FIELD OF THE INVENTION
The invention relates to an electrical impedance imaging sensing element, a sensing system and a sensing method thereof.
BACKGROUND OF THE INVENTION
Electrical Impedance Tomography (EIT) is a radiation-free, real-time, low-cost imaging technology, and these advantages enable the continuous development of this technology in academic research. However, if any electrode of the EIT sensing device fails, it may result in somewhat distortion of the image. Therefore, how to improve the aforementioned issue is one of the goals of those in this technical field.
SUMMARY OF THE INVENTION
In an embodiment of the invention, an electrical impedance imaging sensing element is provided. The electrical impedance imaging sensing element includes a body and N electrodes. The body has a plurality of openings. Each of the N electrodes is embedded in the body and partially exposed from the corresponding opening. Each of the N electrodes is braided by a plurality of conductive wires, and N is a positive integer greater than or equal to 1.
In another embodiment of the invention, an electrical impedance imaging sensing system is provided. The electrical impedance imaging sensing system includes a signal processing device, the sensing element as described above and a processor. The signal processing device is electrically coupled to the sensing element and configured to output an emission signal. Each of the N electrodes is configured to receive a received signal of the emission which passes through a to-be-measured body. The processor is configured to: determine whether a determined one of the N electrodes has failed according to a plurality of the received signal; in response to failure of the determined one of the N electrodes, compensate for the received signal of a failed electrode of the N electrodes; and generate an electrical impedance image pre-processing data according to a plurality of the received signal.
In another embodiment of the invention, an electrical impedance imaging sensing method includes the following steps: outputting an emission signal to the sensing element as described above by the signal processing device; receiving a received signal of the emission signal which passes through the to-be-measured body by each of the N electrodes of the sensing element; determining whether a determination one of the N electrodes has failed according to a plurality of the received signal by a processor; in response to failure of the determined one of the N electrodes, compensating for the received signal of a failed electrode of the N electrodes; and generating an electrical impedance image pre-processing data according to the a plurality of the received signal by the processor.
Numerous objects, features and advantages of the invention will be readily apparent upon a reading of the following detailed description of embodiments of the invention when taken in conjunction with the accompanying drawings. However, the drawings employed herein are for the purpose of descriptions and should not be regarded as limiting.
BRIEF DESCRIPTION OF THE DRAWINGS
The above objects and advantages of the invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
FIG. 1 illustrates a schematic diagram of the electrical impedance imaging sensing system according to an embodiment of the present disclosure;
FIGS. 2A to 2B illustrate schematic diagrams of an electrical impedance imaging sensing element in FIG. 1 in different perspectives;
FIG. 3 illustrates a flow chart of a sensing method according to an embodiment of the electrical impedance imaging sensing system in FIG. 1;
FIG. 4 illustrates a flow chart of a sensing method of another embodiment of the electrical impedance imaging sensing system in FIG. 1;
FIG. 5A illustrates a schematic diagram of a relationship between the received signal received by the electrodes of the electrical impedance imaging sensing element and the receiving orders;
FIG. 5B illustrates a schematic diagram of a relationship between the compensated received signal and the receiving orders in FIG. 5A;
FIG. 6A illustrates a schematic diagram of the simulated image diagram corresponding to the received signal (before compensation) in FIG. 5A;
FIG. 6B illustrates a schematic diagram of the simulated image corresponding to the received signal (after compensation) in FIG. 5B;
FIG. 7 illustrates a flow chart of the sensing method of another embodiment of the electrical impedance imaging sensing system in FIG. 1;
FIG. 8A illustrates a schematic signal diagram of the received signal of the (f+1)th received signal group in FIG. 5A after shifted;
FIG. 8B illustrates a schematic signal diagram of the received signal S1 to S16 of the (f−2)th received signal group Gf−2 after shifted;
FIG. 9 illustrates a schematic signal diagram of the fth received signal group in FIG. 5A replaced by the shifted (f+1)th received signal group in FIG. 8A and the (f−1)th received signal group in FIG. 5A replaced by the shifted (f−2)th received signal group in FIG. 8B.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
Referring to FIGS. 1 to 2B, FIG. 1 illustrates a schematic diagram of the electrical impedance imaging sensing system 100 according to an embodiment of the present disclosure, and FIGS. 2A to 2B illustrate schematic diagrams of an electrical impedance imaging sensing element 110 in FIG. 1 in different perspectives.
As illustrated in FIG. 1, the electrical impedance imaging sensing system 100 includes the electrical impedance imaging sensing element 110, a processor 120 and a signal processing device 130. The electrical impedance imaging sensing system 100 is, for example, a portable EIT sensing system. The processor 120 is, for example, a physical circuit formed by a semiconductor process, such as an integrated circuit, such as a chip, a bare die, or a semiconductor package.
As illustrated in FIGS. 2A and 2B, the electrical impedance imaging sensing element 110 is, for example, an EIT sensor. The electrical impedance imaging sensing element 110 includes a body 111, N electrodes (e.g., electrodes E1 to E16), N electrode fasteners (e.g., electrode fasteners P1 to P16), and N adhesive tapes 112. The body 111 has N openings 111a. N is a positive integer greater than or equal to 1. Each electrode is embedded in the body 111 and partially exposed from the corresponding opening 111a. Each electrode is, for example, braided by a plurality of conductive threads. As a result, the resistances of the electrodes E1 to E16 in the embodiment of the present invention are very small, which may provide excellent signal transmission quality.
In the present embodiment, the value of N is, for example, 16, but it may also be more or less.
As illustrated in FIGS. 2A and 2B, the body 111 is in a strip shape. In use, the electrical impedance imaging sensing element 110 may surround a to-be-measured body (e.g., a part corresponding to the lungs) of the to-be-measured body (e.g., a human body). The signal processing device 130 may emit an emission signal L to the electrical impedance imaging sensing element 110. The emission signal L is emitted from the electrode of the electrical impedance imaging sensing element 110 into the to-be-measured body, becomes a plurality of received signal S1 to S16 after passing through a tissue (for example, lung) in the to-be-measured body, and received by all electrodes E1 to E16. Tissue may contain air, which forms the impedance of the tissue. The emission signal L changes its electrical properties after passing through the impedance. The values of the received signal S1 to S16 received by the electrodes E1 to E16 depend on an impedance distribution (change) of the tissue in the to-be-measured body. The processor 120 may establish a corresponding tissue image according to the received signal S1 to S16.
As illustrated in FIGS. 2A and 2B, the body 111 is formed of nylon material, for example. The body 111 covers 16 (i.e., N) electrodes E1 to E16 and the electrode fasteners P1 to P16. The body 111 has a first surface 111s1 and a second surface 111s2 opposite to the first surface 111s1. Each opening 111a is formed on the first surface 111s1 and exposes a portion of the corresponding electrode, wherein the exposed electrode may directly or indirectly contact the to-be-measured body. The electrode fasteners P1 to P16 are exposed from the second surface 111s2 and are electrically connected to the processor 130 (the processor 130 is illustrated in FIG. 1). The adhesive tape 112 may be disposed on the first surface 111s1 of the body 111 and expose corresponding electrode. The adhesive tape 112 may combine the electrode with the body 111 so that the electrode and the body 111 are tightly bonded together.
In an embodiment, each electrode is, for example, a textile electrode. For example, the electrodes E1 to E16 each include a plurality of fibers and conductive threads, wherein the fibers may encapsulate the conductive threads. The fiber is a textile thread that has the advantages of soft, washable, thin, and resistant to folding, so it will not cause discomfort when attached to the human body. The conductive wire is formed of a material including, for example, gold, silver, copper or other materials with excellent conductivity. In comparison with the conventional electrocardiogramatch which has a high resistance of about 2 ohms, the electrode according to the embodiment of the present invention has a low resistance of 0.2 ohms, thereby providing better signal transmission quality.
As illustrated in FIGS. 1, 2A and 2B, each of the electrode fasteners P1 to P16 may be electrically connected to the corresponding electrode to transmit the received signal S1 to S16 received by the electrodes E1 to E16 to the processor 130, for example, through the signal processing device 130.
As illustrated in FIG. 1, each electrode of the electrical impedance imaging sensing element 110 is configured to receive the received signal. For example, the electrode E1 receives the received signal S1, the electrode E2 receives the received signal S2, the electrode E3 receives the received signal S3, the electrode E4 receives the received signal S4, the electrode E5 receives the received signal S5, the electrode E6 receives the received signal S6, the electrode E7 receives the received signal S7, the electrode E8 receives the received signal S8, the electrode E9 receives the received signal S9, the electrode E10 receives the received signal S10, the electrode E11 receives the received signal S11, the electrode E12 receives the received signal S12, the electrode E13 receives the received signal S13, the electrode E14 receives the received signal S14, the electrode E15 receives the received signal S15, and the electrode E16 receives the received signal S16. The processor 130 is electrically coupled to the electrical impedance imaging sensing element 110 and is configured to: determine whether one (or a determination one) of the electrodes E1 to E16 has failed according to the received signal S1 to S16; and in response to failure of one of the electrodes E1 to E16, compensates for the received signal of the failed electrode. As a result, the distortion of the tissue image established by the processor 120 according to the compensated received signal is greatly reduced and is close to a correct tissue image.
As illustrated in FIG. 1, the signal processing device 130 includes a first connector 131A, a second connector 131B, a processing chip 132, a signal generator 133, a switch 134, a differential amplifier 135, an analog-to-digital converter (ADC) 136 and a wireless communication unit 137. The first connector 131A, the second connector 131B, the processing chip 132, the signal generator 133, the switch 134, the differential amplifier 135, the analog-to-digital converter 136 and/or the wireless communication unit 137 may be a physical circuit formed by, for example, a semiconductor process, wherein the physical circuit is, for example, an integrated circuit such as a chip, die, or semiconductor package.
As illustrated in FIG. 1, the first connector 131A and the second connector 131B are, for example, D-sub (D-subminiature). The first connector 131A and the second connector 131B may electrically connect the electrodes E1 to E16 to transmit the emission signal L (e.g., current signal) to a corresponding electrode and receive the received signal S1 to S16 from all the electrodes E1 to E16 at one time. The processing chip 132 is, for example, an SoC chip (e.g., FPGA Z7000 SoC), which may control the signal generator 133 to generate the t emission signal L, and transmit the signal converted by the analog-to-digital converter 136 to the wireless communication unit 137. The processing chip 132 may control the frequency, intensity, etc. of the emission signal L to obtain different sensing modes. The switch 134 is, for example, a data selector (multiplexer, MUX). The switch 134 has 16 (i.e., N) channels, and may turn on one of the channels in turn to transmit the emission signal L to a corresponding electrode. The differential amplifier 135 is configured to perform differential operations on the received signal S1 to S16. The analog-to-digital converter 136 may convert the received signal S1 to S16 (e.g., voltage signal) into digital signal. The wireless communication unit 137 may transmit digital signal to the processor 130 using wireless communication technology (e.g., Wi-Fy), and the processor 130 performs calculations.
Referring to FIG. 3, FIG. 3 illustrates a flow chart of a sensing method according to an embodiment of the electrical impedance imaging sensing system 100 in FIG. 1.
In step S110, the signal processing device 130 outputs the emission signal L to the electrical impedance imaging sensing element 110. The emission signal L is emitted from one of the 16 electrodes of the electrical impedance imaging sensing element 110 into the to-be-measured body, and the emission signal L changes tissue's electrical properties after passing through the tissue in the to-be-measured body.
In step S120, the electrodes E1 to E16 of the electrical impedance imaging sensing element 110 receive the received signal S1 to S16 respectively.
In step S130, the processor 120 determines whether one of the electrodes E1 to E16 has failed according to the received signal S1 to S16. If yes, the process proceeds to step S140; if not, the process proceeds to step S150.
In step S140, the processor 120 compensates the received signal of the failed electrode.
In step S150, the processor 120 generate, using appropriate or known electrical impedance imaging technology, a set of electrical impedance image pre-processing data according to the received signal S1 to S16 (compensated received signal or uncompensated received signal). The processor 120 may generate a simulated image according to the electrical impedance image pre-processing data. The disclosed embodiment does not limit the type of electrical impedance image pre-processing data. As long as data can be used to generate simulated image, such data can be used as the electrical impedance image pre-processing data in the disclosed embodiment.
Then, the process returns to step S110 to generate the next simulated image.
Referring to FIGS. 4, 5A to 5B and 6A to 6B, FIG. 4 illustrates a flow chart of a sensing method of another embodiment of the electrical impedance imaging sensing system 100 in FIG. 1, FIG. 5A illustrates a schematic diagram of a relationship between the received signal S1 to S16 received by the electrodes E1 to E16 of the electrical impedance imaging sensing element 110 and the receiving orders Rn, FIG. 5B illustrates a schematic diagram of a relationship between the compensated received signal S1 to S16 and the receiving orders Rn in FIG. 5A, FIG. 6A illustrates a schematic diagram of the simulated image diagram corresponding to the received signal (before compensation) in FIG. 5A, and FIG. 6B illustrates a schematic diagram of the simulated image corresponding to the received signal (after compensation) in FIG. 5B.
In step S210, the processing chip 132 of the signal processing device 130 sets the initial value of n to 1.
In step S220, as illustrated in FIG. 1, in the nth receiving order Rn, the signal processing device 130 outputs the emission signal L to the nth electrode En, where n ranges between 1 to 16 (that is, 1 to N) between positive integers. The nth electrode En emits the emission signal L into the to-be-measured body, so it may be called the “emitting electrode”. In an embodiment, the emission signal L is, for example, a current. In addition, in the nth receiving order Rn, the processing chip 132 may set the (n−1)th electrode En−1 as the “grounding electrode”.
In step S230, as illustrated in FIG. 5A, in the nth receiving order Rn, in response to the emission signal L, the electrodes Et to E16 receive an nth received signal group Gn, where the nth received signal group Gn includes, in the receiving order Rn, the received signal S1 to S16 received by the electrodes E1 to E16.
In step S240, the processing chip 132 determines whether the value of n is equal to 16 (i.e., N). If yes, it means that a sensing cycle has been completed, and the process proceeds to step S250 to start to determine whether there is a failed electrode; if not, it means that the sensing cycle has not been completed, and the process proceeds to step S255, and the processor 120 accumulates the value of n, that is, n=n+1, and then the process returns to step S220.
To sum up, as illustrated in FIG. 5A, 16 electrodes E1 to E16 take turns as emitting electrode, and a total of 16 receiving orders R1 to R16 is obtained. The 16 receiving orders R1 to R16 are defined as one sensing cycle. The processor 20 may analyze the received signal in one sensing cycle to obtain the tissue image. In one receiving order Rn, the electrodes E1 to E16 may receive a group of received signal Gn. After N electrodes take turns as emitting electrodes, a total of N received signal groups may be received, that is, N×N received signal. For example, in case of N being equal to 16, after the 16 electrodes E1 to E16 take turns as emitting electrodes, a total of 16 received signal groups G1 to G16 may be received. One received signal group includes 16 (i.e., N) received signal S1 to S16, so the 16 received signal groups G1 to G16 includes a total of 16×16 received signal. If one of the electrodes E1 to E16 fails (for example, falls off, malfunctions, or is unable to emit signal due to other reason), the tissue image will be severely distorted. For example, as illustrated in FIG. 6A, if one of the electrodes E1 to E16 fails, the simulated image M1 established with the signal diagram illustrated in FIG. 5A cannot correctly represent the simulated impedance T1 in the tissue (the impedance T1 is illustrated in FIG. 6B).
In step S250, the processor 120 determines whether one of the electrodes E1 to E16 is failed according to the received signal groups G1 to G16. If yes, the process proceeds to step S260; if not, the process proceeds to step S150.
In step S260, in response to the failure of the fth one of the electrodes E1 to E16 (the electrode Ef), the processor 120 replaces the fth received signal group Gf with the (f+1)th received signal group Gf+1. The value of f is one of 1 to 16 (i.e., 1 to N). The actual value of f depends on the coding number of the failed electrode. Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, as illustrated in FIG. 5B, the processor 120 replaces the 5th received signal group G5 with the 6th received signal group G6. For example, the processor 120 replaces the received signal S1 to S16 of the 5th received signal group G5 with the received signal S1 to S16 of the 6th received signal group G6 respectively.
In step S270, in response to the failure of the fth electrode Ef of the electrodes E1 to E16, the processor 120 replaces the (f−1)th received signal group Gf−1 with the (f−2)th received signal group Gf−2. Furthermore, due to the received signal group Gf−1 and the received signal group Gf performing a differential operation, an abnormal received signal group Gf will cause the received signal group Gf−1 to be abnormal. Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, in the 4th receiving order R4, the 4th electrode E4 serves as the emitting electrode. Due to the received signal S1 to S16 of the received signal group G4 and the received signal S1 to S16 of the received signal group G5 performing the difference operation, the received signal group G4 will also be abnormal due to the abnormality of the received signal group G5. As illustrated in FIG. 5B, the processor 120 replaces the 4th received signal group G4 with the 3th received signal group G3 to eliminate the abnormality of the received signal group G4 in FIG. 5A. Furthermore, the processor 120 replaces the received signal S1 to S16 of the 4th received signal group G4 with the received signal S1 to S16 of the 3th received signal group G3 respectively. As a result, as illustrated in FIG. 6B, the compensated simulated image M2 established with the compensated signal diagram illustrated in FIG. 5B may correctly image the simulated impedance T1 in the tissue.
Then, the process returns to step S210, where the processor 120 sets the value of n as the initial value and continues the next sensing cycle.
During the sensing process, unless the process is terminated manually, the process in FIG. 4 may continue in a loop (namely, repeated).
Referring to FIGS. 7 to 9, FIG. 7 illustrates a flow chart of the sensing method of another embodiment of the electrical impedance imaging sensing system 100 in FIG. 1, FIG. 8A illustrates a schematic signal diagram of the received signal S1 to S16 of the (f+1)th received signal group Gf+1 in FIG. 5A after shifted, FIG. 8B illustrates a schematic signal diagram of the received signal S1 to S16 of the (f−2)th received signal group Gf−2 after shifted, and FIG. 9 illustrates a schematic signal diagram of the fth received signal group Gf in FIG. 5A replaced by the shifted (f+1)th received signal group G′f+1 in FIG. 8A and the (f−1)th received signal group Gf−1 in FIG. 5A replaced by the shifted (f−2)th received signal group G′f−2 in FIG. 8B.
Steps S150, S210 to S250 and S280 in FIG. 7 have been described above and they will not be repeated here. The description will start from step S355 below.
In step S355, in response to the failure of the fth electrode (the electrode Ef) of the 16 electrodes, for the (f+1)th received signal group Gf+1, the processor 120 replaces the received signal Sm received by the mth electrode Em with the received signal Sm+1 received by the (m+1)th electrode Em+1 before shifted (as illustrated in FIG. 5A), and replaces the received signal SN received by the Nth electrode EN with the received signal S1 received by the 1th electrode E1 before shifted (as illustrated in FIG. 5A). In other words, for the (f+1)th received signal group Gf+1, the processor 120 replaces the received signal Sm+1 received, before the electrode Em+1 is shifted, is shifted backward (by previous electrode) with the received signal Sm of the electrode Em. After the shifted, the received signal Sm of each electrode Em is the received signal Sm+1 of the next electrode Em+1 before shifted. The aforementioned m is, for example, a positive integer ranging between 1 and N.
Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, as illustrated in FIG. 8A, for the 6th received signal group G6, the processor 120 replaces the received signal S2, before shifted, received by the electrode E2 with the received signal S1 received by the electrode E1, replaces the received signal S3, before shifted, received by the electrode E3 with the received signal S2 received by the electrode E2, replaces the received signal S4, before shifted, received by the electrode E4 with the received signal S3 received by the electrode E3, replaces the received signal S5, before shifted, received by the electrode E5 with the received signal S4 received by the electrode E4, replaces the received signal S6, before shifted, received by the electrode E6 with the received signal S5 received by the electrode E5, replaces the received signal S7, before shifted, received by the electrode E7 with the received signal S6 received by the electrode E6, replaces the received signal S8, before shifted, received by the electrode E8 with the received signal S7 received by the electrode E7, replaces the received signal S9, before shifted, received by the electrode E9 with the received signal S8 received by the electrode E8, replaces the received signal S10, before shifted, received by the electrode E10 with the received signal S9 received by the electrode E9, replaces the received signal S11, before shifted, received by the electrode E11 with the received signal S10 received by the electrode E10, replaces the received signal S12, before shifted, received by the electrode E12 with the received signal Su received by the electrode E11, replaces the received signal S13, before shifted, received by the electrode E13 with the received signal S12 received by the electrode E12, replaces the received signal S14, before shifted, received by the electrode E14 with the received signal S13 received by the electrode E13, replaces the received signal S15, before shifted, received by the electrode E15 with the received signal S14 received by the electrode E14, and replaces the received signal S16, before shifted, received by the electrode E16 with the received signal S15 received by the electrode E15. As illustrated in FIG. 8A, the 6th received signal group after shifted is represented by G′6.
The aforementioned shift processing is for the received signal S1 to S16 of the 6th received signal group G6, but the shifted received signal group G′6 does not cover (or not replace) the received signal group Ge in FIG. 5A.
In step S360, in response to the failure of the fth one of the electrodes E1 to E16 (the electrode Ef), the processor 120 replaces the fth received signal group Gf with the (f+1)th received signal group Gf+1 (after shifted). Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, the processor 120 replaces the 5th received signal group G5 in FIG. 5A with the 6th received signal group G′6 in FIG. 8A, as illustrated in FIG. 9. For example, the processor 120 replaces the received signal S1 to S16 of the 5th received signal group G5 in FIG. 5A with the received signal S1 to S16 of the 6th received signal group G′6 in FIG. 8A respectively.
The received signal of the emitting electrode is generally strongest. Shifting process for the 6th received signal group Ge may make the replaced 6th received signal group G′6 in the 5th receiving order R5 in FIG. 9 be more consistent with the characteristic “the received signal of the electrode E5 serving as the emitting electrode in the 5th receiving order R5 is the strongest”. Furthermore, for the 6th received signal group G′6 after the shifted, the received signal of electrode E5 is the received signal S6 (in the 6th receiving order Re, the received signal of the electrode E6 serving as the emitting electrode is the strongest). Thus, after the 5th received signal group G5 in the 5th receiving order R5 in FIG. 9 is replaced by the 6th received signal group G′6, it is the same as the situation in which the electrode E5 serves as the emitting electrode in the 5th receiving order R5.
In step S365, as illustrated in FIG. 8B, in response to the failure of the fth electrode (the electrode Ef) of the N electrodes, for the (f−2)th received signal group Gf−2, the processor 120 replaces the received signal Sm received by the (m−1)th electrode Em−1 with the received signal Sm−1 received by the (m+1)th electrode Em+1, and replaces the received signal S1 received by the 1th electrode E1 with the received signal SN received by the Nth electrode EN. In other words, for the (f−2)th received signal group Gf−2, the processor 120 replaces the received signal Sm+1 received with the received signal Sm of the electrode Em which are shifted forward (to the next electrode). After shifted, the received signal Sm of each electrode Em is the received signal Sm−1 of the previous electrode Em−1 before shifted.
Due to the received signal group Gf−1 and the received signal group Gf performing the differential operation, an abnormal received signal group Gf will also cause the received signal group Gf−1 to be abnormal. The sensing method of the embodiment of the present invention may first perform shift processing on the received signal S1 to S16 of the received signal group Gf−2, and then compensate the received signal group Gf−1 according to the shifted received signal group Gf−2.
Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, as illustrated in FIG. 8B, for the 3th received signal group G3, the processor 120 replaces the received signal S2 received by the electrode E2 with the received signal S1, before shifted, received by the electrode E1, replaces the received signal S3 received by the electrode E3 with the received signal S2, before shifted, received by the electrode E2, replaces the received signal S4 received by the electrode E4 with the received signal S3, before shifted, received by the electrode E3, replaces the received signal S5 received by the electrode E5 with the received signal S4, before shifted, received by the electrode E4, replaces the received signal S6 received by the electrode E6 with the received signal S5, before shifted, received by the electrode E5, replaces the received signal S7 received by the electrode E7 with the received signal S6, before shifted, received by the electrode E6, replaces the received signal S8 received by the electrode E8 with the received signal S7, before shifted, received by the electrode E7, replaces the received signal S9 received by the electrode E9 with the received signal S8, before shifted, received by the electrode E8, replaces the received signal S10 received by the electrode E10 with the received signal S9, before shifted, received by the electrode E9, replaces the received signal S11 received by the electrode E11 with the received signal S10, before shifted, received by the electrode E10, replaces the received signal S12 received by the electrode E12 with the received signal S11, before shifted, received by the electrode E11, replaces the received signal S13 received by the electrode E13 with the received signal S12, before shifted, received by the electrode E12, replaces the received signal S14 received by the electrode E14 with the received signal S13, before shifted, received by the electrode E13, replaces the received signal S15 received by the electrode E15 with the received signal S14, before shifted, received by the electrode E14, replaces the received signal S1 received by the electrode E1 with the received signal S16, before shifted, received by the electrode E16. As illustrated in FIG. 8B, the 3th received signal group after shifted is represented by G′3.
The aforementioned shift processing is for the received signal S1 to S16 of the 3th received signal group G3, but the received signal group G′3 after shifted does not cover (or not replace) the received signal group G3 in FIG. 5A.
In step S370, in response to the failure of the fth electrode Ef of the 16 electrodes, the processor 120 replaces the (f−1)th received signal group Gf−1 with the (f−2)th received signal group Gf−2. Taking the 5th electrode E5 as the failed electrode (the received signal group G5 in FIG. 5A is abnormal) for an example, the processor 120 replaces the 4th received signal group G4 in FIG. 8B with the 3th received signal group G′3, as illustrated in FIG. 9. For example, the processor 120 replaces the received signal S1 to S16 of the 4th received signal group G4 in FIG. 5A with the received signal S1 to S16 of the 3th received signal group G′3 in FIG. 8B respectively.
The received signal is generally strongest at the emitting electrode. Shifting process for the 3th received signal group G3 may make the replaced 4th received signal group G′3 in the 4th receiving order R4 in FIG. 9 be more consistent with the characteristic “the received signal of the electrode E4 serving as the emitting electrode in the 4th receiving order R4 is the strongest”. Furthermore, for the 3th received signal group G′3 after the shifted, the received signal of electrode E4 is the received signal S3 (in the 3th receiving order R3, the received signal S3 of the electrode E3 serving as the emitting electrode is the strongest). Thus, after the 4th received signal group G4 in the 4th receiving order R4 in FIG. 9 is replaced by the 3th received signal group G′3, it is the same as the situation in which the electrode E4 serves as the emitting electrode in the 4th receiving order R4.
The aforementioned process of determining the failed electrode and the process of compensating the received signal are executed by the processor 120, but it may also be executed by the processing chip 132 of the signal processing device 130.
In summary, embodiments of the present invention propose a sensing element, a sensing system and a sensing method thereof, which may determine whether any electrode in the N electrodes has failed (called “failed electrodes”) according to a plurality of the received signal (for example, N×N) received by N electrodes. If there is a failed electrode Ef, the processor or the processing chip of the signal processing device is configured to: in the first compensation method, replace the fth received signal group Gf with the (f+1)th received signal group Gf+1 and/or replace the (f−1)th received signal group Gf−1 with the (f−2)th received signal group Gf−2. Alternatively, the processor or the processing chip of the signal processing device is configured to: in the second compensation method, first shift the received signal S1 to S16 of the (f+p1)th received signal group Gf+p1, and then replace the received signal group Gf with the shifted received signal group G′f+p1 and/or first shift the received signal S1 to S16 of the (f−p2)th received signal group Gf−p2, and then replace the received signal group Gf−1 with the shifted received signal group G′f−p2, wherein p1 is a positive integer equal to 1 or greater than 1, and p2 is a positive integer equal to 2 or greater than 2.
In other words, if there is the failed electrode Ef, the processor or the processing chip of the signal processing device may: (1). replace the received signal group Gf with the received signal group (for example, the received signal group Gf+p1 in the receiving order Rf+p1) which is adjacent to the received signal group Gf in the receiving order Rf (in the receiving order Rf, the failed electrode Ef serves as the emitting electrode) and normal and/or replace the received signal group Gf−1 (in the receiving order Rf, the electrode Ef−1 serves as the grounding electrode) with the received signal group (for example, the received signal group Gf−p2 in the receiving order Rf−p2) which is adjacent to the received signal group Gf in the receiving order Rf (the failed electrode Ef serves as the emitting electrode) and normal. Alternatively, the processor or the processing chip of the signal processing device may: (2). first shift the received signal group (for example, the received signal group Gf−p2 in the receiving order Rf−p2) which is adjacent to the received signal group Gf in the receiving order Rf (the failed electrode Ef serves as the emitting electrode) and normal (for example, the received signal S1 to S16 of the received signal group Gf−p2 are shifted forward by p2), and then replace the received signal group Gf−1 with the shifted received signal group Gf−p2.
While the disclosure has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Patent Application
20240219332
