Electrical contact for LGA and BGA electrical packages

Information

  • Patent Grant
  • 6585535
  • Patent Number
    6,585,535
  • Date Filed
    Tuesday, January 9, 2001
    23 years ago
  • Date Issued
    Tuesday, July 1, 2003
    21 years ago
Abstract
An electrical contact and electrical connector are provided for use in connecting a circuit board with an electrical module. The connector includes a socket and contact assembly that are solderably secured to the circuit board. A retention clip is removable snapped on the socket to retain an electrical module within the socket and in electrical communication contact with the contacts, thereby interconnecting the electrical module with the circuit board. The retention clip is removable to permit replacement of the module. The electrical contact includes a solder member mounted to a shorting member to permit the contact to be solderably connected to the printed circuit board, while permitting a non-soldered connection between the module and the socket. The contact includes an upper interface that is biased in a manner to form a shorted electrical path between the module and circuit board when the module is biased downward onto the contact.
Description




CROSS REFERENCE TO RELATED APPLICATIONS (IF APPLICABLE)




STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH & DEVELOPMENT (IF APPLICABLE)




BACKGROUND OF THE INVENTION




The preferred embodiments of the present invention generally relate to electrical contacts and connectors for use with electronic packages or modules having leads arranged in a ball grid array (BGA) or a land grid array (LGA).




Electronic packages or modules with leads arranged in BGA or LGA configurations have been proposed in the past having relatively low vertical profiles to conserve space within an electronic assembly. Conventional packages and modules have been surface mounted directly to a circuit board in a soldering process wherein the leads are solder bonded to a corresponding array of circuit pads on the board. However, directly soldering electronic packages and modules to a circuit board has the drawback that the package is not easily removable for replacement or upgrade.




Connectors have been proposed in the past for removably mounting an electronic package or module on a circuit board. At least one conventional connector configuration comprises a flat dielectric housing which resides between the electronic package and the circuit board. The dielectric housing has an array of cavities in which are disposed electrical contacts arranged in correspondence with the array of leads of the electronic package. The contacts in the connection have ends projecting beyond the surfaces of the connector housing. When the electronic package or module is mounted on the connector, each contact has one end engaging the electronic package, while the other end engages a circuit pad on the circuit board. Compression forces are applied to the electronic package to assure firm engagement with the ends of the contacts. By way of example, the compression forces may be applied through pressure plates fastened together to sandwich the package, connector and circuit board therebetween.




Modem electronic components are designed with strict emphasis on their horizontal and vertical profiles. In certain applications, such as in laptop computers, cell phones, personal digital assistants, palm pilots and the like, a significant effort is made to minimize the vertical profile. Thus, it is desirable to maximize the working range within the height of a connector.




Conventional connectors for electronic packages are typically mounted to a printed circuit board via through holes. The sockets are located above plated round holes extending through the board, through which solder is inserted to mount the socket to the printed circuit board. In the more recent past, it has become desirable to surface mount connectors to printed circuit boards. Surface mounted sockets are not secured via through holes to the printed circuit board, but instead may be secured via bolts or other latching mechanisms to the board. As circuit designs become smaller, the vertical height of the connector becomes a greater concern. Conventional connectors have presented overall heights that are taller than desired for certain applications. The overall height of existing connectors is partially determined by the configuration of the contacts used therein.




In addition, existing connectors present a longitudinal and lateral envelope slightly larger than the size of the electronic package or module included within the connector. As circuit designs become smaller, it becomes more desirable that the longitudinal and lateral envelope of the connector not unduly exceed similar dimensions of the electronic module or package.




Conventional connectors include a socket and a cover mounted thereon to enclose the electronic module or package. Conventional covers are secured to the socket by a mechanism requiring a screwdriver to unscrew or pop the cover loose. Conventional latching mechanisms securing the cover to the socket add to the envelope of the connector, either in the vertical profile and/or in the longitudinal and/or lateral directions. It is desirable to minimize the increase in the connector envelope due to the cover latch.




Further, modem electrical equipment operates at very high switching frequencies, thereby giving rise to significant self inductance effects which may interfere with proper equipment operation. Self inductance may be reduced by reducing the length of a circuit path through a contact. However, it is also desirable to provide adequate length to a contact to permit deflection of the contact without deformation thereof and without degrading the biasing characteristics of the contact. In order to address the above-noted problems, contacts have been proposed with spring arms for deflection compliance and with shorting arms which interconnect free ends of the spring arms to provide a shortened current path through the contact. An example of one such contact is in U.S. Pat. No. 5,653,598. The contact configuration described in the '598 patent constitutes a compression mount, whereby the contacts are not soldered to the circuit board or to the electrical package. Thus, the contact configuration of the '598 patent forms a separable interface through the use of non-soldered interconnections. The contacts of the '598 patent utilize gold plating on the circuit board and on the electrical package to achieve adequate electrical connection characteristics therebetween.




However, in certain circumstances, it may be desirable to avoid or limit the use of gold plating on the circuit board and on the electronic package since gold may be overly expensive for certain applications. Therefore, an improved contact configuration is desirable which reduces the usage of gold to achieve satisfactory electrical connection characteristics, while enabling electronic packages to be easily removed without unsoldering such packages.




A need remains for all improved contact configuration that satisfies the above-discussed needs and that addresses other considerations that will be apparent from the following description and drawings.




BRIEF SUMMARY OF THE INVENTION




An electrical connector is provided in connection with at least one preferred embodiment of the present invention for electrically engaging an electronic module with a circuit board. The connector includes a socket having a base adapted to receive the module. The socket includes a plurality of board locking members mounting the socket to the circuit board. The socket also includes a plurality of contact cavities. Contacts are securely fixed in the contact cavities with each contact having a first engaging surface for electronically engaging the module and having a second engaging surface for electronically engaging the circuit board. A retention clip is removably secured to the socket and is configured to sandwich the module between the clip and socket with a predetermined amount of force. The socket may include end and side walls and a configuration of support ribs interconnecting the end and side walls. The socket and retention clip have a locking assembly interconnecting the retention clip and socket. The retention clip includes at least one biasing member abutting against and biasing the electronic module downward against the socket when the retention clip is secured to the socket. The biasing member provides sufficient force to bias the contacts until the first and second engaging surfaces are interconnected along a shortened circuit path.




According to at least one preferred embodiment, the biasing member includes a plurality of fingers mounted to the retention clip. The fingers project downward toward the socket with a predetermined amount of force. The fingers press against the module when the retention clip is secured to the socket. In an alternative embodiment, the biasing member includes fingers integrally formed with a top surface of the retention clip. The fingers bend downward into a cavity defined between the retention clip and socket, wherein the cavity receives the module. In accordance with an alternative embodiment, the biasing member includes fingers integrally formed with the side and end walls. The fingers are bent inward to project toward and forcibly engage the module. The biasing members maintain the engaging surfaces on the contacts in electrical communication with the module.




In accordance with at least one alternative embodiment, the clip/socket locking assembly includes locking protrusions mounted on opposite ends of the retention clips and opening in opposite ends of the retention clip. The locking protrusions are snappingly secured into the openings to secure the retention clip to the socket. The locking assembly includes opposed clips mounted on the socket. The clips snappingly engage opposed walls of the retention clip. The retention clip includes end walls integrally formed with the support ribs. The support ribs bias the end walls inward toward one another to snapably engage the socket. The end walls are bent outward to release the socket.




In accordance with one embodiment, the socket includes standoffs mounted on a bottom surface of the socket. The standoffs have predetermined lengths that maintain a minimum distance between the socket and the circuit board to prevent the contacts from being crushed when the socket is mounted on the circuit board.




In accordance with one embodiment, the board locking members include a plurality of barb locks projecting downward from the socket. The board locks include retention barbs on a periphery thereof forming an interference fit with corresponding openings in the circuit board. The socket has board lock housings extending outward from opposite sides of the socket. The board lock housings frictionally retain the board locking members. The locking assembly may include a slot between the socket and retention clip to receive a tool to release the retention clip from the socket. The socket may include end and side walls to laterally and longitudinally locate the module in a desired position relative to the contacts. The socket may also include keys shaped to mate with corresponding cutouts in the module. The keys insure proper orientation and positioning of the module.




In accordance with yet another alternative embodiment, an electrical contact is provided for use in a connection between a circuit board, a socket and a module retained in the socket. The contact includes a base shorting member having side walls and front and rear ends. The shorting member is adapted to be securely mounted in the socket. The contact further includes an upper interface having a spring arm connected to, and biased upward from, the base shorting member. The upper interface has an upper end adapted to electronically engage the module. A solder member is mounted to, and extends downward from, the base shorting member. The solder member is adapted to be soldered to the circuit board.




In accordance with at least one embodiment, the base shorting member, upper interface and solder member are aligned in a common plane. The base shorting member, upper interface and solder member may be formed integrally with one another and may be aligned to form a general planar contact body.




In accordance with at least one alternative embodiment, the front end of the base shorting member has a first lobe and the upper end of the upper interface has a second lobe. The first and second lobes may be aligned to engage one another to form a shorted electrical path therebetween when the upper interface is deflected toward the base shorting member. The front end of the base shorting member and the upper end of the upper interface may have chamfered edges aligned with one another to form a shorting electrical connection therebetween when the upper interface and base shorting member are bent toward one another. The upper interface may be formed to angularly diverge from the base shorting member as they extend away from one another when in an unbiased state.




In accordance with one embodiment, the solder member may include a J-shaped lead having outer and inner ended portions interconnected through an intermediate portion. The inner end is electrically connected to the shorting base member at an intermediate point along a length of the shorting base member. The outer end of the solder member may be adapted to be received within a volume of solder connecting the solder member to the circuit board. The solder wicks upward, during a solder reflow operation, along the outer end portion of the solder member. The solder member, and in particular the outer end portion, may have a length determined, in part, by the volume of solder used to prevent excess wicking along the solder member. The solder member, and in particular the intermediate portion, may have a length that is determined, in part, based on a difference between coefficients of thermal expansion of the circuit board and the socket. The intermediate portion and more generally the solder member as a whole preferably has sufficient length to permit relative movement between the socket and circuit board due to different coefficients of thermal expansion of the socket and circuit board. The intermediate portion flexes as the socket and circuit board expand and contract without cracking the solder.











BRIEF DESCRIPTION OF THE DRAWINGS




The foregoing summary, as well as the following detailed description of the preferred embodiments of the invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the preferred embodiments of the present invention, there is shown in the drawings embodiments which are presently preferred. It should be understood, however, that the present invention is not limited to the precise arrangements and instrumentality shown in the attached drawings.





FIG. 1

illustrates a perspective view of an electrical connector corresponding to a preferred embodiment of the present invention.





FIG. 2

illustrates a cross-sectional view taken along line


2





2


in FIG.


1


.





FIG. 3

illustrates a perspective view of a socket formed in accordance with a preferred embodiment of the present invention.





FIG. 4

illustrates a top plan view of a socket formed in accordance with the preferred embodiment of the present invention.





FIG. 5

illustrates a bottom plan view of a socket formed in accordance with a preferred embodiment of the present invention.





FIG. 6

illustrates a side view of a board lock formed in accordance with a preferred embodiment of the present invention.





FIG. 7

illustrates a side view of a socket formed in accordance with a preferred embodiment of the present invention.





FIG. 8

illustrates an exemplary module used with an electrical connector formed in accordance with the preferred embodiment of the present invention.





FIG. 9

illustrates a top view of a channel cut in a socket in accordance with a preferred embodiment of the present invention.





FIG. 10

illustrates a cross-sectional view of a contact taken along lines


10





10


in

FIG. 4

formed in accordance with a preferred embodiment of the present invention.





FIG. 11

illustrates a top plan view of an electrical connector and module formed in accordance with a preferred embodiment of the present invention.





FIG. 12

illustrates a perspective view of a retention clip formed in accordance with a preferred embodiment of the present invention.





FIG. 13

illustrates top plan view of a retention clip formed in accordance with a preferred embodiment of the present invention.





FIG. 14

illustrates a side view of a retention clip formed in accordance with a preferred embodiment of the present invention.





FIG. 15

illustrates a perspective view of a locking mechanism used in connection with a preferred embodiment if the present invention.











DETAILED DESCRIPTION OF THE INVENTION





FIG. 1

illustrates an electrical connector


10


including a retention clip


12


that is snappingly secured to a socket


14


to compressibly enclose an electrical package or module


16


therebetween. The socket


14


is securely mounted to a circuit board


18


. The electrical connector


10


electronically connects the module


16


to the circuit board


18


in a manner that permits the module


16


to be replaced periodically without unsoldering any soldered connections, while limiting an amount of gold plating used in non-soldered connections.





FIG. 2

illustrates a cross-sectional view taken along line


2





2


in

FIG. 1

of the electrical connector


10


. As shown in

FIG. 2

, the retention clip


12


and socket


14


define a cavity therebetween to receive the module


16


in a secure manner at a known position and orientation relative to the socket


14


and therefore relative to the circuit board


18


.





FIG. 3

illustrates a perspective view of the socket


14


. The socket


14


includes a base


20


shaped in a substantially rectangular configuration. Optimally, the base


20


may be shaped in any manner dependent upon the shape of the module


16


to be retained thereon. The socket


14


includes side flanges


22


-


25


formed on opposite sides of the base


20


and projecting upward therefrom. In the embodiment of

FIG. 3

, the side flanges


22


-


25


are located opposed from one another and proximate opposite ends of the base


20


. Optionally, the number of side flanges


22


-


25


and the position of the side flanges


22


-


25


may be varied. The side flanges


22


-


25


in the example of

FIG. 3

are formed integral with the base


20


.





FIGS. 4

,


5


, and


7


illustrate the flanges


22


-


25


in more detail. Each side flange


22


-


25


includes a cutout center section


26


between side surfaces


27


and


28


. The side surfaces


27


and


28


abut against the sides of the module


16


to locate the module


16


laterally at a desired position. A base portion of each flange


22


-


25


includes a notch


30


. The cutouts


26


and notches


30


receive board locks


32


.





FIG. 6

illustrates the board locks


32


in more detail. Each board lock


32


is formed in a substantially T-shaped configuration with upper arms


34


shaped to be slidably and securely received within the cutouts


26


and the flanges


22


-


25


. The board locks


32


include a series of upper and lower retention barbs


36


on either side thereof. Notched openings


38


are located between the retention barbs


36


and upper arms


34


. When assembled, the board locks


32


are inserted downward into the cutouts


26


until the upper and lower retention barbs


36


pass through the notches


30


and the flanges


22


-


25


. The notches


30


are dimensioned such that base portions of the flanges


22


-


25


are snuggly received within the upper set of notches


38


immediately below the upper arms


34


of the board locks


32


, thereby retaining the board locks


32


within the socket


14


.




The printed circuit board


18


upon which the socket


14


is to be mounted similarly is provided with a set of notches (not shown) to align with the board locks


32


. The notches in the circuit board


18


are also dimensioned to snuggly fit within the lower set of notches


38


defined between the pairs of retention barbs


36


, in order to retain the socket


14


upon the circuit board


18


. The board locks


32


and notches in the circuit board


18


are dimensioned with relatively close tolerances in order to align contacts (described in more detail below) in the socket


14


with electrical circuit paths provided in the circuit board


18


.




Turning to

FIG. 7

, a side view is illustrated of the socket


14


separate and apart from the retention clip


12


and module


16


. The socket


14


includes end walls


40


extending upward substantially along the entire width of the ends of the base


20


. The end walls


40


have inner faces


42


and outer edges


44


. At least one of the inner faces


42


includes keying projections


46


thereon extending inward into the chamber defined to receive the module


16


. The keying protrusions


46


may be formed integral with the end walls


40


which in turn may be formed integral with the base


20


. The keying protrusions


46


are configured to align with and fit into keying slots


48


(

FIG. 8

) formed in opposite ends of the module


16


. The end walls


40


further include latches


50


centered thereon and extending upward therefrom. The latches


50


snappingly engage, and retain, the retention clip


12


. The latches


50


include protrusions


52


extending outward from the base


20


in opposite directions beyond the outer edges


44


of the end walls


40


. The protrusions


52


are formed with beveled outer, upper edges


54


that permit easy assembly of the, retention clip


12


. In the embodiment of

FIG. 3

, the latches


50


include notches


56


(

FIGS. 4 and 5

) therein extending along an outer side of the latches


50


and in a vertical direction. The notches


56


facilitate removal of the retention clip when it is desirable to replace or gain access to the module


16


.




As shown in

FIGS. 5 and 7

, the bottom surface


21


of the base


20


includes a plurality of standoffs


58


distributed thereover. The standoffs


58


are formed with a predetermined height sufficient to maintain a desired minimum distance between the bottom surface


21


of the base


20


and the upper surface of the circuit board


18


. The standoffs


58


insure that the contacts


60


mounted in the base


20


are not crushed when the socket


14


is mounted on the circuit board


18


.




In the embodiment of

FIG. 7

, the overall height of the base


20


relative to the top surface of the printed circuit board is preferably minimized, such as to one millimeter and the like from the top surface of the printed circuit board to the top surface


19


of the base


20


. The distance from the top of the circuit board to the top surface


19


is minimized in connection with at least one preferred embodiment by utilizing a contact


60


having a very low vertical profile. The vertical profile of the contact


60


may be minimized by constructing the features of the contact


60


to extend in the horizontal direction (as illustrated in FIG.


10


), while minimizing the feature set of the contact


60


extending in the vertical direction.




As shown in

FIGS. 4 and 5

, the base


20


includes a plurality of channels


62


formed therein and extending therethrough. The channels


62


are formed in a rectangular shape and aligned (in one embodiment) at an acute angle with respect to the longitudinal axis of the base


20


. The channels


62


are grouped in rows


64


, with each row


64


aligned in an offset and overlapping manner with respect to the adjacent rows


64


of channels


62


. Each channel


62


receives a contact


60


that is forcibly inserted into the channel


62


and retained therein in a frictionally fit.




Optionally, the solder member


74


may vary in length and shape. The outer end portion


86


of the solder member


74


may have a length adapted to be soldered to the circuit board


18


. The solder is melted during a “reflow” operation permitting the outer end portion


86


to be embedded within the solder. During the reflow operation, the solder may wick upward along the outer end portion


86


of the solder member


74


a distance dependent upon the volume of solder used. The length of the outer end portion


86


is determined to be sufficient to prevent excess wicking of the solder. Thus, the length of the outer end portion


86


and the solder member


74


is dependent in part upon the amount of solder used to connect each contact


60


to the circuit board


18


.




As shown in

FIG. 9

, each channel


62


may be formed with a tapered width to be narrower proximate one end


63


and wider proximate the other end


65


. The contacts


60


have an even thickness, thereby easily sliding into the wide end


65


and frictionally engaging the narrow end


63


. Optionally, the contract


60


may gauge into the interior sides of the channel


62


proximate the narrow end


63


.





FIG. 10

illustrates a sectional view taken along line


10





10


in

FIG. 4

of a contact


60


mounted in a channel


62


. The contact


60


includes an intermediate shorting member


70


formed integrally with an upper interface


72


and a solder member


74


. In the embodiment of

FIG. 10

, the upper interface


72


includes a spring arm


76


having a lobe


78


formed on the outer end thereof. The upper edge of the lobe


78


forms a module engaging face


80


. The intermediate shorting member


70


includes a lobe


82


on the outer end thereof. The lobes


78


and


82


include shorting faces aligned with one another and that may be formed at angled chamfered edges, such as 45°. The spring arm


76


and shorting member


70


are interconnected via a flexible arcuate resilient bridge


86


. The solder member


74


joins the shorting member


70


at an intermediate point along the length of the shorting member


70


. The solder member


74


is shaped as a J-lead with an outer end portion


86


shaped to be soldered to an electrical path on the circuit board


18


, an inner end portion


87


joining the shorting member


70


and an intermediate portion


88


.




Optionally, the solder member


74


may vary in length and shape. The outer end portion


86


of the solder member


74


may have a length adapted to be soldered to the circuit board


18


. The solder is melted during a “reflow” operation permitting the outer end portion


86


to be embedded within the solder. During the reflow operation, the solder may wick upward along the outer end portion


86


of the solder member


74


a distance dependent upon the volume of solder used. The length of the outer end portion


86


is determined to be sufficient to prevent excess wicking of the solder. Thus, the length of the outer end portion


86


and the solder member


74


is dependent in part upon the amount of solder used to connect each contact


60


to the circuit board


18


.




The shorting member


70


also includes an intermediate portion


88


having a length sufficient to permit movement between the socket


14


and circuit board


18


. It may be desirable to permit relative movement between the socket


14


and the circuit board


18


as these components typically exhibit different coefficients of thermal expansion. As temperatures vary, the socket


14


expands and contracts by an amount dependent upon the size of the socket and the materials from which the socket


14


are formed. Similarly, as temperatures fluctuate, the circuit board


18


expands and contracts. However, as the socket


14


and circuit board


18


are of different size and formed from different materials, they expand and contract by different amounts. The amount of expansion and contraction may be characterized by their coefficients of thermal expansion. The solder member


74


is provided with sufficient length to be bent during relative movement between the socket


14


and circuit board


18


without cracking the solder connection between the circuit board


18


and the outer end


86


of the contact


60


. The intermediate portion


88


of the solder member


74


may flex in order to prevent cracking of the solder connection. The coefficient of thermal expansion (CTE) becomes more important as components become bigger. The CTE is of less importance in conventional socket configurations that simply maintain an abutting relation between the contacts and electrical paths on the circuit board without soldering such members to one another.




Optionally, the solder member


74


may be mounted to the contact


60


at a different position. For instance, the solder member


74


may be secured to the contact


60


at a point closer to or further from the arcuate portion


85


of the contact


60


.




Turning to

FIGS. 11 and 12

, the retention clip


12


is now discussed in more detail. The retention clip


12


includes side walls


100


and end walls


102


. The side walls


100


and end walls


102


are interconnected through a supporting rib configuration


104


. The rib configuration


104


includes opposed outer longitudinal ribs


106


extending along a length of the retention clip


12


. The longitudinal ribs


106


include a plurality of retention beams


108


formed thereon and extending inward and downward from the rib configuration


104


. The retention beams


108


are directed to abut against the module


16


to press the module


16


downward onto the contacts


60


mounted in the base


20


of the socket


14


. While the retention beams


108


are flexible, the retention beams


108


exhibit sufficient resiliency to apply a desired amount of force against the module


16


. The end walls


102


also include a plurality of retention fingers


110


formed therewith and bent inward and downward from the rib configuration


104


. The fingers


110


function in the same manner as retention beams


108


to bias the module


16


against the socket


14


. Optionally, the number of fingers may be modified. Optionally, the size of the fingers and locations thereof may similarly be varied, including mounting the retention beams


108


and


110


upon various portions of the rib configuration


104


, end walls


102


and side walls


100


.





FIG. 8

illustrates an exemplary module


17


comprised of an electronic component within a protective shell


130


. The shell


130


includes a plurality of openings


132


on an upper surface


134


. The shell


130


includes a plurality of exposure notches


120


cut into the shell


130


and arranged along either side of the shell


130


. Within the notches


120


, fingers


136


are formed integral with the shell


130


and bent to project downward. The fingers


136


are soldered to the electronic component enclosed in the shell


130


.




Opposite ends


138


,


139


of the shell


130


include outer flanges


140


bent downward to contact the ends of the electronic component. The flanges


140


may be formed integral with the shell


130


, and may be soldered to the electronic component. The flanges


140


and fingers


136


may be stamped from the shell


130


and bent accordingly. Once the flanges


140


and fingers


136


are bent, exposure notches


120


and


142


are formed. The retention beams


108


and


110


are shaped to fit the exposure notches


120


and


142


.




The overall longitudinal and lateral dimensions of the retention clip


12


are minimized by aligning the retention beams


108


and


110


with the exposure notches


120


and


142


.




The end walls


102


include openings


112


centered therein and located opposed to one another. The openings


112


are configured to align with the latches


50


. Each end wall


102


includes a retention edge


114


in the opening


112


which is secured under the protrusions


52


on the latches


50


once the retention clip


12


is snapped over the socket


14


and module


16


.




As illustrated in

FIG. 15

, the notch


56


in the latch


50


forms an opening behind the retention edge


114


, thereby permitting a tool to be inserted behind the end wall


102


in order to pry the end wall


102


outward and over the protrusions


52


on the latch


50


. To remove the retention clip


12


, a small tool is inserted into the notch


56


behind the end wall


102


and a slight pressure is applied downward on the retention clip


12


, while the tool is rotated inward towards the socket


14


. This action deflects the end wall


102


out and over the latch


50


. Once the module


16


is replaced, the retention clip


12


may be replaced by pressing the end walls


102


downward against the beveled edges


54


until the end walls


102


flex outward and over the latches


50


.





FIG. 8

illustrates an exemplary module


16


including notched side sections


120


that receive the retention beams


108


.




The end walls


102


and side walls


100


are thin and conform closely against the exterior of the socket


14


. The retention clip


12


provides a longitudinal and lateral envelope that is only slightly longer than the dimensions of the module


16


.




Optionally, the retention clip


12


may be modified to omit the rib support structure


104


, and merely include the retention beams


108


and


110


formed directly on the side walls


100


and end walls


102


, respectively.




While particular elements, embodiments and applications of the present invention have been shown and described, it will be understood, of course, that the invention is not limited thereto since modifications may be made by those skilled in the art, particularly in light of the foregoing teachings. It is therefore contemplated by the appended claims to cover such modifications as incorporate those features which come within the spirit and scope of the invention.



Claims
  • 1. An electrical connector, comprising:a socket having a base and having socket side walls and socket end walls on opposite sides and ends, respectively, of said base to define a chamber adapted to receive a module, said socket including a plurality of board locking members configured to surface mount said socket to a circuit board, said base including a plurality of contact cavities; contacts securely fixed in said contact cavities; a retention clip having clip end walls snapably secureable to said socket end walls, said retention clip including at least one biasing member adapted to abut against and bias a module against said socket when said retention clip is interlocked to said socket.
  • 2. The electrical connector of claim 1 wherein said clip end walls of said retention clip are snapped over said socket end walls of said socket when said retention clip is loaded onto said socket.
  • 3. The electrical connector of claim 1 wherein said retention clip is mounted in a downward direction onto said socket and wherein said retention clip is adapted to apply a bias force in said downward direction on a module held between said retention clip and socket.
  • 4. The electrical connector of claim 1 wherein said retention clip is snapped downward onto a top of said socket.
  • 5. The electrical connector of claim 1, wherein said biasing member includes a plurality of retention beams mounted to and extending downward from said retention clip, said retention beams projecting toward said socket, said retention beams pressing against a module when the retention clip is interlocked to the socket.
  • 6. The electrical connector of claim 1, wherein said biasing member includes fingers integrally formed with a top surface of said retention clip, said fingers bending downward into said chamber.
  • 7. The electrical connector of claim 1, wherein said biasing member includes fingers integrally formed with said clip end walls, said fingers bending inward to project toward and forcibly engage a module.
  • 8. The electrical connector of claim 1, said biasing member maintaining first engaging surfaces on said contacts in electrical communication with a module.
  • 9. The electrical connector of claim 1, further including a locking protrusion mounted at least one socket end wall of said socket, and an opening in at least one clip end wall of said retention clip, said locking protrusion snapping securely into said opening to secure said retention clip to said socket.
  • 10. The electrical connector of claim 1, further including opposed latches mounted on said socket, each of said opposed latches snapably engaging one of said clip end walls of said retention clip, said opposed latches including protrusions and outer edges located below and recessed inward from said protrusions, said outer edges and protrusions defining a recessed bench receiving one of said clip end walls such that outer surfaces of each of said clip end walls are flush with an outer edge of one of said protrusions.
  • 11. The electrical connector of claim 1, said clip end walls integrally formed with support ribs, said support ribs biasing said clip end walls inward toward one another to snapably engage opposite ends of said socket, said clip end walls being bendable outward to release said socket.
  • 12. The electrical connector of claim 1, said socket including standoffs mounted on a bottom surface of said socket, said standoffs having a predetermined length maintaining a minimum distance between said socket and a circuit board, to prevent said contacts from being crushed during mounting of said socket on the circuit board.
  • 13. The electrical connector of claim 1, wherein said socket further includes a plurality of board locking members including a plurality of board locks projecting downward from said socket, said board locks including retention barbs on a periphery thereof forming an interference fit with corresponding openings in the circuit board.
  • 14. The electrical connector of claim 1, said socket having board lock housings extending outward from opposite sides of said socket, said board lock housings frictionally retaining board locking members of said socket.
  • 15. The electrical connector of claim 1, including a slot extending between said socket and said retention clip to receive a tool to release said retention clip from said socket.
  • 16. The electrical connector of claim 1, said socket end walls and socket side walls laterally and longitudinally locate a module in a desired position relative to said contacts.
  • 17. The electrical connector of claim 1, said socket including keys shaped to mate with corresponding cutouts in a module, said keys ensuring proper orientation of the module.
  • 18. The electrical connector of claim 1, wherein said base of said socket includes latches mounted on said socket end walls, said latches being located on opposite ends of a module, said latches defining an outer envelope of said connector, said latches including recessed benches receiving clip end walls of said retention clip such that said clip end walls are recessed inward within said envelope defined by said latches.
  • 19. An electrical connector for electronically engaging an electronic module with a printed circuit board, comprising:a socket having a base adapted to receive the module, said socket including a plurality of board locking members surface mounting said socket to the circuit board, said socket including a plurality of contact cavities; contacts securely fixed in the contact cavities, each contact having a first engaging surface for electronically engaging the module and having a second engaging surface for electronically engaging the circuit board; a retention clip removably secured to said socket and cooperating with said socket to sandwich the module therebetween, said retention clip having at least one end wall and at least one side wall, and a configuration of at least one support rib interconnecting said at least one of end wall and said at least one side wall; and a locking assembly interlocking said retention clip and socket, said retention clip including at least one biasing member abutting against and biasing the electronic module against the socket when the retention clip is interlocked to the socket, said locking assembly including a locking protrusion mounted on at least one end of said socket, and an opening in at least one end wall of said retention clip, said locking protrusion snapping securely into said opening to secure said retention clip to said socket.
  • 20. The electrical connector of claim 19, said locking assembly including a slot extending between said socket and said retention clip to receive a tool to release said retention clip from said socket.
  • 21. The electrical connector of claim 19, said socket including end and side walls to laterally and longitudinally locate the module in a desired position relative to said contacts.
  • 22. The electrical connector of claim 19, said socket including keys shaped to mate with corresponding cutouts in the module, said keys ensuring proper orientation of the module.
  • 23. The electrical connector of claim 19, wherein said socket includes a base platform with latches mounted on said base platform, said latches being located on opposite ends of the module, said latches defining an outer envelope of said connector, said latches including recessed benches receiving end walls of said retention clip such that said end walls are recessed inward within said envelope defined by said latches.
  • 24. An electrical connector for electronically engaging an electronic module with a printed circuit board, comprising:a socket having a base adapted to receive the module, said socket including a plurality of board locking members surface mounting said socket to the circuit board, said socket including a plurality of contact cavities; contacts securely fixed in the contact cavities, each contact having a first engaging surface for electronically engaging the module and having a second engaging surface for electronically engaging the circuit board; a retention clip removably secured to said socket and cooperating with said socket to sandwich the module therebetween, said retention clip having end walls and side walls, and a configuration of at least one support rib interconnecting one of said end walls to one of said side walls, said end walls integrally formed with said at least one support rib, said at least one support rib biasing said end walls inward toward one another to snapably engage opposite ends of said socket, said end walls being bendable outward to release said socket; and a locking assembly interlocking said retention clip and socket, said retention clip including at least one biasing member abutting against and biasing the electronic module against the socket when the retention clip is interlocked to the socket.
  • 25. The electrical connector of claim 24, said locking assembly including a slot extending between said socket and said retention clip to receive a tool to release said retention clip from said socket.
  • 26. The electrical connector of claim 24, said socket including end and side walls to laterally and longitudinally locate the module in a desired position relative to said contacts.
  • 27. The electrical connector of claim 24, said socket including keys shaped to mate with corresponding cutouts in the module, said keys ensuring proper orientation of the module.
  • 28. The electrical connector of claim 24, wherein said socket includes a base platform with latches mounted on said base platform, said latches being located on opposite ends of the module, said latches defining an outer envelope of said connector, said latches including recessed benches receiving end walls of said retention clip such that said end walls are recessed inward within said envelope defined by said latches.
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