The subject matter described and/or illustrated herein relates generally to electrical interconnect devices for use between opposed arrays of contacts.
Interconnect devices are used to provide electrical connection between two or more opposing arrays of contacts for establishing at least one electrical circuit, where the respective arrays may be provided on a device, printed circuit board, Pin Grid Array (PGA), Land Grid Array (LGA), Ball Grid Array (BGA), and the like. In one interconnect technique, the electrical connection is provided by an interconnect device that is physically interposed between corresponding electrical contacts of the opposing arrays of contacts. At least some known interconnect devices use an array of elastomeric columns supported on a substrate. The elastomeric columns may be compressed to establish reliable contact between the opposing contacts. In some known interconnect devices, the elastomeric columns are conductive and provide the electrical connection.
In known interconnect devices using conductive elastomeric columns, the elastomeric columns are held by an insulative carrier having coverlays provided on both sides of the insulative carrier. The coverlays protect the elastomeric columns and provide mechanical stops for interfacing with the two electrical components connected by the interconnect device. For example, the coverlays may protect the elastomeric columns from mechanical and/or electrical failure resulting from over-compression of the elastomeric columns. But, the coverlays are extra layers of the interconnect device that add to the cost and complexity of the interconnect device.
A need remains for a less costly and/or complex electrical interconnect device.
In one embodiment, an interconnect device is provided for electrically connecting first and second electrical components together along a connection axis. The interconnect device includes a contact assembly having an insulative carrier and electrical contacts held by the insulative carrier. The insulative carrier includes opposite mating and mounting sides. The electrical contacts include mounting segments that extend along the mounting side of the insulative carrier for mounting to the first electrical component. The electrical contacts include mating segments that extend along the mating side of the insulative carrier for mating with the second electrical component. The mating segments are configured to be compressed along the connection axis. A frame is configured to be mounted to the first electrical component. The frame includes a central opening and at least one perimeter segment that defines a boundary of the central opening. The contact assembly is held within the central opening. The at least one perimeter segment includes a mounting side surface that is configured to face the first electrical component and a mating side surface that is opposite the mounting side surface. The frame includes a compression stop having a stop surface that is configured to engage the second electrical component to limit an amount of compression of the mating segments along the connection axis. The stop surface is aligned with the mating side surface of the perimeter segment.
In another embodiment, an interconnect device is provided for electrically connecting first and second electrical components together along a connection axis. The interconnect device includes a contact assembly having an insulative carrier and electrical contacts held by the insulative carrier. The insulative carrier includes opposite mating and mounting sides. The electrical contacts include mounting segments that extend along the mounting side of the insulative carrier for mounting to the first electrical component. The electrical contacts include mating segments that extend along the mating side of the insulative carrier for mating with the second electrical component. A frame is configured to be mounted to the first electrical component. The frame includes a central opening and a perimeter segment that defines a boundary of the central opening. The frame includes upper and lower tabs that extend from the perimeter segment into the central opening. The upper tab is spaced apart from the lower tab along the connection axis. At least one of the upper tab and the lower tab is resiliently deflectable. The contact assembly is held by the frame within the central opening such that an edge segment of the insulative carrier is captured between the upper and lower tabs with a snap-fit connection.
In another embodiment, an interconnect device for electrically connecting first and second electrical components together along a connection axis. The interconnect device includes a contact assembly having an insulative carrier and electrical contacts held by the insulative carrier. The insulative carrier includes opposite mating and mounting sides. The electrical contacts include mounting segments that extend along the mounting side of the insulative carrier for mounting to the first electrical component. The electrical contacts include mating segments that extend along the mating side of the insulative carrier for mating with the second electrical component. The mating segments are configured to be compressed along the connection axis. A frame is configured to be mounted to the first electrical component. The frame includes a central opening and at least one perimeter segment that defines a boundary of the central opening. The contact assembly is held within the central opening. The frame includes a tab that extends from the perimeter segment into the central opening and over an edge segment of the mating side of the insulative carrier. The tab includes a compression stop having a stop surface that is configured to engage the second electrical component to limit an amount of compression of the mating segments along the connection axis.
In the illustrated embodiment, the electrical component 12 is a flex circuit and the electrical component 14 is a circuit board. But, the electrical components 12 and 14 are each not limited thereto. Rather, each of the electrical components 12 and 14 may be any type of electrical component, such as, but not limited to, an electronic package (such as, but not limited to, a chip, a processor, an integrated circuit, and/or the like), a circuit board, a flex circuit, and/or the like. In some embodiments, the electrical components 12 and 14 are both circuit boards.
The interconnect device 16 includes a contact assembly 18 that is used to electrically connect the electrical components 12 and 14 along a connection axis 20. For example, the contact assembly 18 is configured to engage the arrays of contacts of the electrical components 12 and 14. The contact assembly 18 has a mating side 22 and an opposite mounting side 24. The interconnect device 16 is configured to be electrically connected to the electrical component 12 along the mating side 22. The interconnect device 16 is configured to be electrically connected to the electrical component 14 along the mounting side 24.
The interconnect device 16 includes a frame 26 having a plurality of perimeter segments 42 that define a central opening 30. The frame 26 is configured to be mounted to the electrical component 14, such as, but not limited to, using latches, fasteners, threaded fasteners, and/or the like. The contact assembly 18 is held within the central opening 30 of the frame 26 such that the contact assembly 18 interconnects the electrical components 12 and 14. In an exemplary embodiment, the contact assembly 18 is removable from the frame 26 such that the contact assembly 18 may be removed and replaced while leaving the frame 26 attached to the electrical component 14.
The elastomeric columns 34 are arranged in an array having a predetermined pattern or layout that corresponds to the array of contacts of the electrical component 12 and the electrical component 14. The elastomeric columns 34 extend outward along both the mating side 22 and the mounting side 24. Specifically, the elastomeric columns 34 include mating segments 36 that extend along the mating side 22 and mounting segments 38 that extend along the mounting side 24. In an exemplary embodiment, the mating segments 36 and the mounting segments 38 are frustoconically shaped, being wider about the base and narrower at the tips. In an exemplary embodiment, the elastomeric columns 34 are conductive elastomeric columns, such as, but not limited to, columns fabricated from a mixture of an elastic material and electrically conductive particles (e.g., flakes, spheres, and/or the like). The elastomeric columns 34 provide conductive paths between the arrays of contacts of the electrical components 12 and 14 (
The elastomeric columns 34 are at least partially compressible along the connection axis 20. For example, the mating segments 36 may at least partially compress along the connection axis 20 when the electrical component 12 is mated with the interconnect device 16 and/or when the interconnect device 16 is mounted to the electrical component 14. Moreover, and for example, the mounting segments 38 may at least partially compress along the connection axis 20 when the interconnect device 16 is mounted to the electrical component 14 and/or when the electrical component 12 is mated with the interconnect device 16.
In the illustrated embodiment, the elastomeric columns 34 extend through a thickness T of the insulative carrier 32 such that each elastomeric column 34 includes both a mating segment 36 and the corresponding mounting segment 38. Accordingly, in the illustrated embodiment, the mid-sections 40 of the elastomeric columns 34 are held by, and extend within, the thickness T of the insulative carrier 32. In other embodiments, each mounting segment 38 is a discrete component (e.g., a discrete electrical contact) from the corresponding mating segment 36. In such embodiments, corresponding mating and mounting segments 36 and 38, respectively, are electrically connected together through at least one intervening electrically conductive structure (not shown), such as, but not limited to, an electrical via, an electrical contact, a trace or other circuit pathway, and/or the like.
In an exemplary embodiment, the frame 26 has an open top 44 and an open bottom 46. The central opening 30 extends along the connection axis 20 between the open top 44 and the open bottom 46. The contact assembly 18 (
The perimeter segments 42 includes mounting side surfaces 48 and opposite mating side surfaces 50. The mounting side surfaces 48 are configured to face, and/or engage, the electrical component 14 when the frame 26 is mounted to the electrical component 14. The perimeter segments 42 include interior side surfaces 52.
The frame 26 includes one or more upper tabs 54 and one or more lower tabs 56 that extend into the central opening 30. Specifically, the upper and lower tabs 54 and 56, respectively, extend from the interior side surfaces 52 of one or more corresponding perimeter segments 42 into the central opening 30. The upper and lower tabs 54 and 56, respectively, are used to hold the contact assembly 18 within the central opening 30. In the illustrated embodiment, the upper tabs 54 are offset from the lower tabs 56 along the lengths of the perimeter segments 42. In alternative embodiments, one or more upper tabs 54 may be aligned along the length of the corresponding perimeter segment 42 with a corresponding lower tab 56 such that the corresponding tabs 54 and 56 oppose each other.
Each lower tab 56 has an upward facing ledge 58 and a mounting side surface 60 that extends opposite the upward facing ledge 58. Each upper tab 54 has a downward facing ledge 62 and a mating side surface 64 that extends opposite the downward facing ledge 62. The upper and lower tabs 54 and 56, respectively, are spaced apart from each other along the connection axis 20. In other words, the upper tabs 54 are spaced vertically above the lower tabs 56 such that a gap or space is created between the upward facing ledge 58 and downward facing ledge 62. The gap or space accommodates the thickness T (
In an exemplary embodiment, the upper tabs 54 and/or the lower tabs 56 are resiliently deflectable to enable the frame 26 to hold the contact assembly 18 with a snap-fit connection. Specifically, in an exemplary embodiment, both the upper tabs 54 and the lower tabs 56 are resiliently deflectable in the directions of the arcs C and D, respectively. The tabs 54 and/or 56 can be deflected along the respective arcs C and D to enable edge segments 63 (
The frame 26 may includes any number of the upper tabs 54 and any number of the lower tabs 56. Moreover, each perimeter segment 42 may include any number of the upper tabs 54 and any number of the lower tabs 56. The upper and lower tabs 54 and 56, respectively, may each have any size and/or shape that enables the tabs 54 and 56 to function as described and/or illustrated herein.
The frame 26 includes one or more compression stops 66 and/or includes one or more compression stops 68. The compression stops 66 include stop surfaces that are configured to engage the electrical component 12 to limit an amount of compression of the mating segments 36 (
The compression stops 68 include stop surfaces that are configured to engage the electrical component 14 to limit an amount of compression of the mating segments 36 and/or the mounting segments 38 (
As described above, the contact assembly 18, and more specifically, the insulative carrier 32 is held by the frame 26 with a snap-fit connection. For example, the upper tabs 54 and/or the lower tabs 56 have been deflected along the respective arcs C and D to enable the edge segments 63 of the insulative carrier 32 to clear the tabs 54 and/or 56 and fit within the gap or space between the upward facing ledge 58 and the downward facing ledge 62. The resilience of the tabs 54 and/or 56 causes the tabs 54 and/or 56 to snap back from the deflected position to the position shown in
In the illustrated embodiment, the gap or space between the ledges 58 and 62 is sized similarly to the thickness T of the insulative carrier 32 such that the edge segments 63 of the insulative carrier 32 are held between the upper and lower tabs 54 and 56, respectively, with a relatively tight fit. In alternative embodiments, the gap or space between the ledges 58 and 62 has a greater dimension than the thickness T of the insulative carrier 32 such that the edge segments 63 of the insulative carrier 32, and thus the contact assembly 18, can float within the gap or space along the connection axis 20. Optionally, the insulative carrier 32 can float relative to the frame 26 along one or more axes (e.g., the X and Y axes shown in
The contact assembly 18 is connected to the frame 26 before or after the frame 26 is mounted to the electrical component 14. For example, the contact assembly 18 may be loaded into the central opening 30 of the frame 26 through the open top 44 after the frame 26 is mounted to the electrical component 14. Alternatively, prior to mounting the frame 26 to the electrical component 14, the contact assembly 18 may be connected to the frame 26 and the interconnect device 16 can be mounted to the electrical component 14 as a unit.
When mated, the electrical component 12 is loaded onto the mating side 22 of the contact assembly 18. A mating interface 74 of the electrical component 12 engages the contact assembly 18. The electrical component 12 includes an array of component contacts 76 at the mating interface 74. The component contacts 76 engage corresponding mating segments 36 of the elastomeric columns 34.
The electrical component 12 is loaded onto the mating side 22 of the contact assembly 18 until the electrical component 12 engages the stop surfaces of the compression stops 66. The compression stops 66 limit the amount of compression of the elastomeric columns 34. For example, the compression stops 66 limit the amount of compression of the mating segments 36 along the connection axis 20. The compression stops 66 and/or 68 facilitate preventing damage to the elastomeric columns 34 from over-compression of the elastomeric columns 34, which may facilitate protecting the elastomeric columns from mechanically and/or electrically failing by being over-stressed. Because the compression stops 66 and/or 68 provide mechanical stops for interfacing with the electrical components connected by the interconnect device 16, the contact assembly 18 can be used without one or more coverlays over the insulative carrier 32. As such, the contact assembly 18 may be less complex and/or less costly to manufacture than a contact assembly 18 that includes a coverlay. For example, the material cost of the contact assembly 18 may be reduced, as well as assembly cost of the contact assembly 18.
In the illustrated embodiment, the stop surface of each of the compression stops 66 is defined by a combination of the mating side surfaces 50 of the perimeter segments 42 and the mating side surfaces 64 of the upper tabs 54. Specifically, as is shown in
The embodiments described and/or illustrated herein may provide an interconnect device that is less costly and/or complex.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
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Number | Date | Country | |
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20130260578 A1 | Oct 2013 | US |