This application claims the priority benefit of Chinese Patent Application No. 202211283044.0 filed on Oct. 19, 2022, in the China National Intellectual Property Administration, the whole disclosure of which is incorporated herein by reference.
Embodiments of the present disclosure generally relate to the field of data communication, and more specifically, to an electrical connector capable of effectively reducing the differential impedance at the solder balls during high-speed signal transmission.
With the development of digital information technology, the amount of data transmitted is increasing day by day. For example, in the field of communication, high-speed connectors are required to achieve high-speed signal transmission of at least 112 Gbps. Since data transmission often needs to connect different electrical devices or interfaces through an electrical connector, the signal transmission speed and quality of the electrical connector will greatly affect the speed and stability of data transmission. For example, an electrical connector can be used to make an electrical connection between two printed circuit boards (PCBs).
Applicable electrical connectors usually include conductive terminals installed in an insulation housing and adapted to contact or clamp mating components to provide electrical connections. The conductive terminals include a plurality of ground terminals, a plurality of signal terminals, etc. The plurality of ground terminals are usually connected together through a conductive housing or a conductive layer to provide shielding for the signal terminals. In some conventional technologies, the ground terminals are connected through a conductive housing with a concave-convex structure. When the ground terminals are assembled into the conductive housing, the friction force is very large. This may scratch the metal plating on the conductive housing, causing the risk of disconnection. Further, internal stress generated at the same time will act on the insulation housing, aggravating the warping of the insulation housing during the over-reflow process, which is not conducive to soldering the connector onto the circuit board.
According to an embodiment of the present disclosure, an electrical connector includes an insulation housing, a conductive housing assembled to the insulation housing, a plurality of conductive terminals installed within both the insulation housing and the conductive housing, and a spacer. The plurality of conductive terminals include a plurality of ground terminals in contact with the conductive housing to electrically connect the plurality of ground terminals together. The spacer is connected to the insulation housing such that the conductive housing is positioned between the insulation housing and the spacer. The spacer is formed with a clamping structure adapted to clamp the conductive housing and the ground terminals together.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art.
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
As shown
As shown in the figures, the electrical connector 100 includes an insulation housing 110 having opposite first and second sides, and an array of a plurality of conductive terminals 120 installed within the insulation housing. Each conductive terminal 120 has a main body segment, and a contact segment 1201 and a solder segment 1202 respectively extending in opposite directions from opposite ends of the main body segment. The contact segment 1201 is at least partially exposed from the first side of the insulation housing 110, for making an electrical contact with a conductive terminal of a mating connector (not shown). The solder segment 1202 is at least partially exposed from the second side of the insulation housing 110. The electrical connector 100 further includes a plurality of solder balls 130. Each solder ball 130 is connected to the solder segment 1202 of a corresponding conductive terminal 120, for making an electrical connection, such as electrical contact or soldering, to a circuit board (not shown).
As shown in
In some embodiments, the plurality of conductive terminals 120 may be arranged in multiple columns within the insulation housing 110. For example, the electrical connector 100 may include a hybrid connector, for instance, the plurality of conductive terminals 120 installed in the insulation housing 110 may also include a plurality of ground terminals 121, a plurality of signal terminals 122 and a plurality of power terminals 123. A plurality of columns of the ground terminals 121 and a plurality of columns of the signal terminals 122 may be arranged within a central region 101 of the electrical connector 100. A plurality of columns of the power terminals 123 may be arranged in an edge region 102 of the electrical connector, as shown in
In some examples, as shown in
According to an embodiment of the present disclosure, the electrical connector 100 further includes a spacer 140 disposed on the second side of the insulation housing. The spacer 140 includes solid parts positioned between adjacent solder balls 130 to circumferentially surround each solder ball 130 and space the solder balls 130 apart from each other. The spacer 140 comprises a dielectric or insulating member, for example, made of a dielectric material with a dielectric constant greater than the air, such as a plastic sheet or other dielectric material plates. Accordingly, presence of this spacer can effectively reduce the differential impedance of the coupling at the solder balls during high-frequency signal transmission, making signal transmission more stable, and meeting the requirements of at least 112 Gbps high-speed signal transmission.
In an embodiment of the present disclosure, as shown in
As shown in
As an example, the conductive housing 150 may be formed by Physical Vapor Deposition (PVD) technology or Moulded Interconnect Device (MID) technology and assembled on the insulation housing 110. Here, the MID technology refers to the technology of manufacturing or installing the components with electrical functions on the surface of the injection-molded plastic housing, so as to combine the electrical interconnection function of the components and the mechanical support function of the plastic housing. Of course, in other embodiments, other technologies that can metalize the plastic surface may also be used to form the conductive housing over the insulation housing.
In an exemplary embodiment, as shown in
In some examples, the spacer 140 may abut against the first frame-shaped body 111 and/or the first partition wall 113 of the insulation housing 110. In some embodiments, as shown in
According to an exemplary embodiment of the present disclosure, as shown in
For example, the ground terminal 121 may be held at least partially in planar contact with the conductive housing 150 by the clamping structure 145, so that there is no need to provide an additional concave-convex structure on the conductive housing to hold the ground terminals. This avoids damage to the ground terminals or the conductive layer of the conductive structures caused by excessive friction force of assembling the ground terminals, thereby avoiding the risk of disconnection and also avoiding the internal stress caused by excessive friction force on the insulation housing. This also prevents or reduces the warping or deformation of the insulation housing in the reflow process.
In the embodiment shown in
As an example, the clamping structure may include a protrusion (e.g., a cylinder liking a quadrangular prism or a polygonal cylinder) extending from the main body of the spacer 140 (e.g., from the side of the spacer facing the conductive housing 150 or the insulation housing 110) toward the conductive housing 150. The protrusion may be extended or inserted into the conductive housing. In some examples, at least a portion of a surface of at least one clamping structure in the adjacent pair of clamping structures facing the ground terminal 121 is a flat face that abuts against the surface of the ground terminal 121 to press the ground terminal 121 against the conductive housing 150 (for example, against the side of the second partition wall 152 of the conductive housing 150). By way of example, at least one of two opposite sides of the second partition wall 152 has a flat portion that can make planar contact with the ground terminal 121. Alternatively or additionally, a protruding structure for installation of the ground terminal may also be formed on the side face of the second partition wall.
As shown in
As shown in
In some embodiments, as shown in
In some embodiments, as enlarged in
In some embodiments, the spacer 140 and the insulation housing 110 are assembled together so that they are fixed relative to each other, to firmly hold the conductive terminals and the conductive housing. For example, the spacer 140 and the insulation housing 110 are detachably connected to each other. As an example, one of the spacer and the insulation housing may be formed or provided with a fastening structure while the other is formed with a connection hole in which the fastening structure is assembled to secure the spacer and the insulation housing together.
In the embodiment shown in
As an example, the fastening structure 114 may be formed or provided at an edge position of the second side or surface of the insulation housing 110, and the connection hole 144 is formed at a corresponding edge position of the spacer 140, to facilitate the engagement therebetween.
The fastening structure 114 may be integrated with the insulation housing 110, or be formed individually and installed to the insulation housing. For example, in some examples, the insulation housing 110 is initially formed a pillar body at the edge position or other appropriate positions. After assembling the spacer 140 into the insulation housing 110, the pillar body is inserted into the connection hole 144 formed within the spacer. Then, a part of the pillar body on the side of the connection hole 144 facing away from the insulation housing 110 is melted through thermal riveting or hot melt, to form a large-diameter disk-like part or head 1142 so as to fix the spacer to the insulation housing.
In other examples, as shown in
As shown in
Additionally or alternatively, the spacer and the insulation housing may also be fixedly or detachably connected or assembled together with each other by fasteners. For example, suitable fasteners may include fixtures, screws, or other threaded connections, but the present disclosure is not limited thereto.
As shown in
In addition, those areas in which it is believed that those of ordinary skill in the art are familiar, have not been described herein in order not to unnecessarily obscure the invention described. Accordingly, it has to be understood that the invention is not to be limited by the specific illustrative embodiments, but only by the scope of the appended claims.
It should be appreciated for those skilled in this art that the above embodiments are intended to be illustrated, and not restrictive. For example, many modifications may be made to the above embodiments by those skilled in this art, and various features described in different embodiments may be freely combined with each other without conflicting in configuration or principle.
Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.
As used herein, an element recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of the elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property.
Number | Date | Country | Kind |
---|---|---|---|
202211283044.0 | Oct 2022 | CN | national |