The present invention generally relates to a contact configured to be joined to a conductive member while being held in a housing. For example the contact may be carried in an electrical socket and soldered to a circuit board. More particularly, the present invention relates to a contact having termination leads that flex to accommodate movement between the contact, a conductive member and a housing holding the contact.
An example of an application in which contacts are held in a housing and joined to a conductive member is in electrical sockets that are generally used to connect processors to circuit boards. The typical socket includes a body having an array of cavities that carry contacts. One type of socket is a pin grid array (PGA) socket which holds contacts that each have a flexible planar body joined to a solder ball at one end and a semicircular collar at another end. The solder ball extends out of the socket cavity below a bottom surface of the socket and is soldered to an electrical trace on the circuit board. The collar is located proximate, but below, a top surface of the body and receives and engages a pin extending from the processor in order to electrically connect the processor to the circuit board.
Another type of socket is a land grid array (LGA) socket, which holds contacts that each have a flexible body formed with a contact beam at one end and a solder ball at another end. The contact beams extend upward beyond the top surface of the socket cavities, while solder balls extend downward beyond the bottom surface of the socket. The solder balls join the contacts to electrical traces on a circuit board. The processor has several contact pads on its bottom surface that are positioned on the socket with the contact pads engaging the contact beams. The processor vertically compresses the contact beams downward in order to electrically connect the processor contact pads to the circuit board.
Conventional socket contacts suffer from several drawbacks. The contacts, socket and the circuit board are different sizes and are made of different materials, and thus have differing coefficients of thermal expansion. The coefficient of thermal expansion determines the amount that a material expands and contracts as the material is heated and cooled. Hence, the contacts, the socket and the circuit board expand and contract at different rates as the surrounding temperature changes such as when the electronic device is first turned on and begins to warm up.
Also, during assembly, once the socket is placed on a circuit board, but before the processor is inserted, the solder balls must be liquefied sufficiently to solder each contact to a corresponding trace on the circuit board. This is achieved through a reflow solder process during which the socket and circuit board are passed through an oven and heated to a relatively high temperature. Upon completion of reflow soldering the solder balls are formed directly to the bodies of the contacts and the contacts in turn are held rigidly in the cavities of the socket. The solder balls rigidly join the contacts and traces on the circuit board. Thus, as the circuit board, contacts and socket expand at a different rates, the solder joints between the contacts and the circuit board are strained. When these strains become substantial, the solder joints may fracture.
The impact of the mismatch in the coefficients of thermal expansion is magnified by the use of large sockets carrying a large array of contacts. The socket expands and contracts evenly in all directions. Thus, cavities near the center of the socket move or shift laterally less than cavities near the outer perimeter of the socket. Also, for sockets with an opening through the center, cavities in the central portion of each side of the socket move or shift less than cavities near the ends or corners of each side. Hence, while the solder joints near the center of a large socket may only be slightly affected by differences in coefficients of thermal expansion, solder joints near the edge or corner are greatly impacted by the differences in coefficients of thermal expansion. Therefore, the most strain occurs at the solder joints near the perimeter of the socket and near the corners. The inability to accommodate for differences in coefficients of thermal expansion between the contacts, socket and the circuit board limits the use of large sockets.
A need exists for a socket and contact that address the above noted problems and others experienced heretofore.
An electrical contact is provided that includes a body configured to be held on a circuit board. The body of the contact is movable relative to the circuit board along at least a first direction of motion. The contact includes a contact portion joined with the body that is configured to engage an electrical component. The contact portion may include one or more contact beams. The contact further includes a termination lead joined to the body and having an outer end that is configured to be fixedly secured to the circuit board. The termination lead extends from the body at a non-parallel angle to the first direction of motion, along which the contact moves relative to the circuit board. The termination lead flexes about an arcuate path as the body of the contact shifts along the first direction of motion with respect to the circuit board. The termination lead may also flex to permit relative motion between the circuit board and the body of the contact along a second direction of motion that is oriented at an angle to the first direction of motion.
Optionally, the body may be provided with a central beam that defines and extends along a longitudinal axis of the body. The termination lead extends laterally from the central beam at one of acute and right angles with respect to the longitudinal axis. A plurality of termination leads may be provided on the body and distributed such that a pair of termination leads are located near the center of the central beam and extend laterally outward therefrom. Optionally, termination leads may be provided at one end or at opposite ends of the central beam and also oriented to extend laterally outward therefrom.
In accordance with at least one alternative embodiment, an electrical socket is provided having a housing that is configured to be placed on a circuit board and to receive an electronic package, such as a processor or the like. The socket includes a contact having a body that is securely held in the housing where the body joints a termination lead. The termination lead has an outer end that is configured to be fixedly secured to the circuit board. The termination lead flexes when the housing of the socket shifts with respect to the circuit board. The housing may hold a plurality of contacts about the perimeter of the housing or evenly distributed across the housing. The contacts are shifted by different amounts with respect to the circuit board as the housing expands and contracts with changes in temperature.
The foregoing summary, as well as the following detailed description of certain embodiments of the present invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there is shown in the drawings, certain embodiments. It should be understood, however, that the present invention is not limited to the arrangements and instrumentality shown in the attached drawings.
Optionally, the contact 10 may include only a single contact beam 34 and a single end wall 14. Alternatively, more than two contact beams 34 may be formed with each end wall 14. Alternatively, an uneven number of contact beams 34 may be used (e.g., one contact beam 34 on one end wall 14 and two or three contact beams 34 on the opposite end wall 14). Each end wall 14 has a curved arm 50 extending from a bottom end 52 between the legs 18. The curved arms 50 are formed with a thin center beam 54. The center beam 54 extends parallel to the longitudinal axis 78 between the end walls 14. The center beam 54 includes a slot 56 cut in the center thereof to form thin side walls 60 on opposite sides of the slot 56. The center beam 54 includes center termination leads 58 and 59 extending perpendicularly from opposite sides of the center beam 54 along a transverse axis 82. The center termination leads 58 and 59 are formed with circular pads 62 on outer ends thereof that carry solder balls 66 (only one of which is shown in FIG. 1). End termination leads 70 and 71 are provided on opposite ends of the center beam 54 proximate the end walls 14. The end termination leads 70 and 71 extend laterally from the center beam 54 at an acute angle, such as a generally 45 degree angle, to the longitudinal axis 78 and toward the nearest end wall 14. The end termination leads 70 and 71 also are formed with circular pads 62 that carry the solder balls 66 (FIG. 2). Thus, the contact 10 retains several solder balls 66 for the purpose of forming solder joints with a common pad or trace on the printed circuit board 74 (not shown when reflow soldered). The center termination leads 58 and 59 and the end termination leads 70 and 71 retain the solder balls 66 remote from the center beam 54 and the end walls 14.
Once the contacts 10 are inserted into the cavities 88 in the housing 84 of the socket 80, the socket 80 is then positioned on a circuit board and the solder balls 66 (
Returning to
Because the socket 80 and circuit board are made of insulating materials such as plastic and the contact 10 is made of a conductive material such as copper, the socket 80, the circuit board and the contact 10 have different coefficients of thermal expansion. As the surrounding temperature changes, the contacts 10, the socket 80 and the circuit board expand or contract at different rates and by different amounts.
Thus, the contacts 10 shift with respect to the circuit board along the longitudinal and transverse axes 78 and 82 (FIG. 1).
With reference to
Optionally, the center termination leads 58 and 59 may be modified to extend at an acute angle from the center beam 54 with the slot 56 retained or removed. Alternatively, the end termination leads 70 and 71 may be oriented at a perpendicular angle to the center beam 54, with a slot (similar to slot 56) provided within the center beam 54 to permit transverse movement or shifting at the end termination leads 70 and 71.
Optionally, the center and end termination leads 58 and 59 and 70 and 71 may be formed at alternative angles or in varied combinations (e.g., less than 6 leads or more than 6 leads). Alternatively, an uneven number of termination leads may be provided. Alternatively, termination leads may be provided at different positions along the length of the center beam 54.
In the embodiment of
It is to be understood that the contacts 10 and 110 may be used with many other conductive members besides circuit boards, sockets and processors.
While the invention has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Number | Name | Date | Kind |
---|---|---|---|
5611698 | Ito | Mar 1997 | A |
5772451 | Dozier et al. | Jun 1998 | A |
6296495 | Wang et al. | Oct 2001 | B1 |
20010012739 | Grube et al. | Aug 2001 | A1 |
20010015373 | Olson | Aug 2001 | A1 |
Number | Date | Country | |
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20050020099 A1 | Jan 2005 | US |