1. Field of the Invention
The present invention relates to electrical contacts, and more particularly to an electrical contact with a preferred engaging function.
2. Background of the Invention
Electrical contacts are widely used in electrical socket connector to electrically bridge two electrical interfaces such as an electrical substrate, e.g. a PCB and an integrated circuit (IC) package, e.g. a central processing unit (CPU).
Referring to
What is needed, thereby, is a new electrical contact able to provide a preferred contacting shape and a good contacting stability.
An electrical contact according to a preferred embodiment of the present invention may include a retention portion, a solder portion bending from a bottom edge of the retention portion, a contact portion formed at a topmost end of the retention portion. The contact portion is configured as a spherical type head, which makes the contact have a preferred engaging function and an improved current conducting feature.
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For more reliable position of the contact 1 in the passage of the socket, an upright head portion 16 extends from a top end of the retention portion. In this preferred embodiment, the head portion 16 is angled with the retention portion 11 and has a generally elongate plate-like configuration. It should be understood that the head portion 16 may be figured to have other configurations, as long as it can be fit for fixing the contact 1 more reliably in the socket. The head portion 16 comprises a body portion 161 extending from a sidewall of the retention portion 11, a securing portion 163 extending downwardly from the body portion 161 and a leading portion 162 extending from a distal end of the body portion 161. The securing portion 163 defines a pair of slant surfaces 1634 on a lower end thereof and a pair of concave 1630 above the slant surfaces on two lateral sides thereof. In addition, the securing portion 163 comprises a number of barbs 1632 extending from two opposite sides thereof for engaging with the housing.
A tail portion 15 curvedly and downwardly extends from the second spring portion 13 and has a spherical type head for contacting with the printed circuit board. The tail 15 is used to establish electrical connecting between the contact and the PCB.
An contacting portion 14 formed at a distal end of the first spring arm 12, being at a topmost part of the contact 1, for electrically engagingly mating with a corresponding conductive pad of the IC package. In this preferred embodiment, the contact portion 14 has an arced or curved dish configuration, which can improve the contacting engagement between the contact 1 and the chip module, hence enhancing the stability of electrical connection between the chip module and the printed circuit board.
In use, the contact 1 is received in an insulative housing of the socket which serves to electrically connect the IC package and the PCB. The soldering portion 15 is electrically soldered to the PCB. The spring arms 12, 13 produces resilient deformation by an exterior force acted on the contact 1. The contacting portion 14 urges and mates with a corresponding conductive pad of the IC package through elastic force generated by the resilient deformation of the spring arms 12, 13. Thus, the electrical connection between the IC package and the PCB is established.
In the preferred embodiment, as the contact 1 has a contacting portion 14 and a tail portion 15 both having a semi-spherical shape able to improve a bigger surface and spherical shape which improves the engaging function between the contact and the chip module. Therefore, As a result, the contact 1 has a preferred electrical feature and mating character, compared to the typical contact 1.
While preferred embodiment in accordance with the present invention have been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present invention are considered within the scope of the present invention as defined in the appended claims.