This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2011-179528, filed on Aug. 19, 2011, the entire contents of which are incorporated herein by reference.
A certain aspect of the embodiments discussed herein is related to a connector.
Conventionally, there has been known a connector that is welded to a contact pad on a printed circuit board by melting a solder by a reflow process (Japanese Laid-Open Patent Publication No. 2011-060427 and Japanese National Publication of International Patent Application No. 2007-502527). The reflow process is a process in which parts are mounted on the printed circuit board on which the solder has been printed, the printed circuit board is heated by the hot air of a heating device to melt the solder, and the parts and the printed circuit board are combined.
According to an aspect of the present invention, there is provided a connector, including: a housing; and a connector module; the connector module including: a projection portion that projects outside from the housing; a substrate composed of a material with thermal conductivity; and a terminal that is fixed to a lower part of the substrate and contacts an external substrate.
The object and advantages of the invention will be realized and attained by the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
A description will now be given of exemplary embodiments with reference to the accompanying drawings.
In
An opening 13 is formed on a front surface of the connector 10, and another connector, not shown, is attached to the connector modules 12 via the opening 13. Each of slits 14 for exposing outside a part of each connector module 12 (i.e., a projection unit 26 described later) is formed on the back surface of the connector 10, as illustrated in
In
The connector module 12 includes a substrate 20, sockets 21, signal lines 22, and a frame 25, as illustrated in
That is, the connector module 12 is separated from an adjacent connector module 12 by the thickness of the frame 25.
The substrate 20 is composed of a metal with high thermal conductivity, such as aluminum or copper, and an insulated film 28 is applied to the surface of the metal (see
The sockets 21 are connected to another connector to be connected to the connector 10. The connector module 12 includes four sockets 21, but the number of sockets 21 is not limited to this. Each socket 21 is connected to two signal terminals 23 via two signal lines 22. The two signal terminals 23 are fixed to a lower part of the substrate 20, and extend in a horizontal direction from the lower part of the substrate 20. A plurality of ground terminals 24 extend in the horizontal direction from the lower part of the substrate 20. The two signal terminals 23 are provided between a ground terminal 24 and an adjacent ground terminal 24. The signal terminals 23 and the ground terminals 24 are disposed on the electrode pads 51, and fixed on the electrode pads 51 by melting the solder 52.
In addition, the leg units 27 extend vertically downwards from the lower part of the substrate 20, and are inserted into the holes 53 on the substrate 50. Thereby, the motion in the horizontal direction of the connector module 12 is inhibited. Protrusions, not shown, which fit in the concave units 54, are formed on a bottom surface of the housing 11.
The connector 10 constituted as mentioned above absorbs the heat of the heating device 100 from the projection unit 26 of the connector module 12, as illustrated in
When the connector 10 is used, the heat generated by the substrate 50 is conducted to the projection unit 26 of the connector module 12 via the signal terminals 23 and the ground terminals 24. Therefore, the projection unit 26 of the connector module 12 has a function as a heat sink emitting the heat generated by the substrate 50.
In
An opening unit 25A (a first opening portion) is formed at a position on the frame 25 opposed to the signal terminals 23 and the ground terminals 24, as illustrated in
By forming the opening unit 25A and any one of the opening unit 11A and the slits 11B, a user can check the states of each signal terminal 23 and each ground terminal 24. That is, the user can check whether each signal terminal 23 and each ground terminal 24 are fixed on the electrode pads 51 by melting the solder 52. In addition, the hot air of the heating device 100 reaches the solder 52 easily by forming the opening unit 25A and any one of the opening unit HA and the slits 11B.
As described above, the heat absorbed in the projection unit 26 is conducted to the substrate 50 via the substrate 20, the signal terminals 23 and the ground terminals 24, and hence it is possible to easily melt the solder 52 on the substrate 50.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various change, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
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2011-179528 | Aug 2011 | JP | national |
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Number | Date | Country | |
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20130045634 A1 | Feb 2013 | US |