The present invention relates to electrical connectors that include power contacts and thermally conductive structural elements in close proximity with the power contacts for sinking heat away from the contacts.
Power connectors, by their functional nature, produce heat. Typical materials used in most existing connector housing designs are thermally insulative, and thus, hold in heat, allowing it to build up inside the connector. One approach for improving heat dissipation has been to core out the housing as much as possible to allow clearance around the contacts within the housing in hopes of improving convective heat transfer. However, stagnant air is a poor conductor of heat, and localized forced air is dependent on a customer's application.
The invention includes both plug and receptacle power connectors. In some of the embodiments, the housing of at least one of the plug and receptacle connectors includes thermally conductive material in regions proximate contacts residing therein to sink heat away from the contacts. Both mating connectors can employ thermally conductive materials in their housing structure. The connector housing may also include materials other than the thermally conductive material. Furthermore, the thermally conductive material may reside generally throughout the housing structure. Alternatively, the thermally-conductive material may be selectively placed at locations such as locations proximate the heat generating contacts.
One manner of providing thermally conductive material proximate the power contacts is by forming the housing structure out of such material; for example, injection moldable thermoplastic materials including additives or fillers that render the cured polymer thermally conductive. Another manner includes employing a separately formed heat dissipation member that can be coupled to either the housing structure surrounding the power contacts or to the contacts themselves. For example, a clip, made out of thermally conductive material, can be added to a power contact, and the contact be inserted into the housing. At least a portion of the clip is preferably exposed to the exterior of the connector housing, so that heat conductively transferred from the contact can subsequently be transferred away from the entire connector via convection. The connector housing may be made from thermally insulative or conductive materials in embodiments where a separately formed heat dissipation member is coupled to housing structure or the power contact.
In preferred embodiments of the present invention, power contacts including plate-like body members are employed. The relatively large surface area of these contacts help facilitate heat transfer to the surrounding thermally conductive housing material. Other power contact designs can equally be employed without limitation. Moreover, the principles of the present invention can be applied to both single and multiple-contact connectors.
Reference is made to
Respective inner surfaces of plate-like body members 32 and 34 are positioned flush against a wall 22 of pocket 21 that preferably includes thermally conductive material, so that heat can be transferred away from the contact itself. In preferred embodiments, the thermally conductive material includes a thermally conductive thermoplastic. Such thermoplastics are currently available from PolyOne Corp., Cool Polymers, LNP Engineering Plastics, TRP Co., and Ticona Corp. Although most thermoplastics, particularly those traditionally used in the electronics industry, are good insulators, fillers or additives can be compounded with existing base polymers (e.g., nylons, liquid crystal polymers, and polyesters) to impart thermal conductivity. Among the most commonly used heat-conductive additives are graphite carbon fibers; carbon powder; metallic fillers such as copper powder, steel, aluminum power, and aluminum flake; and ceramic fillers such as aluminum nitride and boron nitride. Thermally conductive polymers can be produced in either electrically or non-electrically conductive grades, either of which may be used in a connector application of the present invention.
The thermally conductive material can have a thermal conductivity of approximately 1.2 W/m K to approximately 2.4 W/m K, and a heat capacity of approximately 1.1 J/g K to approximately 1.3 J/g K. These particular ranges of thermal conductivity and heat capacity are disclosed for exemplary purposes only. Thermally conductive materials having thermal conductivities or heat capacities outside of these ranges can be used in the alternative.
Respective outer surfaces of plate-like body members 32 and 34 are exposed to housing channels 24 and 26. These channels can improve heat dissipation from plug contact 30 via convection. Thus, heat generated by contact 30 can be transferred away from the contact both conductively via thermally conductive wall 22 and convectively via air flow through channels 24 and 26. Besides wall 22, other portions of plug connector housing 20 can employ thermally conductive material. For example, plug connector housing 20 can be injection molded from thermally conductive polymers so that the entire structure is available as a heat sink. In this scenario, radiative heat transfer can also occur from the outer surfaces of plate-like body members 32 and 34 to opposing pocket walls 28 (not visible) and 29.
Referring now to
Referring now to
In alternative connector embodiments of the present invention, additional thermally conductive material can be disposed between contact features and connector housing features, which also comprise thermally conductive material. For example, a conductive pad or compound can be disposed in gaps between contact body members and surrounding housing structure. In some instances, such additional thermally conductive material is included to fill any small air gaps (which would be insulative) arising from high points on the adjacent contact and/or housing structures. Here, there would be some portions of the contact body member that are in intimate contact surrounding housing structure and some portions that are coupled (conductively) via the additional conductive material. In other instances, no portions of the contact will be in direct contact with surrounding housing structure, and the gap would be at least partially filled with an added conductive pad or compound for example.
Referring now to
Heat dissipation member 206 can have many different forms, including a clip 230, as is shown in
The use of the term “clip” is in no way intended to limit the design of the heat dissipation member 206. Rather, the important aspects of the heat dissipation member is that it be designed and positioned in such a way to sink heat away from the power contact. In preferred embodiments, at least a portion of the heat dissipation member is exposed to the outside environment so as to create a heat transfer pathway from a connector interior to the connector exterior. As can be seen in
A rear portion of an electrical connector 260, similar to connector 200, is shown in
Depending on the application, more or less heat can be generated from transmission of power through the electrical connectors of the present invention. In a high heat situation, the thermally conductive heat dissipation member can include a considerable amount of surface area, both in contact with the power contact and exposed to an exterior of the connector (i.e., the outside environment). By way of example, and as shown in
A subassembly 350 of a power contact 320 and heat dissipation member 330 is shown in
In
Power contacts of the present invention are made from suitable materials, such as, for example, copper alloys. The contacts may be plated with materials such as gold, a combination of gold and nickel, or a range of other materials commonly known within the industry. The number of contacts and their arrangement in connector housings is not limited to that shown in the figures. Preferred power contacts of the present invention comprise plate-like body members. One of ordinary skill in the art would readily appreciate that the plate-like body members may be planar or non-planar in form. The power contacts may contain apertures or other heat transfer features. Similarly, the connector housings may contain heat transfer features not shown in the included figures, such as, for example, heat channels extending from the exterior of the connector to an interior of the housing, voids, or gaps adjacent some portions of the retained power contacts to combine conductive and convective heat transfer. Note that while both the plug and receptacle connectors described above employ thermally conductive materials, alternative embodiments include mating connectors where only one of the plug connector and the receptacle connector employs thermally insulative material.
The description has focused on exemplary power contact and connector embodiments shown in the figures. Variations of such embodiments are included within the spirit of the present invention, the manifestations of some of which is included through the various claims appended hereto.
This application claims priority under 35 U.S.C. § 119(e) to U.S. provisional application No. 60/638,470, filed Dec. 22, 2004, the contents of which is incorporated by reference herein in its entirety. This application is related to U.S. provisional application No. 60/648,561, filed Jan. 31, 2005, and U.S. provisional application No. 60/668,350, filed Apr. 5, 2005. The contents of each of these applications is incorporated by reference herein in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
318186 | Hertzog | May 1885 | A |
741052 | Mahon | Oct 1903 | A |
1477527 | Raettig | Apr 1923 | A |
2248675 | Huppert | Jul 1941 | A |
2430011 | Gillentine | Nov 1947 | A |
2759163 | Ustin et al. | Aug 1956 | A |
2762022 | Benander et al. | Sep 1956 | A |
2844644 | Soule, Jr. | Jul 1958 | A |
3011443 | Nielsen | Dec 1961 | A |
3178669 | Roberts | Apr 1965 | A |
3208030 | Evans et al. | Sep 1965 | A |
3286220 | Marley et al. | Nov 1966 | A |
3411127 | Adams | Nov 1968 | A |
3420087 | Hatfield | Jan 1969 | A |
3514740 | Filson | May 1970 | A |
3538486 | Shlesinger, Jr. | Nov 1970 | A |
3634811 | Teagno | Jan 1972 | A |
3669054 | Desso et al. | Jun 1972 | A |
3692994 | Hirschman et al. | Sep 1972 | A |
3748633 | Lundergan | Jul 1973 | A |
3845451 | Neidecker | Oct 1974 | A |
3871015 | Lin et al. | Mar 1975 | A |
3942856 | Mindheim, deceased et al. | Mar 1976 | A |
3972580 | Pemberton et al. | Aug 1976 | A |
4070088 | Vaden | Jan 1978 | A |
4076362 | Ichimura | Feb 1978 | A |
4082407 | Smorzaniuk et al. | Apr 1978 | A |
4136919 | Howard et al. | Jan 1979 | A |
4159861 | Anhalt | Jul 1979 | A |
4217024 | Aldridge et al. | Aug 1980 | A |
4260212 | Ritchie et al. | Apr 1981 | A |
4288139 | Cobaugh et al. | Sep 1981 | A |
4371912 | Guzik | Feb 1983 | A |
4383724 | Verhoevan | May 1983 | A |
4402563 | Sinclair | Sep 1983 | A |
4403821 | Zimmerman, Jr. et al. | Sep 1983 | A |
4473113 | Whitfield et al. | Sep 1984 | A |
4505529 | Barkus | Mar 1985 | A |
4536955 | Gudgeon | Aug 1985 | A |
4545610 | Lakritz et al. | Oct 1985 | A |
4552425 | Billman | Nov 1985 | A |
4560222 | Dambach | Dec 1985 | A |
4564259 | Vandame | Jan 1986 | A |
4596433 | Oesterheld et al. | Jun 1986 | A |
4685886 | Denlinger et al. | Aug 1987 | A |
4717360 | Czaja | Jan 1988 | A |
4767344 | Noschese | Aug 1988 | A |
4776803 | Pretchel et al. | Oct 1988 | A |
4782893 | Thomas | Nov 1988 | A |
4815987 | Kawano et al. | Mar 1989 | A |
4820182 | Harwath et al. | Apr 1989 | A |
4867713 | Ozu et al. | Sep 1989 | A |
4878611 | LoVasco et al. | Nov 1989 | A |
4881905 | Demler, Jr. et al. | Nov 1989 | A |
4900271 | Colleran et al. | Feb 1990 | A |
4907990 | Bertho et al. | Mar 1990 | A |
4963102 | Gettig et al. | Oct 1990 | A |
4965699 | Jorden et al. | Oct 1990 | A |
4973257 | Lhotak | Nov 1990 | A |
4973271 | Ishizuka et al. | Nov 1990 | A |
4974119 | Martin | Nov 1990 | A |
4979074 | Morley et al. | Dec 1990 | A |
5024610 | French et al. | Jun 1991 | A |
5035639 | Kilpatrick et al. | Jul 1991 | A |
5052953 | Weber | Oct 1991 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5077893 | Mosquera et al. | Jan 1992 | A |
5082459 | Billman et al. | Jan 1992 | A |
5094634 | Dixon et al. | Mar 1992 | A |
5104332 | McCoy | Apr 1992 | A |
5137959 | Block et al. | Aug 1992 | A |
5174770 | Sasaki et al. | Dec 1992 | A |
5194480 | Block et al. | Mar 1993 | A |
5213868 | Liberty et al. | May 1993 | A |
5214308 | Nishiguchi | May 1993 | A |
5238414 | Yaegashi et al. | Aug 1993 | A |
5254012 | Wang | Oct 1993 | A |
5274918 | Reed | Jan 1994 | A |
5276964 | Anderson, Jr. et al. | Jan 1994 | A |
5298791 | Liberty et al. | Mar 1994 | A |
5302135 | Lee | Apr 1994 | A |
5321582 | Casperson | Jun 1994 | A |
5381314 | Rudy et al. | Jan 1995 | A |
5400949 | Hirvonen et al. | Mar 1995 | A |
5427543 | Dynia | Jun 1995 | A |
5431578 | Wayne | Jul 1995 | A |
5457342 | Herbst, II | Oct 1995 | A |
5475922 | Tamura et al. | Dec 1995 | A |
5490040 | Gavdenzi et al. | Feb 1996 | A |
5533915 | Deans | Jul 1996 | A |
5558542 | O'Sullivan et al. | Sep 1996 | A |
5558859 | Cretois | Sep 1996 | A |
5577928 | Duclos | Nov 1996 | A |
5582519 | Buchter | Dec 1996 | A |
5590463 | Feldman et al. | Jan 1997 | A |
5609502 | Thumma | Mar 1997 | A |
5618187 | Goto | Apr 1997 | A |
5637008 | Kozel | Jun 1997 | A |
5643009 | Dinkel et al. | Jul 1997 | A |
5664973 | Emmert et al. | Sep 1997 | A |
5691041 | Frankeny et al. | Nov 1997 | A |
5702255 | Murphy et al. | Dec 1997 | A |
5730609 | Harwath | Mar 1998 | A |
5741144 | Elco et al. | Apr 1998 | A |
5741161 | Cahaly et al. | Apr 1998 | A |
5742484 | Gillette et al. | Apr 1998 | A |
5743009 | Matsui et al. | Apr 1998 | A |
5745349 | Lemke | Apr 1998 | A |
5746608 | Taylor | May 1998 | A |
5755595 | Davis et al. | May 1998 | A |
5772451 | Dozier et al. | Jun 1998 | A |
5787971 | Dodson | Aug 1998 | A |
5795191 | Preputnick et al. | Aug 1998 | A |
5810607 | Shih et al. | Sep 1998 | A |
5817973 | Elco et al. | Oct 1998 | A |
5857857 | Fukuda | Jan 1999 | A |
5874776 | Kresge et al. | Feb 1999 | A |
5876219 | Taylor et al. | Mar 1999 | A |
5876248 | Brunker et al. | Mar 1999 | A |
5883782 | Thurston et al. | Mar 1999 | A |
5888884 | Wojnarowski | Mar 1999 | A |
5908333 | Perino et al. | Jun 1999 | A |
5919050 | Kehley et al. | Jul 1999 | A |
5930114 | Kuzmin et al. | Jul 1999 | A |
5955888 | Frederickson et al. | Sep 1999 | A |
5961355 | Morlion et al. | Oct 1999 | A |
5971817 | Longueville | Oct 1999 | A |
5975921 | Shuey | Nov 1999 | A |
5980270 | Fjelstad et al. | Nov 1999 | A |
5980321 | Cohen et al. | Nov 1999 | A |
5984726 | Wu | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6012948 | Wu | Jan 2000 | A |
6050862 | Ishii | Apr 2000 | A |
6059170 | Jimarez et al. | May 2000 | A |
6068520 | Winings et al. | May 2000 | A |
6071152 | Achammer et al. | Jun 2000 | A |
6077130 | Hughes et al. | Jun 2000 | A |
6089878 | Meng | Jul 2000 | A |
6095827 | Dutkowsky et al. | Aug 2000 | A |
6123554 | Ortega et al. | Sep 2000 | A |
6125535 | Chiou et al. | Oct 2000 | A |
6139336 | Olson | Oct 2000 | A |
6146157 | Lenoir et al. | Nov 2000 | A |
6146202 | Ramey et al. | Nov 2000 | A |
6146203 | Elco et al. | Nov 2000 | A |
6152756 | Huang et al. | Nov 2000 | A |
6174198 | Wu et al. | Jan 2001 | B1 |
6180891 | Murdeshwar | Jan 2001 | B1 |
6183287 | Po | Feb 2001 | B1 |
6183301 | Paagman | Feb 2001 | B1 |
6190213 | Reichart et al. | Feb 2001 | B1 |
6193537 | Harper, Jr. et al. | Feb 2001 | B1 |
6196871 | Szu | Mar 2001 | B1 |
6202916 | Updike et al. | Mar 2001 | B1 |
6210197 | Yu | Apr 2001 | B1 |
6210240 | Comerci et al. | Apr 2001 | B1 |
6212755 | Shimada et al. | Apr 2001 | B1 |
6215180 | Chen et al. | Apr 2001 | B1 |
6219913 | Uchiyama | Apr 2001 | B1 |
6220884 | Lin | Apr 2001 | B1 |
6220895 | Lin | Apr 2001 | B1 |
6220896 | Bertoncini et al. | Apr 2001 | B1 |
6234851 | Phillips | May 2001 | B1 |
6257478 | Straub | Jul 2001 | B1 |
6259039 | Chroneos, Jr. et al. | Jul 2001 | B1 |
6269539 | Takahashi et al. | Aug 2001 | B1 |
6272474 | Garcia | Aug 2001 | B1 |
6293827 | Stokoe et al. | Sep 2001 | B1 |
6299492 | Pierini et al. | Oct 2001 | B1 |
6309245 | Sweeney | Oct 2001 | B1 |
6319075 | Clark et al. | Nov 2001 | B1 |
6328602 | Yamasaki et al. | Dec 2001 | B1 |
6347952 | Hasegawa et al. | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6359783 | Noble | Mar 2002 | B1 |
6360940 | Bolde et al. | Mar 2002 | B1 |
6362961 | Chiou | Mar 2002 | B1 |
6363607 | Chen et al. | Apr 2002 | B1 |
6371773 | Crofoot et al. | Apr 2002 | B1 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6386924 | Long | May 2002 | B2 |
6409543 | Astbury et al. | Jun 2002 | B1 |
6428328 | Haba et al. | Aug 2002 | B2 |
6431914 | Billman | Aug 2002 | B1 |
6435914 | Billman | Aug 2002 | B1 |
6461202 | Kline | Oct 2002 | B2 |
6471523 | Shuey | Oct 2002 | B1 |
6471548 | Bertoncini et al. | Oct 2002 | B2 |
6506081 | Blanchfield et al. | Jan 2003 | B2 |
6514103 | Pape et al. | Feb 2003 | B2 |
6537111 | Brammer et al. | Mar 2003 | B2 |
6544046 | Hahn et al. | Apr 2003 | B1 |
6551112 | Li et al. | Apr 2003 | B1 |
6554046 | Bryan et al. | Apr 2003 | B1 |
6554647 | Cohen et al. | Apr 2003 | B1 |
6572410 | Volstorf et al. | Jun 2003 | B1 |
6592381 | Cohen et al. | Jul 2003 | B2 |
6652318 | Winings et al. | Nov 2003 | B1 |
6663426 | Fedder et al. | Dec 2003 | B2 |
6665189 | Lebo | Dec 2003 | B1 |
6669514 | Wiebking et al. | Dec 2003 | B2 |
6672907 | Azuma | Jan 2004 | B2 |
6692272 | Lemke et al. | Feb 2004 | B2 |
6702594 | Lee et al. | Mar 2004 | B2 |
6705902 | Yi et al. | Mar 2004 | B1 |
6712621 | Li et al. | Mar 2004 | B2 |
6716068 | Wu | Apr 2004 | B2 |
6740820 | Cheng | May 2004 | B2 |
6743037 | Kassa et al. | Jun 2004 | B2 |
6746278 | Nelson et al. | Jun 2004 | B2 |
6769883 | Brid et al. | Aug 2004 | B2 |
6769935 | Stokoe et al. | Aug 2004 | B2 |
6776635 | Blanchfield et al. | Aug 2004 | B2 |
6776649 | Pape et al. | Aug 2004 | B2 |
6790088 | Ono et al. | Sep 2004 | B2 |
6796831 | Yasufuku et al. | Sep 2004 | B1 |
6811440 | Rothermel et al. | Nov 2004 | B1 |
6829143 | Russell et al. | Dec 2004 | B2 |
6835103 | Middlehurst et al. | Dec 2004 | B2 |
6843687 | McGowan et al. | Jan 2005 | B2 |
6848886 | Schmaling et al. | Feb 2005 | B2 |
6848950 | Allison et al. | Feb 2005 | B2 |
6848953 | Schell et al. | Feb 2005 | B2 |
6869294 | Clark et al. | Mar 2005 | B2 |
6884117 | Korsunsky et al. | Apr 2005 | B2 |
6890221 | Wagner | May 2005 | B2 |
6905367 | Crane, Jr. et al. | Jun 2005 | B2 |
6929504 | Ling et al. | Aug 2005 | B2 |
6947012 | Aisenbrey | Sep 2005 | B2 |
6975511 | Lebo et al. | Dec 2005 | B1 |
6994569 | Minich et al. | Feb 2006 | B2 |
7001189 | McGowan et al. | Feb 2006 | B1 |
7070464 | Clark et al. | Jul 2006 | B2 |
7074096 | Copper et al. | Jul 2006 | B2 |
7101228 | Hamner et al. | Sep 2006 | B2 |
7104812 | Bogiel et al. | Sep 2006 | B1 |
7114963 | Shuey et al. | Oct 2006 | B2 |
7168963 | Minich et al. | Jan 2007 | B2 |
7182642 | Ngo et al. | Feb 2007 | B2 |
D542736 | Riku | May 2007 | S |
7273382 | Igarashi et al. | Sep 2007 | B2 |
7335043 | Ngo et al. | Feb 2008 | B2 |
20010003685 | Aritani | Jun 2001 | A1 |
20020106930 | Pape et al. | Aug 2002 | A1 |
20020142676 | Hosaka et al. | Oct 2002 | A1 |
20020159235 | Miller et al. | Oct 2002 | A1 |
20020193019 | Blanchfield et al. | Dec 2002 | A1 |
20030013330 | Takeuchi | Jan 2003 | A1 |
20030143894 | Kline et al. | Jul 2003 | A1 |
20030219999 | Minich et al. | Nov 2003 | A1 |
20030220021 | Whiteman, Jr. et al. | Nov 2003 | A1 |
20030236035 | Kuroda et al. | Dec 2003 | A1 |
20040183094 | Caletka et al. | Sep 2004 | A1 |
20050112952 | Wang et al. | May 2005 | A1 |
20060003620 | Daily et al. | Jan 2006 | A1 |
20060281354 | Ngo et al. | Dec 2006 | A1 |
Number | Date | Country |
---|---|---|
1 665 181 | Apr 1974 | DE |
102 26 279 | Nov 2003 | DE |
0 273 683 | Jul 1988 | EP |
0 321 257 | Apr 1993 | EP |
0 623 248 | Nov 1995 | EP |
0 789 422 | Aug 1997 | EP |
1 091 449 | Sep 2004 | EP |
1 162 705 | Aug 1969 | GB |
06-236788 | Aug 1994 | JP |
07-114958 | May 1995 | JP |
0 812 5379 | May 1996 | JP |
2000-003743 | Jan 2000 | JP |
2000-003744 | Jan 2000 | JP |
2000-003745 | Jan 2000 | JP |
2000-003746 | Jan 2000 | JP |
2003-217785 | Jul 2003 | JP |
546 872 | Aug 2003 | TW |
576 555 | Feb 2004 | TW |
WO 9743885 | Nov 1997 | WO |
WO 9744859 | Nov 1997 | WO |
WO 9815989 | Apr 1998 | WO |
WO 0129931 | Apr 2001 | WO |
WO 0139332 | May 2001 | WO |
Number | Date | Country | |
---|---|---|---|
20060228948 A1 | Oct 2006 | US |
Number | Date | Country | |
---|---|---|---|
60638470 | Dec 2004 | US |