overlaid on a lead frame
310
B. As can be seen, in this embodiment, there is one ground conductor for each signal conductor. In this configuration, an insulative housing is molded over the ground conductors to form a shield subassembly. As with the signal conductor subassembly, the insulative housing leaves the contact tails and the mating contact portions exposed.
FIG. 3B
does not show the carrier strips
340
. In the preferred embodiment, the carrier strips are severed after the insulative housing is molded over the conductors. However, the precise manufacturing steps are not critical to the invention and they can be performed in any convenient order.
FIG. 4
shows a signal subassembly
250
and a shield subassembly
410
mated to form a wafer
118
. Shield subassembly
410
has an insulative housing
450
. Housing
450
includes a rear portion
452
that includes features, such as hub
454
, to which clip
124
can be attached. Other such features will be included to provide mechanical properties as appropriate for the desired application of connector
100
.
Housing
450
also includes a front portion
460
. Front portion
460
contains openings
464
into which mating portions
216
of the signal conductors fit. As will be explained in greater detail in connection with
FIG. 6A
, mating contact portions
316
of the ground conductors are also accessible within openings
464
. Though not visible in
FIG. 4
, openings
464
extend to the mating face of the connector so that projections from the mating connector can enter openings
464
and make contact with the electrical conductors of wafer
118
.
Front portion
460
includes tabs
462
, which fit between ribs
164
and guide the connector pieces into proper alignment when mated. Other mechanical features as appropriate for the intended application of the connector can also be molded into front portion
460
.
The ground subassembly
410
and the signal subassembly
250
can be held together in any convenient matter. Preferably, attachment features are molded into the insulative housing of each subassembly. For example, snap-fit features, such as hooks and latches could be used. Alternatively, friction type attachments can be used.
Turning now to
FIG. 5
,
FIGS. 5A .
. .
5
C show components of backplane connector
150
. In the illustrated embodiment, each module
152
has an insulative housing
552
. Preferably, the housing is molded of a plastic material.
The floor
512
has a plurality of projections
510
extending from it in the direction of a mating connector. Projections
510
have channels
514
formed on opposite sides. One channel is adapted to receive a signal conductor
560
(
FIG. 5B
) and the channel on the opposite face is adapted to receive a ground conductor
570
(FIG.
5
C). The projections
510
are laid out in an array that matches the layout of conductive members in the mating connector. In the illustrated embodiment, the projections are laid out in a rectangular array. Each column in the array corresponds to one wafer in the mating connector.
Passages extend through floor
512
to allow the conductive members to be inserted from the lower surface of floor
512
. Passages
516
receive signal conductors
560
. Passages
518
receive ground conductors
570
. Stand-offs
530
are molded into housing
552
to ensure that the contact tails of the conductive members are in an open area and are therefore able to move freely to provide compliant motion when a connector module
152
is soldered to a printed circuit board. During attachment of the connector to a printed circuit board, the stand-offs also prevent the contact tails from being pressed too hard into the solder bricks and displacing the solder bricks.
FIG. 1
shows similar stand-offs are included on each daughter card wafer
118
.
FIG. 5B
shows signal conductors
560
. For illustration, three signal conductors are shown. In a preferred embodiment, multiple signal conductors
560
will be stamped and formed from a sheet of conductive material. The signal conductors will be held together by a carrier strip (not shown) or other convenient mechanism until inserted into housing
552
. Thereafter, the signal conductors will be separated as shown in FIG.
5
B. Preferably, automated tooling will insert a column of signal conductors into housing
552
at one time. In the illustrated embodiment, there are fourteen signal conductors in a column.
Signal conductors
560
include a mating contact portion
562
to which a signal conductor from a mating connector mates. When inserted into housing
552
, mating contact portion
562
will be in channel
514
facing outwards. More detail of conductors in the connector is provided in connection with the discussion of
FIG. 6A
, below.
Signal conductors
560
also include an intermediate portion
564
. Intermediate portion
564
includes retention features that hold signal conductor
560
within housing
552
. Examples of suitable retention features are barbs or tabs that create an interference fit inside signal opening
516
.
Signal conductors
560
also include contact tails
566
. When signal conductors
560
are inserted into housing
552
, contact tails
566
will be exposed below floor
512
. In the illustrated embodiment, the contact tails are curved to provide compliant members, similar to those used in the daughter card connector.
FIG. 5C
shows a ground conductor
570
. In an assembled backplane module
152
, the ground conductors will be inserted into shield opening
518
in floor
512
. Intermediate portion
574
is positioned within the floor
512
and holds the ground conductor
570
in the housing.
Ground conductors
570
include a mating contact portion
572
. The mating contact portion will be facing outward from projection
510
, thereby allowing a contact from a mating connector to make electrical connection to the ground conductor
570
.
As with the other conductors, ground conductors
570
also include contact tails
576
. In the illustrated embodiment, contact tails
576
are also shaped as compliant surface mount contacts. Here, two complaint members are shown with a gap
580
. Preferably, each of the compliant members will align with a conducting pad on the surface of a printed circuit board. Both pads will be connected, internally to the printed circuit board, to a reference potential. As shown in more detail in
FIG. 6A
, a contact tail
566
from a signal conductor will be positioned in gap
580
. Such a configuration provides improved electrical properties for the overall connector.
Each ground conductor
570
, in the illustrated embodiment, also includes a side portion
578
. The side portions bend away from the mating contact surface
572
. As shown in
FIG. 5A
, in the assembled backplane module
152
, side portions
578
are positioned between adjacent projections
510
.
Preferably, there will be one ground conductor for each signal conductor
560
. As shown in
FIG. 5A
, the ground conductors are supported by projections
510
, but are on the opposite side from a signal conductor
560
.
In this way, each projection
510
includes a signal conductor
560
and a ground conductor
570
. Projection
510
serves to keep the signal conductor and ground conductor electrically isolated. Furthermore, the signal conductor and ground conductor have a broad dimension and a narrow dimension. The signal conductor and ground conductor are preferably held so that their broad portions are in parallel. Such an arrangement of a signal conductor and a ground conductor forms a structure similar to a microstrip transmission line. Such structures have an impedance that is controllable by adjusting the spacing between the conductors, the properties of the material that separates the conductors and the width of the conductors in the broad dimension. Preferably, these dimensions are selected to provide desired impedance properties of the connector.
In addition to providing desirable impedance properties, the microstrip transmission structures formed by signal conductors
560
and ground conductors
570
concentrate the electromagnetic fields in the region between the conductors. Concentrating the electromagnetic fields decreases the amount of signal that is coupled from one signal conductor to an adjacent signal conductor.
Side portions
578
further reduce the amount of signal coupled between adjacent signal conductors. As shown, side portions
578
extend from ground conductors
570
to a position that is between adjacent signal conductors
560
. The presence of a conducting sheet connected to a reference potential can block coupling, particularly of electric fields, between adjacent signal conductors. Such shielding reduces the overall cross talk of the connector and makes it more suitable for use at high frequencies or with close spacing between signal conductors.
FIG. 6A
shows the conductors in two connector halves as mated. The insulative housings of the connectors are not shown in
FIG. 6A
for clarity. As shown, ground conductor
370
makes electrical contact with ground conductor
570
. Signal conductor
260
makes electrical contact with signal conductor
560
. The contact occurs within opening
464
.
As shown in
FIG. 6A
, the mating contacts are shaped to provide a conductive path through the connector that provides limited disruption to a signal. Such a path is said to have high signal integrity and is necessary for accurate transmission of signals, particularly high speed signals.
One feature is that the contact tails of the ground conductors are positioned on either side of the contact tails for signal conductors. This arrangement provides additional shielding in what would otherwise be a “noisy” part of the connector and therefore increases the integrity of signals passing through the connector. Thus, contact tail
212
is positioned between a pair of contact tails
312
and contact tail
566
is positioned between a pair of contact tails
576
.
A second feature is that projection
350
and side portions
578
provide a nearly continuous barrier on the side of the signal contacts. As the contacts are positioned in the overall connector, this barrier falls between adjacent signal contacts in a column. The main body of ground conductors
370
and
570
provide a barrier between adjacent signal contacts in the same row of the connector.
Furthermore, the shape of mating contact portion
316
provides improved signal integrity. Contact portion
316
has multiple beams, here beams
670
A and
670
B. One way that having multiple beams improves signal integrity is that they create multiple current paths. In
FIG. 6B
, those current paths are shown as paths
652
and
654
. Of particular advantage in the embodiment of
FIG. 6B
is the fact that path
652
diverts current into projection
350
.
Projection
350
provides a physical barrier between adjacent signal conductors. And, because it is made of conductive material connected to a ground, it also acts as a barrier to electric fields. However, the effectiveness of projection
350
at blocking magnetic fields is increased if current flows through it.
By having a second beam, with a base attached to a different portion of the ground conductor, a second current flow path is created. As shown, beam
670
A has a base
672
A and beam
670
B has a base
672
B that are attached to different portions of the ground conductor.
An additional benefit of having multiple beams arises when the beams are configured to have current flow through them in opposite directions. In the configuration of
FIG. 6B
, each of the beams makes contact to a mating ground conductor at contact regions
674
A and
674
B, respectively. Each of the beams
670
A and
670
B has a base
672
A or
672
B, respectively, that is positioned on the opposite side of its respective contact region. Because current in each beam flows along a line from the base to the contact region, the current flows through the two beams in opposite directions.
A benefit of having current flows in opposite directions is that magnetic fields generated by current in the beams are in opposite directions and will tend to cancel. Canceling magnetic fields might be of a particular advantage where the conductive member is carrying a high frequency signal instead of a ground.
A further benefit of having multiple beams with current flowing in offsetting directions is that the effective inductance of the overall contact is reduced.
A further advantage of the dual beam contact is that it is relatively narrow, allowing a high density of signal conductors. In a presently contemplated commercial embodiment of a connector as pictured, the connector will have 14 rows and carry more than 120 signals per inch of connector. Connectors with 8 rows can carry more than 80 signals per inch of connector. The illustrated embodiment should carry signals with rise times of 90 picoseconds, or shorter, with less than 5% cross talk. Such specifications correspond to a data rate of greater than 5 Gbps.
An advantage of the contact structure as illustrated is that current flows through the lower portion
680
of the shield. The contact structure spreads out the flow of current in the shield member, meaning that current flows at various places across the width of the contact. A similar benefit is provided by the mating contact
570
. As shown in
FIG. 6A
, mating contact
570
has two contact tails
576
, which are widely spaced across the width of the contact. In this way, current will flow across the width of contact
570
, also increasing its shielding effectiveness.
Alternatives
Having described one embodiment, numerous alternative embodiments or variations can be made.
For example,
FIG. 7
shows an alternative shielding configuration.
FIG. 3B
shows shielding of the preferred embodiment. Multiple individual ground conductors are positioned to generally create a shield plane that is positioned between columns of signal contacts in the overall connector. The same effect could be achieved by creating a shield plane from a single sheet of conductive material.
FIG. 7
shows such a shield member
710
. Here, shield member
710
is shown attached to a carrier strip
712
, such as it might appear before an insulative housing is molded onto it. Shield member
710
includes a body
714
to which contact tails
716
are attached.
In this embodiment, contact tails
716
are press fit contacts. They are adapted to make mechanical and electrical connection to plated through holes in a printed circuit board to which the connector is mounted.
Shield body
714
also has a plurality of mating contacts
718
formed along one edge. In a mated connector, each of the contacts
718
might make contact to separate blade-shaped mating contacts, such as contacts
570
. Alternatively, the mating contacts
718
on each of the shield plates might make connection to a shield plate running between columns of signal contacts in a mating connector. The shield configuration of
FIG. 7
might be most useful in a connector designed to carry differential signals. As shown, shield plate
714
includes side projections
730
, but not projections such as
350
that create a barrier between adjacent signal conductors.
The specific shape of mating contacts
718
might be employed, regardless of whether they are part of a single shield body or formed on individual ground conductors. As in the prior embodiments, each mating contact includes two beams
720
and
722
.
Beam
722
is shown to have an opening
724
formed below its base. Opening
724
is shaped to leave the base of beam
722
attached to a member
726
. Member
726
is attached to the overall plate at two ends and has a long axis running generally between these two ends. Member
726
forms a torsion member and can act like a torsion spring.
Beam
722
is attached to member
726
. A force on beam
722
such as might be generated when it is pressed against a mating contact will tend to cause beam
722
to rotate about the axis of member
726
. Member
726
will be stressed in torsion and will generate a counter force against the rotation. This counter force increases the mating Force generated by beam
722
.
An advantage of using a torsional member is that the beam can be made shorter, such as less than 2 mm. For example, in a preferred embodiment, beam
722
is 70 mils (1.7 mm). In contrast, beam
720
is 130 mils (3.2 mm). Yet, beam
722
provides the required mating force. Thus, using the torsional member allows the beam to be more than 40% shorter.
Ideally, each of the beams would be as short as possible to increase the shielding effectiveness of the ground contact. The portions of a conductive member that have current flowing through it are more effective as a shield than portions that do not. The current must flow through the beam to reach the mating contact (i.e. to complete the electrical circuit). When current flows through a beam, the current is concentrated in the relatively narrow beam rather than flowing through the rest of the shield contact. Thus, keeping the beam as short as possible reduces the percentage of the length of the overall contact where the current is concentrated in the narrow beam.
In the illustrated embodiment, a torsional member is not used with beam
720
because the overall connector structure would not have sufficient mechanical integrity to meet requirements of a specific application. However, beam
720
could likewise be mounted to a torsional member for other applications.
As pictured, torsion member
726
is serpentine. Because the counter force or spring force of a torsion member is inversely proportional to its length, making torsion member
726
longer results in a torsion spring that is more compliant or less “stiff.” By including bends or curves in torsion member
726
, the desired spring constant for the torsion member can be achieved in a relatively small area.
FIG. 7
also shows that beam
720
has projections
728
. As illustrated, beam
720
is bent out of the plane of shield plate
710
. Projections
728
extend beyond the main contact in the direction of the mating connector and also bend back towards the shield plate. Projections
728
prevent beam
720
from stubbing on a mating contact while a connector containing shield plate
710
is mated to another connector.
Similar projections are not shown for beam
722
because the base of the beam faces the mating connector. As a mating contact
718
is mated with a conductor from another connector, the mating contact will slide along beam
722
. Beam
722
will be pushed back into the plane of shield plate
710
and there is no abrupt protrusion from beam
722
on which the mating conductor could get caught or “stub.”
Because the free end of beam
720
faces the mating connector, there is a greater risk of stubbing from beam
720
. To make a good electrical connection to a mating contact, beam
720
must also be bent out of the plane of shield plate
710
sufficiently far that it will press against the mating contact when the connector pieces are mated. However, by projecting out of the plane of shield plate
710
, the forward edge of beam
720
presents an abrupt surface on which a mating conductor could stub.
As the mating contact reaches beam
720
, it is desirable that beam
720
be pressed back into the plane of shield plate
710
so that the mating conductor can slide along it. Projections
728
create a ramp at the leading edge of beam
720
. A mating contact will slide along this ramp, pushing beam
720
out of the direct path of the mating contact. In this way, projections
728
significantly reduce the chance that a mating contact will stub on beam
720
.
Similar anti-stubbing properties could be achieved by shaping the free end of beam
720
as a ramp or to otherwise have tapered lead-in like projections
728
. However, including the ramps in separate projections provides performance advantages. First, because the preferred construction technique is to stamp and form the ground contacts, all of the structures for the mating contacts
718
must be cut from a single sheet of metal. As shown, projections
728
extend to the side of beam
722
. They are formed from material that would otherwise have been cut out of the sheet to allow beam
722
to move freely. To include a tapered lead-in on beam
720
, material between beams
720
and
722
would be needed. The ends of beams
720
and
722
would have to be far enough apart to leave sufficient material to form the taper. Conversely, by making the tapered lead-in on a projection to the side of the beam, the spacing between beams can be made smaller.
Thus, by forming the tapered lead-in of one beam to be on the side of the other beam, the points at which each beam contacts a mating connector can be made closer together. We believe that having close points of contacts reduces the areas of the shield in which there is no current flow and overall increases the effectiveness of the shield.
The illustrated configuration in which two projections are used is also preferable. Two projections means that there are two points of contacts to the mating contact. Multiple points of contact creates multiple current paths in the contact, which will also increase the shielding effectiveness of that contact. Two points of contact is shown as the preferred embodiment, representing a compromise of the number of contacts that can fit into the space available to create a high density connector of the required mechanical properties.
As an example of another variation, the opposing beams are shown with the long axes of the beams being substantially co-linear. Such an arrangement is useful when a shield plate is to mate in a relatively narrow region, such as when the plate mates with the blade. However, if more mating area is provided, the beams could be side-by-side. In such an arrangement, the long axes of the beams would be parallel such that magnetic fields associated with each beam would cancel.
Furthermore, the invention is not limited to use in making ground contacts. Signal contacts could likewise be formed with contacts as described above.
Additionally, the invention is shown having pairs of beams formed in the same conducting member. It is possible that each of the beams could be formed in a mating contact member. In this configuration, one.
Also, the invention is illustrated in a connector that uses surface mount contact tails. Other forms of contact tails might be used. Examples of other suitable contact tails are press-fit contact tails, pressure mount contact tails and solder ball contacts.
Screws
116
and
158
can be used in the case of a pressure mount contact to generate the required force to press the contact tails against the printed circuit board. It should be appreciated, though, that they are used as an illustration of a mounting mechanism and might not be used. For a surface mount connection, if alignment features such as posts
122
provide sufficient retention force to hold the connector in place until the solder is reflowed, screws might not be required. Alternatively, the screws might be added after the solder is reflowed to allow the connector to be mounted to the board in the same manufacturing step as semiconductor components. However, the screws might still be needed to prevent excessive force from building up on the solder joints holding the contact tails to the printed circuit board. Likewise, screws might be added later along with alignment features such as pins
156
.
As another example, it might be possible or desirable to include features in addition to or instead of the clips in the illustrated embodiment on each of the subassemblies to hold the subassemblies together. For example, the subassemblies might be held together with snap-fit features or with some securing mechanism, such as an adhesive, or a member, such as a bolt, running through the subassemblies. As yet another variation, the subassemblies might be held in a housing or cap.
As an example of another variation, it is not necessary that the connector housings be made of insulative material. It is sometimes desirable that the housing be made partially or wholly of a conductive material. Where the housing is conductive, spacers or insulative coatings can be used to ensure that the signal conductors are not shorted together or to ground through the housing.
The ground conductors in each of the daughter card and backplane connector include side portions, or projections, such as
350
and
578
. While desirable to have both, it is not necessary and a connector might be made without one or both of these projections. Likewise, benefit could still be obtained with the projections extending over only a portion of the length of the signal contact. For example, a connector might be made with only projection
350
and only in the region or opening
464
where the signal conductors mate.
It should also be appreciated that the illustrated embodiment shows ground contacts with side portions
350
on only one side to create shield strips with an L-shpaed cross section. Side portions could be included on both sides of the contact to have ground strips with a U-shaped cross section. Such a configuration might be useful, for example, in a differential connector. In a differential connector, two signal conductors, forming a differential pair, would be placed within the “U” of the U-shaped ground conductor.
It should be appreciated that that the arrows in
FIG. 6B
illustrating the direction of the current flow do not necessarily correspond to the direction of the flow of electrons in an interconnection system. Because either a positive or negative voltage, if largely static, can act as a reference potential for high-speed signals, the conductive members identified as ground or reference conductors could carry currents of either polarity. Moreover, even though reference voltages are normally fixed in an interconnection system, during operation of a circuit, the magnitude or the polarity of the reference voltages might even switch.
Further,
FIG. 7
shows that beam that has its free end facing a mating electrical connector has projections
728
to avoid stubbing conductors from the mating connector. The tapered shaper of the projections provides this benefit. As an alternative, a single beam might be formed on the beam itself without the need for projections. Other anti-stubbing features might be used instead. For example, the end of beam
720
might be embedded in the insulative housing
450
or otherwise protected from stubbing.
Alternatively, it is not necessary that the beams
720
and
722
or beams
670
A and
670
B be separated. For example, with holes
724
cut below the base of the beams leaving each beam attached to a member such as
726
, beams could be stamped from a sheet of material and formed to bend out of the plane of material by deforming members
726
. In this way, the upper and lower beams could remain joined, but still bend sufficiently far out of the plane of the sheet of metal to provide a good electrical connection to a conductor in a mating electrical connector. Such a contract structure would, for example, still provide the benefit of two parallel current paths through the shield and, if appropriately positioned, increase the current flow, and therefore the shielding abilities, of a projection such as
350
.
Furthermore, it might not be necessary to use two beams in a contact. For example, even if beam
670
A were not present in
FIG. 6B
, current would flow through path
652
, increasing the shielding effectiveness of projection
350
.
While the invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims
- 1. An electrical connector having a plurality of conductive members and at least one ground member, the electrical connector mateable to a corresponding electrical connector and comprising:each of the conductive members having a first contact end connectable to a printed circuit board and a second contact end mateable to the corresponding electrical connector; the ground member having a plurality of first contact ends connectable to the printed circuit board and a plurality of second contact ends mateable to the corresponding electrical connector; the second contact aids of the ground member having a first beam with an elongated axis and a second beam with an elongated axis; the first beam having a fee end and an end attached to the ground member and the second beam having a free end and an end attached to the ground member; and the elongated axis of the first beam and the elongated axis of the second beam being aligned and the free end of the first beam and the free end of the second beam being directed towards one another such that electrical current flow through the first and second beams is substantially in opposite directions.
- 2. The electrical connector of claim 1, wherein:the ground member further comprises an intermediate portion between the fist contact ends and the second contact ends, the intermediate portion disposed along a first plane; and the first and second beams of the ground member projecting from the first plane such that during mating to the corresponding electrical connector, the first and second beams provide spring force.
- 3. The electrical connector of claim 1, wherein the ground member comprises a plurality of ground conductors.
- 4. An electrical connector having a plurality of wafers, with each of the plurality of wafers comprising,a housing; a plurality of signal conductors and a plurality of ground conductors disposed at least partially in the hosing, where each of the signal conductors has a first contact end connectable to a printed circuit board and a second contact end mateable to a corresponding electrical connector and each of the ground conductors has a it contact end connectable to the printed circuit board and a second contact end mateable to the corresponding electrical connector, the second contact end of the ground conductors has a first beam with an elongated axis and a second beam with an elongated axis, where the first beam includes a free end and an end attached to the ground conductor and the second beam includes a free end and an end attached to the ground conductor; and the elongated axis of the first beam and the elongated axis of the second beam are aligned and the free end of the first beam and the free end of the second beam are directed towards one another.
- 5. The electrical connector of claim 4, wherein the plurality of wafers are held together by a stiffening member.
- 6. The electrical connector of claim 4, wherein:each of the ground conductors further comprises an intermediate portion between the first contact end and the second contact end, the intermediate portion being disposed along a first plane; and the first and second beams of the ground conductor project from the first plane such that during mating to the corresponding electrical connector, the first and second beams provide spring force.
US Referenced Citations (7)