Number | Date | Country | Kind |
---|---|---|---|
197 38 575 | Sep 1997 | DE |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP98/05514 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO99/12178 | 3/11/1999 | WO | A |
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526077 | Dec 1982 | AU |
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6176680 | Jun 1994 | JP |
10-106425 | Apr 1998 | JP |
9608832 | Mar 1996 | WO |
9608832 | Mar 1996 | WO |
Entry |
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Patent Abstracts of Japan: vol. 097, No. 009 Sep. 30, 1997; JP 09 115418A (Matsuo Denki KK) May 2, 1997. |
Patent Abstracts of Japan: vol. 097, No. 001, Jan. 31, 1997 & JP 08 236003 A (Hitachi Chem Co Ltd), Sep. 13, 1996. |
Neuhalfen A.J.: “Miniaturization of Circuit Protection Devices to Meet Surface Mount Applications” ISBN# 0-7803-2636-9, Nov. 7, 1995, pp. 172-177, XP00586566. |