The disclosure relates to a technological field of a connector, particularly to a connector.
A connection between a cable and a connector is usually implemented by a printed circuit board (PCB) or in a manner of soldering directly. Under the conditions of increasing transmission speed and decreasing overall sizes, how to reduce variation of characteristic impedance is an issue being researched.
A related-art connector usually uses a PCB to serve as an intermediate element. It is limited by the conditions of the art, the adjustment to the characteristic impedance is restrained. Also, if impedance matching is not implemented to remove reflection and reduce wave distortions, such as ringing, overshoot, and undershoot, etc., to guarantee the signal integrity of signals, the impedance variation may be excessive to worsen the signal integrity.
An object of the disclosure is to provide a connector, which uses a ground assembly to undistortedly implement high-speed transmission of digital signals.
To accomplish the above object, the connector of the disclosure includes multiple ground terminals, multiple signal terminals, a cable and a ground assembly. The cable includes multiple ground wires and multiple signal wires. The ground assembly includes a plate and multiple protrusion structures. Each protrusion structure is arranged spacedly and extended from the plate. A top of each protrusion structure is higher than a surface of the plate. Each ground wire is electrically connected with each ground terminal and each protrusion structure. Each signal wire is electrically connected with each signal terminal. Each signal wire is formed between any two of the protrusion structures adjacent to each other.
The disclosure further has the following functions. The interference of the signal transmission of each signal wire and each signal terminal may be reduced by arranging the insulator and the recess to adjust the characteristic impedance. The interference of the signal transmission of each signal wire and each signal terminal may be reduced by arranging the opening on the plate to adjust the characteristic impedance.
In view of this, the inventors have devoted themselves to the abovementioned related art, researched intensively and cooperated with the application of science to try to solve the abovementioned problems. Finally, the disclosure which is reasonable and effective to overcome the above drawbacks is provided.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
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The upper plate 41 is pressed to be formed with multiple upper protrusion structures 411. In the embodiment, the upper protrusion structures 411 are three in number. The upper protrusion structures 411 are arranged spacedly. Each upper protrusion structure 411 is approximately a rectangular sheet. A side of the upper protrusion structure 411 is extended from the upper plate 41, and the other three sides are separated from the upper plate 41. A top of each protrusion structure 411 is higher than a surface of the upper plate 41. Similarly, the lower plate 42 is pressed to be formed with multiple lower protrusion structures 421 corresponding to the upper protrusion structures 411 of the upper plate 41. Each lower protrusion structure 421 is the same as the upper protrusion 411 in shape and pattern.
Furthermore, apart from the abovementioned shape, the ground assembly 40 may also have an H-shaped or a Z-shaped cross section (not shown).
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Furthermore, a recess 51 is formed on the insulator 50 located between any two of the conducting surfaces 412 adjacent to each other. The shape of the recess 51 may be a polygon. In the embodiment, the shape of the recess 51 is a rectangle. The recess 51 is used to adjust the characteristic impedance of the signal terminals 20, especially the characteristics of reactance for capacitors and inductors. A width, length and depth of the recess 51 may be varied according to the needs. The signal terminals 20 has the smallest impedance when the recess 51 is fully filled. The signal terminals 20 has the largest impedance when the recess 51 penetrates through two opposite sides (that is, the insulator 50 between any two of the protrusion structures 411 adjacent to each other and located on the upper plate 41 is carved out.).
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Each signal terminal 20 includes a conducting section 21, a fixing section 22 extended from the conducting section 21 and an abutting section 23 extended from the fixing section 22. The abutting section 23 is away from the conducting section 21 and is formed at an end of the fixing section 22.
Each ground terminal 10 and each signal terminal 20 are arranged spacedly. An insulative seat 14 is formed on the fixing sections 12, 22 by injection coating manner. There are two insulative seats 14 in the embodiment. Each insulative seat 14 is provided with three ground terminals 10 and four signal terminals 20. The three ground terminals 10 are separately arranged at the first, fourth and seventh positions and the four signal terminals 20 are separately arranged at the second, third, fifth and sixth positions.
There are two cables 30 in the embodiment. Each cable 30 includes two ground wires 31 and two signal wires 32. The two ground wires 31 are located outside the two signal wires 32. Each ground wire 31 has a core line 311. Each signal wire 32 also has a core line 321. In addition, each cable 30 may only include one ground wire 31 and one signal wire 32.
When assembling, the inside of each insulative seat 14 abuts against the intermediate plate 43 of the ground assembly 40 and a front end of the insulator 50. Each cable 30 is placed at an end of the insulator 50, which is located away from the insulative seat 14. The conducting section 11 of each ground terminal 10 is separately mounted (lapped) on each conducting surface 412, 422 and the core line 311 of each ground wire 31 is separately mounted (lapped) on the conducting section 11 of each ground terminal 10. The conducting section 21 of each signal terminal 20 straddles over each recess 51 for the core line 321 of each signal wire 32 to be mounted. The conducting section 21 is soldered by a soldering process to complete the electric connection.
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Furthermore, the opening 413 of the embodiment is arranged corresponding to the recess 51 in position and formed under the junction of the conducting section 21 of the signal terminal 20 and the core line 321 of the signal wire 32. The opening 413 may be greater than, equal to or less than the recess 51 in size.
In addition, the upper plate 41 may be formed with the opening 413 when the insulator 50 does not have the recess 51 (that is, being filled), such that the characteristic impedance may still be adjusted.
Similarly, the lower plate 42 may also be formed with multiple openings 423 to obtain the same effect.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
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Office Action dated Aug. 9, 2021 of the corresponding Taiwan patent application No. 109141162. |
Number | Date | Country | |
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20220166168 A1 | May 2022 | US |