Claims
- 1. A device which comprises(1) a laminar conductive polymer element which (a) is composed of a conductive polymer which comprises (i) a polymeric component and (ii), dispersed in the polymeric component, electrically conductive particles in an amount such that the composition has a resistivity at 23° C. of less than 106 ohm-cm, and (b) has a first principal face, a second principal face parallel to the first face, and at least one transverse face which extends from the first principal face to the second principal face and consists essentially of a fractured surface; (2) a first laminar electrode which has (i) an inner face which contacts the first principal face of the conductive polymer element, and (ii) an outer face; and (3) a second laminar electrode which has (i) an inner face which contacts the second principal face of the conductive polymer element, and (ii) an outer face.
- 2. A device according to claim 1 wherein each of the first and second electrodes is a metal foil.
- 3. A device according to claim 1 wherein the conductive polymer element has a periphery which consists of four substantially straight transverse faces at least two of which extend from the first principal face to the second principal face and consist essentially of a fractured surface.
- 4. A device according to claim 3 wherein each transverse face is at an angle of substantially 90° to the principal faces.
- 5. A device according to claim 1 wherein the conductive polymer is a PTC conductive polymer.
- 6. A device according to claim 5 wherein the conductive polymer element consists of a single layer of the PTC conductive polymer.
- 7. A device according to claim 6 wherein each of the electrodes is a metal foil and the PTC conductive polymer has a resistivity at 23° C. of less than 10 ohm-cm.
- 8. A method of making a device, which method comprises(1) making an assembly which comprises (A) a laminar conductive polymer element which (a) is composed of a composition which comprises a polymeric component and, dispersed in the polymeric component, electrically conductive particles in an amount such that the composition has a resistivity at 23° C. of less than 106 ohm-cm, and (b) has a first principal face and a second principal face parallel to the first face; (B) a plurality of upper laminar conductive members, each of which has (a) an inner face which contacts the first principal face of the conductive polymer element and (b) an outer face, the upper conductive members defining, with intermediate portions of the conductive polymer element, a plurality of upper fracture channels which do not penetrate into the conductive polymer element; and (C) a plurality of lower laminar conductive members, each of which has (a) an inner face which contacts the second principal face of the conductive polymer element, and (b) an outer face, the lower conductive members defining, with intermediate portions of the conductive polymer element, a plurality of lower fracture channels which do not penetrate into the conductive polymer element; and (2) separating the assembly into a plurality of devices by a process which comprises applying physical forces to the assembly which cause the conductive polymer element to fracture along a plurality of paths each of which runs between one of the upper fracture channels and one of the lower fracture channels, thus producing transverse faces which extend from the first principal face to the second principal face and consist essentially of a fractured surface.
- 9. A method according to claim 8 wherein said assembly has been prepared by a process which comprises(1) providing an assembly which comprises (A) said laminar conductive polymer element, (B) an upper laminar metal foil, and (C) a lower laminar metal foil; and (2) etching a plurality of lines in the upper and lower foils, thus dividing them into said upper and lower conductive members without etching the conductive polymer element.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation of application Ser. No. 08/808,135, filed Feb. 28, 1997, now U.S. Pat. No. 5,864,281, which is a file wrapper continuation of application Ser. No. 08/257,586, filed Jun. 9, 1994, now abandoned. This application is also related to commonly assigned U.S. application Ser. No. 08/121,717, filed Sep. 15, 1993, by Siden, Thompson, Zhang and Fang now abandoned, to commonly assigned U.S. application Ser. No. 07/910,950, now abandoned, filed Jul. 9, 1992, by Graves, Zhang, Chandler, Chan and Fang, now abandoned, and the corresponding PCT Application US93/06480, filed Jul. 8, 1993, and to the commonly assigned U.S. application Ser. No. 08/242,916 filed by Zhang and Fang on May 16, 1994, now abandoned in favor of continuation application Ser. No. 08/710,925, filed Sep. 24, 1996, now U.S. Pat. No. 5,831,510. The entire disclosure of each of those US and PCT applications is incorporated herein by reference for all purposes.
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Continuations (2)
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Number |
Date |
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Parent |
08/808135 |
Feb 1997 |
US |
Child |
09/215646 |
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US |
Parent |
08/257586 |
Jun 1994 |
US |
Child |
08/808135 |
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US |