This application claims priority to Taiwan Patent Application Nos. 099122249 filed Jul. 6, 2010; and 099134352 filed Oct. 8, 2010, the entire disclosures of which are hereby incorporated by reference in their entireties.
The present invention relates to an electrical connector, and more particularly to an electrical connector with an upper base and a lower base, which are movable relative to each other.
In a case that the driving member 92 is rotated downwardly to have the covering member 91 move forwardly, the hook 96 of the covering member 91 and the hook 95 of the base 90 are securely engaged with each other, so that the covering member 91 and the base 90 are combined together. Due to the engagement between the hooks 95 and 96, even if an upward force is generated during the process of rotating the driving member 92, the possibility of upturning the covering member 91 will be minimized. Consequently, the possibility of damaging the plastic covering member 91 or the base 90 will be reduced.
The conventional electrical connector, however, still has some drawbacks. For example, since the covering member 91 needs to have the downwardly-extended side plates 98, during the covering member 91 is produced by a plastic injection molding process, a stress is generated. Due to the stress, the covering member 91 is readily warped and thus uneven. Under this circumstance, the production yield is reduced. As the size of the covering member 91 is gradually reduced to comply with the miniaturization requirement, the problem of producing the warped and uneven covering member will become more serious.
The present invention provides an electrical connector with an upper base and a lower base. The upper base has no integral and downwardly-extended side plate hooking structure to be engaged with the lower base. By using an engaging structure to engage the upper base with the lower base, the upper base is engaged with the lower base and the upper base is restricted to be moved forwardly or backwardly relative to the lower base. In such way, the upper base has enhanced evenness in the fabrication process.
The present also provides an electrical connector with an engaging mechanism. The engaging mechanism is arranged on at least two outer peripheries of the upper base and the lower base to facilitate combining the upper base and the lower base together, thereby improving the engaging efficacy of the hooks of the conventional electrical connector.
The present further provides an electrical connector with an engaging structure to engage the upper base with the lower base. The upper base is made by an insulating flat plate in order to meet the requirements of small size, light weightiness and evenness.
In accordance with an aspect of the present invention, there is provided an electrical connector. The electrical connector includes a lower base, an upper base, an engaging structure and a driving mechanism. The lower base includes a terminal slot for accommodating a terminal. The upper base is disposed over the lower base. An outer periphery of the upper base at least includes an upper-base top surface, an upper-base bottom surface and an upper-base sidewall arranged between the upper-base top surface and the upper-base bottom surface. The upper base is an insulating flat plate. The upper-base top surface and the upper-base bottom surface are flat and have no protruding structure. The engaging structure is used for engaging the upper base with the lower base, so that the upper base is restricted to be moved forwardly or backwardly relative to the lower base. The driving mechanism is arranged between the upper base and the lower base for driving movement of the upper base and lower base forwardly or backwardly relative to each other.
In an embodiment, the engaging mechanism further includes a side plate. The side plate is integrally formed with and protruded from a lower-base top surface of the lower base and extended from an edge of the lower base, wherein the downward engaging surface is protruded from a top edge of the side plate. Alternatively, the engaging mechanism further includes a movable engaging piece. The movable engaging piece is protruded from at least one of left and right edges of the lower-base top surface. An upper segment of the movable engaging piece has a side plate and a downward engaging surface protruded from a top edge of the side plate. A lower segment of the movable engaging piece has a positioning part to be positioned in the lower base. Alternatively, the engaging mechanism further includes a first coupling part, a second coupling part and a position-limiting element. The first coupling part is laterally protruded from the upper-base sidewall at a left side and/or a right side of the upper base, and the upward engaging surface is provided by the first coupling part. Corresponding to the first coupling part, the second coupling part is laterally protruded from a lower-base sidewall at a left side and/or a right side of the lower base to provide the downward engaging surface. The movable position-limiting element has at least one fastening slot. The first coupling part and the second coupling part are allowed to be penetrated through the fastening slot and engaged with the fastening slot.
In an embodiment, the upward engaging surface is provided by the upper-base top surface to be engaged with the downward engaging surface. Alternatively, the upward engaging surface is provided by a plurality of bulges, which are discretely arranged on the upper-base sidewall at a left or right side of the upper base to be engaged with the downward engaging surface. Alternatively, the upward engaging surface is provided by a contiguous bulge, which is arranged on and longitudinally extended from the upper-base sidewall at a left or right side of the upper base, so that the contiguous bulge and a portion of the upper-base top surface at the same side of the contiguous bulge are collectively engaged with the downward engaging surface. Alternatively, the upward engaging surface is provided by the upper-base top surface to be engaged with the downward engaging surface which is provided by the movable engaging piece. A first perforation is formed at a left edge and/or a right edge of the upper base. A second perforation and a fastening slot corresponding to the first perforation are formed in a left edge and/or a right edge of the lower base. The movable engaging piece is penetrated through the first perforation and the second perforation, and the positioning part is positioned in the fastening slot. Alternatively, a first perforation is formed in a left edge and/or a right edge of the upper-base top surface corresponding to the downward engaging surface of the movable engaging piece. The upward engaging surface is arranged in the first perforation and exposed to the upper-base top surface. A second perforation and a fastening slot corresponding to the first perforation are formed in the left edge and/or the right edge of the lower base. The movable engaging piece is penetrated through the first perforation and the second perforation to be engaged with the upward engaging surface. Alternatively, a notch is formed in a left edge and/or a right edge of the upper-base top surface corresponding to the downward engaging surface of the movable engaging piece. The upward engaging surface is arranged in the notch and exposed to the upper-base top surface. A perforation and a fastening slot corresponding to the first perforation are formed in the left edge and/or the right edge of the lower base. The movable engaging piece is penetrated through the perforation and the notch to be engaged with the upward engaging surface. Alternatively, the upward engaging surface is provided by the upper-base top surface to be engaged with the downward engaging surface, and a notch is formed in a left edge and/or a right side of the upper base. After the upper base is placed on the lower base from top to bottom, the downward engaging surface provided by the movable engaging piece is received by the notch. Alternatively, the positioning part of the movable engaging piece has an elastic inverted hook for facilitating fixing the movable engaging piece in the lower base. Alternatively, the fastening slot of the movable position-limiting element includes a wide hole and a narrow hole, which are in communication with each other. The first coupling part and the second coupling part are penetrated through the wide hole. The narrow hole is engaged with the first coupling part and the second coupling part. Alternatively, the movable position-limiting element includes a plurality of separate movable position-limiting portions, and the fastening slot of each movable position-limiting element comprises a wide hole and a narrow hole, which are in communication with each other. The first coupling part and the second coupling part are penetrated through the wide hole. The narrow hole is engaged with the first coupling part and the second coupling part. Alternatively, the fastening slot of the movable position-limiting element includes an open hole and a narrow hole, wherein the first coupling part and the second coupling part are penetrated through the open hole, and the narrow hole is engaged with the first coupling part and the second coupling part.
In an embodiment, the upper base is an insulating flat plate. The driving mechanism includes a handle with a lever part and a pivotal part. A shaft is disposed at both ends of the pivotal part. A cam is disposed at a middle of the pivotal part. The shaft is coupled with the lower base. Upon rotation of the cam, the upper base is driven to be moved relative to the lower base. Alternatively, the driving mechanism includes a moving element and a pushing element. The upper base has an opening, the moving element has a through-hole and is coupled to and fixed on the base. The pushing element has a slot in a top surface thereof and an eccentric cam corresponding to a center of the slot. The eccentric cam is received within the through-hole. The slot is exposed to the opening of the upper base. Upon rotation of the pushing element, the moving element is pushed by the eccentric cam, so that the upper base is driven to be moved relative to the lower base.
In an embodiment, the upper base is an insulating flat plate, and the upper-base top surface and the upper-base bottom surface are flat and have no protruding structure. Moreover, the side plate of the lower base is a contiguous plate, and the downward engaging surface is divided into multiple segments of separate surfaces. Alternatively, the downward engaging surface is divided into multiple segments of separate first surfaces, and the side plate is divided into multiple segments of separate second surfaces and engaged with the downward engaging surface. Alternatively, corresponding to the movable engaging piece, at least one fastening slot is formed in a left edge and/or a right edge of the low-base top surface of the lower base.
In an embodiment, the electrical connector further includes a conduction mechanism and a chip package. The conduction mechanism is installed on at least one of the upper base and the lower base for transferring a physical signal. The chip package is supported on the upper base, and includes a top surface, a bottom surface, a sidewall connected with the top surface and the bottom surface and a plurality of metal pins protruded outside the chip package. The metal pins are penetrated through a plurality of insertion holes to be electrically connected with respective terminals.
In an embodiment, the conduction mechanism includes a thermal conduction mechanism or an electrical conduction mechanism. The thermal conduction mechanism is disposed on the upper-base top surface, the upper-base bottom surface, a lower-base top surface of the lower base, a lower-base bottom surface of the lower base, within at least one of the insertion holes, within at least one of the terminal slots and/or on at least one of the metal pins. The electrical conduction mechanism includes a laminate with at least one electrically-conductive layer. The laminate is disposed on a part of the upper base or the lower base.
In an embodiment, the conduction mechanism includes a thermal conduction mechanism or an electrical conduction mechanism. Moreover, the thermal conduction mechanism includes a first thermal conduction mechanism, which is in contact with the bottom surface or the sidewall of the chip package or in contact with at least one signal pin, one ground pin or one power pin of the metal pins of the chip package, wherein the first thermal conduction mechanism is a metal plate, an electrically-conductive pad, a fastener, a wire or a solder ball. Alternatively, at least one part of the engaging structure and the driving mechanism is made of a metallic material, and at least one thermal conduction path is established between the part and the first thermal conduction mechanism. Alternatively, the thermal conduction mechanism includes a first thermal conduction mechanism and a second thermal conduction mechanism, wherein the first thermal conduction mechanism is in contact with the bottom surface or the sidewall of the chip package or in contact with at least one signal pin, one ground pin or one power pin of the metal pins of the chip package, the second thermal conduction mechanism is not in contact with the bottom surface or the sidewall of the chip package or not in contact with each of the metal pins, and at least one thermal conduction path is established between the second thermal conduction mechanism and the first thermal conduction mechanism. Alternatively, the electrical conduction mechanism includes a laminate with at least one electrically-conductive layer, and the laminate is disposed on a part of the upper base or the lower base. Alternatively, the electrical conduction mechanism at least includes a first electrical conduction mechanism and a second electrical conduction mechanism, wherein the first electrical conduction mechanism is in contact with the bottom surface of the chip package or the metal pins of the chip package, the second electrical conduction mechanism is disposed on a location of the electrical connector which is not in contact with the chip package, and an electrical conduction path is established between the second electrical conduction mechanism and the first electrical conduction mechanism.
In an embodiment, the electrically-conductive layer at least includes a ground layer or a power layer. Alternatively, at least one metal substrate, one metal wire, one thermally-conductive pad, one thermally-conductive terminal, one thermally-conductive hole, one metallic fastener or one solder ball is disposed on the laminate to be electrically with at least one signal pin, one ground pin or one power pin of the metal pins. Alternatively, the second thermal conduction mechanism includes a thermally-conductive ring or a solder ball or other heat-dissipating or cooling mechanism. Alternatively, an electronic component is further in communication with the electrical conduction mechanism, wherein the electronic component includes a capacitor, a capacitive structure, an inductor, an inductive structure, an active/passive electronic component, an active/passive electronic structure, an electromagnetic interference (EMI) protection element or an electrostatic discharge (ESD) protection element.
In an embodiment, each of the upper base and the lower base further includes a thermal conduction mechanism or an electrical conduction mechanism, at least one part of the engaging structure and the driving mechanism is made of a metallic material, and at least one thermal conduction path is established between the part and the first thermal conduction mechanism.
In an embodiment, the electrical conduction mechanism includes a laminate with at least one electrically-conductive layer, and the laminate is disposed on a part of the upper base or the lower base.
In an embodiment, the engaging structure includes a movable engaging piece, which is protruded from at least one of left and right edges of a lower-base top surface of the lower base. An upper segment of the movable engaging piece has a side plate and a downward engaging surface protruded from a top edge of the side plate. A lower segment of the movable engaging piece has a positioning part to be positioned in the lower base. The thermal conduction path is established between the part and the thermal conduction mechanism through the movable engaging piece.
In accordance with another aspect of the present invention, there is provided an electrical connector. The electrical connector includes a lower base, an upper base, an engaging mechanism and a driving mechanism. The engaging structure at least includes a movable upward engaging surface and a downward engaging surface installed on the lower base. After the movable upward engaging surface is engaged with the downward engaging surface, the upper base is engaged with the lower base and the upper base is movable forwardly or backwardly relative to the lower base. In addition, the movable upward engaging surface is located at a level not higher than the downward engaging surface.
In an embodiment, each of the upper base and the lower base further includes a thermal conduction mechanism or an electrical conduction mechanism, at least one part of the engaging structure and the driving mechanism is made of a metallic material, and at least one thermal conduction path is established between the part and the first thermal conduction mechanism.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
The lower base 10 comprises multiple rows of terminal slots 11, which are arranged in an array. For clarification and brevity, only the terminal slots 11 disposed at the corners of the lower base 10 are shown. The terminal slots 11 are used for accommodating respective terminals (not shown). In addition, a recess 12 is formed at a side of the lower base 10 for accommodating the driving mechanism 40. A circular hole 13 is formed in the middle of the recess 12. Two longitudinal fastening slots 14 are respectively disposed at opposite sides of the circular hole 13. Each of the fastening slots 14 has an upright opening 15. In addition, an entrance 16 is disposed at a rear end of the fastening slot 14.
The outer periphery of the upper base 20 at least comprises an upper-base top surface 2101, an upper-base bottom surface 2102 and an upper-base sidewall 2103. The upper-base sidewall 2103 is arranged between the upper-base top surface 2101 and the upper-base bottom surface 2102. The upper base 20 comprises multiple rows of insertion holes 21, which are arranged in an array. For clarification and brevity, only the insertion holes 21 disposed at the corners of the upper base 20 are shown. These insertion holes 21 correspond to the terminal slots 11 of the lower base 10. In addition, corresponding to the circular hole 13 of the lower base 10, a circular opening 22 is formed at a side of the upper base 20. One longitudinal perforation 23 and two fastening holes 24 are arranged at each of opposite sides of the circular opening 22. The two fastening holes 24 are perpendicular to each other. The upper base 20 may be placed on the lower base 10 to cover the lower base 10 and movable relative to the lower base 10. In the first embodiment, the whole upper base 20 is a flat plate made of insulating material. That is, the upper-base top surface 2101 and the upper-base bottom surface 2102 are flat and have no protruding structure. Therefore, any side plates extended downwardly from bilateral sides of the covering member of the conventional electrical connector are not included in the upper base 20.
The engaging mechanism comprises a downward engaging surface and an upward engaging surface. When the downward engaging surface and the upward engaging surface are engaged with each other, the upper base 20 is engaged with the lower base 10, and the upper base 20 is movable relative to the lower base 10. Moreover, the upward engaging surface is located at a level not lower than the downward engaging surface.
In the first embodiment, the engaging mechanism comprises an engaging structure 30, which is integrally formed with the lower base 10. The engaging structure 30 is protruded from a side plate 31 of the lower base 10, wherein the side plate 31 is formed on at least one of the left and right edges of the top surface of the lower base 10. The engaging structure 30 is protruded from a top edge of the side plate 31 to define the downward engaging surface 32 of the engaging mechanism. On the other hand, the upward engaging surface of the engaging mechanism is provided by the upper-base top surface 2101 of the upper base 20. The upper-base top surface 2101 is located at a level not lower than the upper-base bottom surface 2102. Moreover, the upper-base top surface 2101 can be engaged with the downward engaging surface 32. It is noted that, in the first embodiment, a plurality of engaging structures 30 are integrally formed with the lower base 10 by a plastic injection molding process. These engaging structures 30 are discretely arranged on the sidewalls 31. Moreover, numerous modifications and alterations may be made while retaining the teachings of the invention. For example, a contiguous engaging structure 30 is connected with the side plate 31. Moreover, the side plates 31 in the first embodiment may be modified. For example, a plurality of separate side plates 31 may be discretely protruded from an edge of the top surface of the lower base 10.
The driving mechanism 40 (e.g. a screw driving assembly) comprises a fixing slice 41, a moving element 45 and a pushing element 412. The fixing slice 41 is positioned in a recess 12 of the lower base 10. The fixing slice 41 has a pivotal aperture 42 corresponding to the circular hole 13 of the lower base 10. Two perforations 43 are arranged at each of opposite sides of the pivotal aperture 42. A through-hole 46 is arranged at the middle of the moving element 45. A longitudinal perforation 47 and two protruding parts 48 are arranged at each of opposite sides of the through-hole 46. The two protruding parts 48 are perpendicular to each other. After the protruding parts 48 are penetrated through corresponding fastening holes 24 of the upper base 20 from bottom to top, the moving element 45 is combined with the upper base 20.
Please refer to
During the assembling process, the pushing element 412 is firstly inserted into the circular opening 22 of the upper base 20. Consequently, the screw head 413 is sustained against the moving element 45, the eccentric cam 415 is received within the through-hole 46, and the cross-form slot 414 is exposed to the circular opening 22 of the upper base 20. Then, the shaft 416 of the pushing element 412 is coupled with the pivotal aperture 42 of the fixing slice 41, which is positioned on the lower base 10. Upon rotation of the pushing element 412, the moving element 45 is pushed by the eccentric cam 415, and thus the upper base 20 is driven to be moved relative to the lower base 10.
Moreover, the electrical connector 105 further comprises a clamping element 50, which is substantially inversed U-shaped. The clamping element 50 comprises a pressing surface 51 and two hooking parts 52. The pressing surface 51 has an opening 53. The opening 53 is smaller than the circular opening 22 of the upper base 20. Moreover, the opening 53 may be sheathed around the raised surface 417 of the pushing element 412. The two hooking parts 52 are respectively connected to bilateral sides of the pressing surface 51. Moreover, each of the hooking parts 52 is extended downwardly and then bent to have a horizontal engaging surface 54. The longitudinal perforation 23 of the upper base 20 and the longitudinal perforation 47 of the moving element 45 are both longer than the hooking part 52. Please refer to
A process of assembling the electrical connector 105 will be illustrated as follows. The assembled process is presented for purpose of illustration and description only. The assembled process comprises the following steps. Firstly, in the step (a), the fixing slice 41 is accommodated within the recess 12, and the moving element 45 is fixed onto the bottom surface of the upper base 20 from bottom to top (in the direction indicated as the arrow T). Then, in the step (b), the upper base 20 is placed on the lower base 10 from back to front (in the direction indicated as the arrow F), wherein the bilateral sides and the top side of the upper base 20 is confined by the engaging structure 30 and the downward engaging surface 32 is engaged with the upper-base top surface 2101. Then, in the step (c), the clamping element 50 is moved from top to bottom (in the direction indicated as the arrow U) to clamp the upper base 20 and the driving mechanism 40. That is, after the two hooking parts 52 are penetrated through the longitudinal perforation 23 of the upper base 20, the longitudinal perforation 47 of the moving element 45 (in the direction indicated as the arrow T) and the perforations 43 of the fixing slice 41, the two hooking parts 52 are inserted into the fastening slots 14. Afterwards, in the step (d), the insertion pins 60 are inserted into the fastening slots 14 through the entrance 16 from back to front (in the direction indicated as the arrow F) and engaged with the engaging surfaces 54 of the hooking parts 52 of the clamping element 50. In such way, the upper base 20, the driving mechanism 40 and the lower base 10 are securely combined together.
Moreover, by using a suitable tool (e.g. a screwdriver) to drive the cross-form slot 414, the pushing element 412 may be rotated. Since the clamping element 50 is attached on the lower base 10, upon rotation of the pushing element 412, the moving element 45 is pushed by the eccentric cam 415 of the pushing element 412. In such way, the upper base 20 is movable forwardly and backwardly relative to the clamping element 50 and the lower base 10.
From the above discussions, after the two hooking parts 52 of the clamping element 50 are penetrated through the upper base 20, the moving element 45 and the fixing slice 41, the clamping element 50 is attached on the lower base 10. In other words, the upper base 20, the lower base 10 and the driving mechanism 40 are all clamped by the clamping element 50. The pushing element 412 can be securely positioned on the lower base 10 without the help of any riveting means. Therefore, the assembling convenience is enhanced, and the driving mechanism 40 is securely clamped.
A process of producing the upper base 20 of the electrical connector 105 will be illustrated as follows. Firstly, an insulating flat plate is provided. Then, the insulating flat plate is punched and cut into an upper base. Consequently, the upper base 20 comprises a plurality of insertion holes 21, which are arranged in an array. The insulating flat plate is a plastic flat plate or a glass fiber flat plate. In addition, the upper base 20 is configured to support at least one central processing unit (CPU).
Hereinafter, an electrical connector according to a second embodiment of the present invention will be illustrated with reference to
In comparison with the first embodiment, the circular opening 22 of the upper base 20 of the electrical connector 205 is formed in a concave surface 27 of the upper base 20. Corresponding to the circular hole 13 of the lower base 10, two transverse perforations 28 are respectively arranged at opposite sides of the circular opening 22. Moreover, a plurality of bulges 29 are discretely arranged on the upper-base sidewall 2103 of the upper base 20. The top surface 2901 of the bulge 29 is arranged between the upper-base top surface 2101 and the upper-base bottom surface 2102. Alternatively, the bulge 29 is a contiguous bulge with a contiguous top surface 2901. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention.
In comparison with the first embodiment, the engaging mechanism of the electrical connector 205 comprises an engaging structure 30, which is integrally formed with the lower base 10. The engaging structure 30 is protruded from a side plate 131 of the lower base 10, wherein the side plate 131 is formed on at least one of the left and right edges of the top surface of the lower base 10. In this embodiment, a plurality of engaging structures 30 are discretely arranged on a plurality of side plates 131 of the lower base 10. On contrast, the side plate 31 of the first embodiment is a contiguous side plate. Moreover, each of the side plates 131 has a notch mating with a corresponding bulge 29 of the upper base 20. That is, in the second embodiment, the engaging structure 30 provides a downward engaging surface of the engaging mechanism, and the top surface 2901 of the bulge 29 provides an upward engaging surface of the engaging mechanism. As shown in
In comparison with the first embodiment, the fixing slice 41 has a pivotal aperture 42 corresponding to the circular hole 13 of the lower base 10. Two narrow lateral parts 44 are respectively arranged at bilateral sides of the fixing slice 41. A through-hole 46 is arranged at the middle of the moving element 45. Three transverse perforations 49 are arranged at each of opposite sides of the through-hole 46. The constituents and the assembling relation of the pushing element 412 are similar to those of the first embodiment, and are not redundantly described herein.
In comparison with the first embodiment, the clamping element 50 comprises a pressing surface 51 and four hooking parts 52. The pressing surface 51 has an opening 53. The opening 53 is smaller than the circular opening 22 of the upper base 20. These four hooking parts 52 are respectively connected to the front and rear ends of the left and right sides of the pressing surface 51 and extended downwardly. Consequently, the left and right sides of the clamping element 50 are substantially inverted U-shaped. The hooking part 52 has a fastening hole. A lower edge of the fastening hole has a horizontal engaging surface 54.
Please refer to
Hereinafter, an electrical connector according to a third embodiment of the present invention will be illustrated with reference to
Moreover, the electrical connector 305 comprises two smaller separate clamping elements 50 and a pressing plate 55. These two clamping elements 50 are sheathed around bilateral sides of the pressing plate 55. The cooperation of the two clamping elements 50 and the pressing plate 55 can achieve the similar efficacy of the clamping elements 50 of the second embodiment.
In the above embodiments, the upper base and the lower base of the electrical connector are combined together by the engaging mechanism. Since the two downwardly-extended side plates of the covering member of the conventional electrical connector are not included in the upper base, the upper base is more even and not warped during the upper base is produced by a plastic injection molding process. As the trend of designing the electrical connector is toward small size and light weightiness, the upper base of the present invention becomes more important and valuable. It is noted that the upward engaging surface and the downward engaging surface of the engaging mechanism are not restricted to those described in the above embodiments. That is, numerous modifications and alterations of the engaging mechanism may be made while retaining the teachings of the invention.
Hereinafter, an electrical connector according to a fourth embodiment of the present invention will be illustrated with reference to
Moreover, corresponding to these movable engaging pieces 33, a plurality of fastening slots 17 and a plurality of perforations 110 are formed at the edges of a lower-base top surface 1001 of the lower base 10 of the electrical connector 405.
Moreover, corresponding to the fastening slots 17 and the perforations 110, a plurality of perforations 26 are formed in the upper-base top surface 2101 of the electrical connector 405. The geometric shape of each perforation 26 is not limited to these examples. In this embodiment, the perforation 26 includes a front-segment wide part and a rear-segment narrow part, wherein the front-segment wide part and the rear-segment narrow part are in communication with each other.
In the fourth embodiment, the downward engaging surfaces 32 of the engaging mechanism are provided by these movable engaging pieces 33, and the upward engaging surface of the engaging mechanism is provided by the upper-base top surface 2101. For assembling the upper base 20 and the lower base 10, the wide part of the perforation 26 of the upper base 20 is firstly aligned with the movable engaging piece 33, and then the movable engaging piece 33 is moved from top to bottom to be inserted into a corresponding fastening slot 17 and a corresponding perforation 110 of the lower base 10. Then, the upper base 20 is moved forwardly or backwardly until the movable engaging piece 33 is engaged with the upper-base top surface 2101.
Hereinafter, an electrical connector according to a fifth embodiment of the present invention will be illustrated with reference to
During the assembling process, the clamping element 50 is moved from top to bottom to clamp the upper base 20 and the handle 70, and the pressing surface 51 is pressed on the upper base 20. The fastening part 57 is penetrated through the elongated transverse opening 215 and coupled with the cam 73 of the handle 70. The hooking parts 52 are penetrated through the transverse perforations 28 and the elongated transverse opening 215 of the upper base 20 and the recess 12 of the lower base 10. Then, two insertion pins 60 are respectively inserted into the fastening slots 14 and clasped at the position over the engaging surfaces 54 of the hooking parts 52 of the clamping element 50 and under the cam 73 of the handle 70. By the clamping element 50, the upper base 20, the handle 70 and the lower base 10 can be securely combined together. Moreover, during the handle is rotated, the cam 73 is allowed to be protruded outside the elongated transverse opening 215 of the upper base 20.
Hereinafter, an electrical connector according to a sixth embodiment of the present invention will be illustrated with reference to
Hereinafter, an electrical connector according to a seventh embodiment of the present invention will be illustrated with reference to
Hereinafter, an electrical connector according to an eighth embodiment of the present invention will be illustrated with reference to
The first coupling parts 216 are discretely arranged on and protruded from the upper-base sidewall 2103. Each of the first coupling parts 216 is an upwardly-stepped block with a recessed upward engaging surface 217. The upward engaging surface 217 is arranged between the upper-base top surface 2101 and the upper-base bottom surface 2102. In other words, the first coupling part 216 provides engaging mechanism of the electrical connector 1025 with the upward engaging surface 217.
The second coupling parts 115 are discretely arranged on and protruded from a lower-base sidewall 1003 of the lower base 10. The locations of the second coupling parts 115 correspond to the locations of respective first coupling parts 216. Each of the second coupling parts 115 is a downwardly-stepped block with a recessed downward engaging surface 116. The downward engaging surface 116 is arranged between the lower-base top surface 1001 and a lower-base bottom surface 1002.
The engaging mechanism further comprises a plurality of longitudinal elongated sheet-like movable position-limiting elements 38. Each of the movable position-limiting elements 38 comprises a plurality of separate fastening parts 35. Each of the fastening parts 35 is a fastening slot composed of a wide hole 36 and a narrow hole 37, wherein the wide hole 36 and the narrow hole 37 are in communication with each other.
During the assembling process, the first coupling part 216 of the upper base 20 is aligned with the second coupling part 115 of the lower base 10, then the movable position-limiting element 38 is moved toward the electrical connector 115 in the direction indicated as the arrow S, and then the first coupling part 216 and the second coupling part 115 are simultaneously accommodated within the wide hole 36 of the movable position-limiting element 38. Then, by moving the movable position-limiting element 38 in the direction indicated as the arrow F, the first coupling part 216 and the second coupling part 115 are engaged with the narrow hole 37. That is, since the upward and downward directions of the upper base 20 and the lower base 10 are restricted by the fastening part 35, the upper base 20 is movable forwardly or backwardly relative to the lower base 10. Moreover, since the first coupling part 216 and the second coupling part 115 are engaged with the narrow hole 37, the movable position-limiting element 38 will not be laterally detached. Moreover, since the narrow hole 37 of the fastening part 35 at the front end of the movable position-limiting element 38 also encloses a fastening block 117 of the lower base, the movable position-limiting element 38 will not be backwardly detached.
Moreover, the front end of the movable position-limiting element 38 has a chamfer angle 312. After the movable position-limiting element 38 is attached on the upper-base sidewall 2103 and the lower-base sidewall 1003, due to the chamfer angle 312, a gap is formed at this end for facilitating the user to remove the movable position-limiting element 38.
In this embodiment, since one or more coupling parts are discretely arranged on the upper-base sidewall or the lower-base sidewall, the possibility of generating the non-uniform stress or the residual stress during the plastic injection molding process of the upper base and the lower base will be minimized. Therefore, the evenness and yield of the upper base or the lower base will be increased when compared with the conventional covering member having the contiguous side plate.
From the above discussion, it is noted that if the evenness is not taken into consideration, additional structures other than the coupling parts may be disposed on the upper-base sidewall or the lower-base sidewall. Corresponding to the additional structures of the upper-base sidewall or the lower-base sidewall, the movable position-limiting element 38 may have corresponding additional structures.
In the above embodiments, the elastic inverted hook 39 is used to sustain against the fastening block 117. Alternatively, other structures of the movable position-limiting element 38 may be used to sustain against the fastening block 117.
In the above embodiments, the downward engaging surface is provided by the movable engaging piece of the engaging mechanism. During the assembling process, the movable engaging piece is fixed in the lower base, and then the upper base is engaged with the movable engaging piece. However, in some embodiments, the upward engaging surface may also be provided by the movable engaging piece.
During the assembling process, the upward engaging surface 310 of the movable engaging piece 63 is aligned with the fastening slot 212 of the upper base 20 and the perforation 110 of the lower base 10, and then the upper base 20 is moved in the direction indicated by the arrow F. Consequently, the upward engaging surface 310 is engaged with the downward engaging surface 111 of the lower base 10.
In the nineteenth embodiment, the movable engaging piece provides a movable upward engaging surface to be engaged with the downward engaging surface of the lower base. The movable upward engaging surface is located at a level not higher than the upper-base bottom surface. This design is not detrimental to the evenness of the upper base or the lower base. It is noted that the electronic connector of this embodiment further comprises other components of the above embodiments (e.g. the driving device or the clamping element).
The lower base 10 comprises a plurality of terminal slots 11, which run through the lower-base top surface 1001 and the lower-base bottom surface 1002. The terminal slots 11 are aligned with respective insertion holes 21. Each of the terminal slots 11 is used for accommodating a terminal 113. After the lower base 10 is covered by the upper base 20, the terminals 113 are electrically connected with the metal pins 804 and the ground pins 804a which are accommodated within the insertion holes 21.
The chip package 80 comprises a top surface 801, a bottom surface 802, a sidewall 803, a plurality of metal pins 804 and a plurality of ground pins 804a. The sidewall 803 is connected with the top surface 801 and the bottom surface 802. The metal pins 804 and the ground pins 804a are protruded from the bottom surface 802 and electrically connected with the terminals 113. The chip package 80 comprises a chip 805 and a supporting substrate 806. The chip 805 is mounted on the supporting substrate 806. Moreover, the chip 805 is in communication with the external medium outside the chip package 80 through the metal pins 804. The chip package 80 is a CUP chip package or a single chip package with a high operating speed. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, the chip package 80 may contain a plurality of chips, which are arranged side by side or arranged in a staked form. In this embodiment of
In comparison with the above embodiments, the upper base or the lower base of the electrical connector 2005 of this embodiment is further provided with a conduction mechanism. The conduction mechanism is used for providing a conduction path, so that a physical signal generated by a working chip 805 of the chip package 80 is transmitted to the external surroundings of the chip package 80 through the conduction path. The top surface 801 of the chip package 80 is not the start point of the conduction path of the conduction mechanism. On the other hand, the package surface excluding the top surface 801 is served as the start point of the conduction path.
Hereinafter, for illustration, the physical signal is heat and the conduction mechanism is a thermal conduction mechanism.
The thermal conduction mechanism 81 is made of metallic material. In addition, the thermal conduction mechanism 81 is disposed on the upper-base top surface 2101, the upper-base bottom surface 2102, the lower-base top surface 1001 and the lower-base bottom surface 1002, and/or within the at least one insertion hole 21 and/or within the at least one terminal slot 11. The thermal conduction mechanism 81 comprises a first thermal conduction mechanism, which is in contact with the bottom surface 802, the sidewall 803 or at least one ground pin 804a. An example of the first thermal conduction mechanism includes but is not limited to a metal plate 81a, an electrically-conductive pad (not shown), a fastener 81b or a metal article 81c. Moreover, in this embodiment, at least one part of the engaging mechanism and/or the driving mechanism is made of metallic material, thereby defining at least one thermal conduction path with the first thermal conduction mechanism.
Moreover, the thermal conduction mechanism 81 further comprises a second thermal conduction mechanism, which is not in contact with the bottom surface 802 or the sidewall 803 of the chip package 80 or not in contact with any metal pin 804 of the metal pins 804 of the chip package 80. For example, the second thermal conduction mechanism includes a thermally-conductive ring 81d, which is disposed around the first thermal conduction mechanism. By the second thermal conduction mechanism, the heat may be transferred from the metal plate 81a to the thermally-conductive ring 81d or other region contacting with the thermally-conductive ring 81d. Alternatively, in some embodiments, the second thermal conduction mechanism includes a metal wire or other heat-dissipating or cooling mechanism. Moreover, at least one thermal conduction path is established between the second thermal conduction mechanism and the first thermal conduction mechanism.
The above thermal conduction mechanisms (e.g. the metal plate 81a, the electrically-conductive pad, the fastener 81b, a metal article 81c or the thermally-conductive ring 81d) may be individually employed or collectively employed. Moreover, the above thermal conduction mechanisms (e.g. the metal plate 81a, the electrically-conductive pad, the fastener 81b, a metal article 81c or the thermally-conductive ring 81d) and the locations of installing the thermal conduction mechanisms may be adjusted according to the practical requirements. Therefore, the heat generated by the working chip package 80 can be transmitted to the external surroundings of the chip package 80 through various conduction paths.
For example, as shown in
Moreover, a metallic conductive structure or an encapsulant structure made of a material having a higher thermal conductivity than the chip package 80 may be disposed within the chip package 80 and in the vicinity of the bottom surface 802 or the sidewall 803 of the thermal conduction mechanism so as to be used as an accelerated thermal conduction mechanism 817.
In the electrical connector 2015 of the twenty-first embodiment, the metal pins 804 of the chip package 80 are in communication with a system board 89 through the electrical connector 2015. Moreover, the electrical conduction mechanism at least comprises a laminate 841 with one or more electrically-conductive layers 8411. The laminate 841 may be disposed on the upper-base top surface 2101, the upper-base bottom surface 2102, the lower-base top surface 1001 and/or the lower-base bottom surface 1002. The laminate 841 comprises a single layer of electrically-conductive layer 8411 or multiple layers of electrically-conductive layers 8411 to be used as a wiring layer, a ground layer or a power layer. A dielectric layer or an insulating layer 8412 is interposed between adjacent electrically-conductive layers 8411. Like the ordinary printed circuit board, the laminate 841 may be produced by laminating electrically-conductive layers 8411 and insulating layers 8412. In this embodiment, the electrically-conductive layer 8411 is used as a wiring layer, a ground layer or a power layer.
Moreover, the electrically-conductive layer 8411 is a metal layer. Since the metal layer is electrically conductive and has a higher thermal conductivity than the nonmetallic material, the electrically-conductive layer 8411 can be used as a thermal conduction mechanism. Hereinafter, the laminate 841 will be illustrated as an electrical conduction mechanism. However, if a proper insulating measure is made to prevent a short-circuited problem of the metal pins 804 of the chip package 80, the laminate 841 may also be used as a thermal conduction mechanism. The locations and the way of producing the conduction path are similar to those of the twentieth embodiment, and are not redundantly described herein.
Moreover, in this embodiment, the laminate 841 is a printed circuit board. Therefore, the technology associated with the through-hole, the blind hole or the buried hole used in the conventional printed circuit board may be applied to the electrical connector of the present invention to be used as an electrical conduction mechanism. For example, an electrical connection structure (e.g. an electrically-conductive through-hole, an insulating through-hole, an electrically-conductive blind/buried hole, an insulating blind/buried hole or the combination of different holes) may be employed to transmit electrical signal or receive the metal pins 804 (or metallic grab hooks or metallic terminals). According to diversified requirements, different types of metal pins 804 of the chip package 80 are connected to different media. For example, the ground pin is in communication with a ground layer, the power pin is connected with a power layer, and the signal pin is partially interconnected with or in communication with the system board. According to diversified requirements, the laminate 801 provides an electrical conduction path. That is, through the electrically-conductive through-hole, the insulating through-hole, the electrically-conductive blind/buried hole or the insulating blind/buried hole, the electrical conduction path can be connected with the metal pins 804. In such way, the chip package 80 can be in communication with the electrical connector and/or the system board 89.
Moreover, through an additional electrical conduction mechanism installed on the upper base 20 and/or the lower base 10, the signal issued from the system board 89 may be transmitted to the trace pattern or the electrically-conductive layer 8411 of the laminate 841. As mentioned above, since the electrically-conductive layer 8411 of the laminate 841 may be used as a ground layer or a power layer, the ground layer or the power layer that is originally installed on the system board 89 may be changed to the surface of the upper base 20 and/or the lower base 10 of the electrical connector of the present invention. In such way, the number of layers of the system board 89 is decreased, and the fabricating cost of the system board 89 is reduced.
From the above discussions, the laminate 841 of the printed circuit board provides a plurality of electrical conduction paths. Therefore, other electronic components, active/passive electronic components, active/passive electronic structures, electromagnetic interference (EMI) protection elements or electrostatic discharge (ESD) protection elements may be received in or disposed on the laminate 841. In this embodiment, an active/passive electronic component (e.g. a capacitor 82 and an inductor 83) is received in the laminate 841. Through the laminate 841, the chip package 80 and/or the system board 89 may be in communication with the capacitor 82 and the inductor 83. Moreover, since a wiring layer may be included in the laminate 841, the cooperation of the electrically-conductive layer 8411 and the electrically-conductive through-hole, the insulating through-hole, the electrically-conductive blind/buried hole, the metal pin, the metallic grab hook or the metallic terminal may facilitate forming the electronic component or the electronic circuit or the active/passive electronic circuit in the electrical connector. Especially, the the electronic component or the electronic circuit or the active/passive electronic circuit may be formed at the location under the chip package 80 or at the location below and adjacent to the chip package 80
Moreover, in a case that a transient power is possibly needed during operation of the chip package (e.g. a CPU chip package or any other digital IC device), a bypass capacitor is usually employed to provide the transient power to the digital IC device. In this embodiment, a bypass capacitor may be installed on the laminate 841 and then covered by a smoothing layer 8413, so that the bypass capacitor is close to the chip package 80. That is, through the electrical conduction path provided by the laminate 841, the chip package 80 and the system board 89 may be in communication with the electronic components, the active/passive electronic components or the active/passive electronic structures of the laminate 841.
From the above discussions, the region under the chip package 80 may be fully utilized to mount other electronic components or active/passive electronic components or active/passive electronic structures. Therefore, the working path of the chip package is optimized, and the flexibility of selecting the layout space of mounting other electronic components or active/passive electronic components or active/passive electronic structures will be enhanced.
Moreover, various types of electrical conduction structures may be employed. An example of the electrical conduction structure includes but is not limited to a wiring layer of the laminate, a wire, a thermally-conductive pad, any other thermally-conductive terminal, a thermally-conductive driving device, a metal substrate or a metallic fastener. Moreover, the electrical conduction structure may be disposed on a proper location of the upper base, the lower base or the laminate. For example, the electrical conduction structure may be disposed on the electrically-conductive through-hole, the insulating through-hole or the electrically-conductive blind/buried hole, an edge of the upper base or the lower base, the insertion hole or terminal slot. In addition, the electrical conduction structure may be in communication with the metal pins of the chip package, the thermally-conductive layer of the laminate or the system board.
From the above description, by means of the cooperation of the electrical conduction structure and the laminate 841, the signal communication between the chip package 80 and the electrical connector and the signal communication between the chip package 80 and the system board 89 can be established. In other words, the electrical conduction mechanism additionally installed on the upper base 20 and/or the lower base 10 may further comprises a first electrical conduction mechanism and a second electrical conduction mechanism. The first electrical conduction mechanism is in contact with the bottom surface 802 of the chip package 80 or the metal pins 804 of the chip package 80. The second electrical conduction mechanism is disposed on a location of the electrical connector which is not in contact with the chip package 80 (for example in the laminate 841). Moreover, an electrical conduction path is established between the second electrical conduction mechanism and the first electrical conduction mechanism, so that two or three of the chip package 80, the electrical connector and the system board 89 may be in communication with each other.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Number | Date | Country | Kind |
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099122249 | Jul 2010 | TW | national |
099134352 | Oct 2010 | TW | national |