This application claims priority to Chinese Application No. 201610059038.5, filed Jan. 28, 2016, which is incorporated herein by reference in its entirety.
The present disclosure relates to an electrical connector, and more specifically relates to an electrical connector with soldering wires.
Generally, an electrical connector with soldering wires, for example, as disclosed in Taiwan patent TW575256U, because a location where a wire and a terminal of the electrical connector are soldered is exposed to air, and a dielectric coefficient of air is less than a dielectric coefficient of an insulating body, therefore a higher impedance is produced at the joint and affects the performance of the signal transmission.
Therefore, an object of the present disclosure is to provide an electrical connector which can reduce an impedance of a location where a wire and a terminal are soldered.
Accordingly, in some embodiments, an electrical connector of the present disclosure comprises an insulative housing, a plurality of terminals and a plurality of wires. The plurality of terminals are fixed to the insulative housing, each terminal has a fixed portion fixed to the insulative housing and a contact portion and a soldering portion which are connected to the fixed portion, the soldering portion of each terminal of at least a part of the plurality of terminals is formed with a bending section, and an inner surface of the bending section defines a filling space for filling a solder. The plurality of wires are respectively soldered to the soldering portions of the plurality of terminals and make the solder filled in each filling space.
In some embodiments, the soldering portion of each terminal is plate-like. In some embodiments, each filling space is fully filled with the solder. In some embodiments, each wire is soldered to the first surface of the corresponding soldering portion.
In some embodiments, the soldering portion of each terminal has a first surface and a second surface which are respectively positioned at opposite sides and two side surfaces, one side surface connects one side of the first surface and one side of the second surface, the other side surface connects the other side of the first surface and the other side of the second surface, and the first surface is the inner surface of the bending section.
In some embodiments, each wire is soldered to the first surface of the corresponding soldering portion, and the wire soldered to the soldering portion formed with the bending section extends across the filling space of the corresponding bending section. In some embodiments, the plurality of terminals are arranged so that the side surfaces of the soldering portions of the plurality of terminals face each other and are spaced apart from each other.
In some embodiments, the plurality of terminals are arranged so that the side surfaces of the soldering portions of one part of the plurality of terminals face each other and are spaced apart from each other in a first row, and the side surfaces of the soldering portions of the other part of the plurality of terminals face each other and are spaced apart from each other in a second row, the second row is parallel to the first row.
In some embodiments, the soldering portion of each terminal is formed with the bending section. In some embodiments, the two soldering portions of the two adjacent terminals each are formed with the bending section, and the two bending sections of the two adjacent terminals each are formed with a protruding block so that the two adjacent protruding blocks protrude relative to each other.
In some embodiments, each terminal of one part of the plurality of terminals is a signal terminal, each terminal of the other part of the plurality of terminals is a ground terminal, the soldering portion of each signal terminal is formed with the bending section. In some embodiments, the plurality of terminals are a pair of signal terminals and two ground terminals respectively positioned at both sides of the pair of signal terminals.
In some embodiments, the plurality of terminals are two pairs of signal terminals and three ground terminals respectively positioned between the two pairs of signal terminals and both sides of the two pairs of signal terminals. In some embodiments, the plurality of terminals are defined as an arrangement of alternate signal terminal and ground terminal.
Other characteristics and effects of the present disclosure will be apparent through detailed description of embodiments with referring to the Figures, and in which:
Before the present disclosure is described in detail, it should be noted that similar element is indicated by the same reference numeral in the following description. As can be appreciated, the present disclosure has the following effect: the conducting area on each of both side surfaces of the soldering portion can be increased via the soldering area formed by the solder being filled in the filling space of the soldering portion, thereby increasing the capacitance effect and in turn reducing the impedance. In addition, the wire and the terminal can have improved soldering strength.
Referring to
The plurality of terminals 2 are fixed to the insulative housing 1 side by side. Each terminal 2 has a fixed portion 21 fixed to the insulative housing 1 and a contact portion 22 and a soldering portion 23 which are connected to the fixed portion 21. The contact portion 22 extends into the slot 111. The soldering portion 23 extends out of the rear cover 12, and comprises a first surface 232 and a second surface 233 which are respectively positioned at opposite sides and two side surfaces 231, one side surface 231 connects one side of the first surface 232 and one side of the second surface 233 and the other side surface 231 connects the other side of the first surface 232 and the other side of the second surface 233. The soldering portion 23 of each terminal 2 of at least a part of the plurality of terminals 2 is formed with a bending section 234, and an inner surface of the bending section 234 defines a filling space 235 for filling a solder 4. In the embodiment, the soldering portion 23 is plate-like which is easier to bend to form the bending section 234 and thus has the larger inner surface to carry a solder 4, and the first surface 232 is the inner surface of the bending section 234. In the embodiment, the soldering portion 23 of each terminal 2 of the plurality of terminals 2 is formed with the bending section 234, however in other embodiments, only the soldering portion 23 of each terminal 2 of a part of the plurality of terminals 2 may be formed with the bending section 234 (as shown in
Also referring to
The plurality of terminals 2 can define a footprint according to transmission specifications of the electrical connector. For example, referring to
Referring to
Referring to
In the above embodiments, the plurality of terminals 2 are arranged so that the side surfaces 231 of the soldering portions 23 of the plurality of terminals 2 face each other and are spaced apart from each other, however in a modified implementation, the plurality of terminals 2 also may not be arranged side by side in the same plane, for example, referring to
In conclusion, the conducting area on each of both side surfaces 231 of the soldering portion 23 can be increased via the soldering area formed by the solder 4 being filled in the filling space 235 of the soldering portion 23, thereby increasing the capacitance effect and in turn reducing the impedance, and the wire 3 and the terminal 2 have a better soldering strength.
The above described contents are only the embodiments of the present disclosure, which cannot limit the scope of the implementation of the present disclosure, namely simple equivalent variations and modifications made according to the claims and the content of the present disclosure are still fallen within the scope of the present disclosure.
Number | Date | Country | Kind |
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2016 1 0059038 | Jan 2016 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
5293177 | Sakurai | Mar 1994 | A |
5451174 | Bogursky | Sep 1995 | A |
5762526 | Kuramoto | Jun 1998 | A |
5879206 | Badgley | Mar 1999 | A |
5967833 | Cachina | Oct 1999 | A |
6039616 | Pereira | Mar 2000 | A |
6773293 | Lee | Aug 2004 | B1 |
7435132 | Fong | Oct 2008 | B1 |
7534143 | Tsao | May 2009 | B1 |
9130312 | Wu et al. | Sep 2015 | B2 |
20040058587 | Huang | Mar 2004 | A1 |
20080009204 | Wei | Jan 2008 | A1 |
20100105256 | Lyford | Apr 2010 | A1 |
20160254620 | O'Young | Sep 2016 | A1 |
Number | Date | Country |
---|---|---|
2454921 | Oct 2001 | CN |
2458760 | Nov 2001 | CN |
2552173 | May 2003 | CN |
2660712 | Dec 2004 | CN |
2814703 | Sep 2006 | CN |
200990433 | Dec 2007 | CN |
201207469 | Mar 2009 | CN |
202906120 | Apr 2013 | CN |
M468064 | Dec 2013 | TW |
Number | Date | Country | |
---|---|---|---|
20170302030 A1 | Oct 2017 | US |