This invention relates to electrical resistance heaters, heater assemblies, and methods of their use for applications such as processing substrates; more particularly, thermally processing substrates for electronic devices and optical-electronic devices.
Thermal processing of substrates is used in numerous applications such as modern microelectronic device manufacturing. These processes include processes such as chemical vapor deposition (CVD) and epitaxial semiconductor deposition such as silicon epitaxy, silicon germanium epitaxy, and compound semiconductor epitaxy. These processes are typically performed using one or more gases for causing reactions on the surface of substrates such as semiconductor wafers, flat panel display substrates, solar cell substrates, and other substrates.
This invention seeks to provide electrical resistance heaters, heater assemblies, and methods and that can overcome one or more deficiencies in thermal processes and process equipment. One aspect of the inventions is a heater or heater assembly. Another aspect of the invention is a method of performing a thermal process on a substrate.
It is to be understood that the invention is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced and carried out in various ways. In addition, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting.
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention.
For the following defined terms, these definitions shall be applied, unless a different definition is given in the claims or elsewhere in this specification. All numeric values are herein defined as being modified by the term “about,” whether or not explicitly indicated. The term “about” generally refers to a range of numbers that a person of ordinary skill in the art would consider equivalent to the stated value to produce substantially the same properties, function, result, etc. A numerical range indicated by a low value and a high value is defined to include all numbers subsumed within the numerical range and all subranges subsumed within the numerical range. As an example, the range 10 to 15 includes, but is not limited to, 10, 10.1, 10.47, 11, 11.75 to 12.2, 12.5, 13 to 13.8, 14, 14.025, and 15.
The operation of embodiments of the present invention will be discussed below in the context of thermally processing substrates such as semiconductor wafers or other substrates used for electronic and/or optoelectronic devices. It is to be understood, however, that embodiments in accordance with the present invention may be used to perform essentially any thermal process.
Reference is now made to
The cross-section area of sinusoidal heating element 222 is given by the multiplying the cross-section width of sinusoidal heating element 222 generally at each radial position by the cross-section thickness of sinusoidal heating element 222 generally at each radial position. The cross-section area varies with radial position based on the size of the surface to be heated and the wattage requirement. Additional factors that determine the cross-section area of the sinusoidal heating element are the number of oscillations in the sinusoidal heating element, resistivity of the sinusoidal heating element, spacing between facing sides of the sinusoidal heating element, and the length of the sinusoidal heating element.
As indicated above, the cross-section thickness and the cross-section width of the heating element at each radial position are functions of the radial position on the sinusoidal heating element. The thickness can be represented in general by a function of the form f1(1/r) where r is radial position on the sinusoidal heating element and f1 is the function. The term 1/r is used to indicate that the relation is an inverse relation. The width can be represented in general by a function of the form f2(r) where r is radial position on the sinusoidal heating element and f2 is the function. Consequently, the cross-section area of the sinusoidal heating element is a function of the form (f1(1/r)(f2(r)).
For some embodiments of the present invention, the cross-section thickness of the sinusoidal heating element is derived from the equation:
t=2πri2Gti/(2πr2G−Sr) (1)
where t is cross-section thickness of the heating element, r is radial position on the heating element, π is the mathematical constant pi, ri is an inside radius of the heating element, ti is an initial trial thickness, G is a geometry factor equaling the angular width of the heating element spoke divided by the angular size of the heater, and S is the spacing between facing side surfaces of the heating element. More specifically, t and r are variables and π, ri, ti, G, and S are numerical parameters. With the knowledge of the numerical parameters for a heater, the thickness can be calculated as a function of radial position.
As will be recognized by persons of ordinary skill in the art, Equation 1 and the numerical parameters are the result of only one approach to obtaining a numerical representation of the dimensions of heaters according to one or more embodiments of the present invention. Other approaches will be recognized by persons of ordinary skill in the art in view of the disclosure in this specification. The derivation of Equation (1) was accomplished using π the mathematical constant, ri as a designer choice, an outside radius of the heater as a designer choice, G as a designer choice, and S as a designer choice. The initial trial thickness of the heater element at the inside radius, ti, is also a designer choice, but optionally ti may have to be refined by iteration so that the resistance of the heater element is more suitably matched for use with the full voltage and current capacity of the power source to be used with the heater. The capacity of the power source is also a designer choice. One possible iteration procedure is presented below in an example heater design.
It is also possible to derive the numerical parameters or equivalent constants for an equation similar to Equation (1) if heater thickness data as a function of radial position is known for a heater. A further simplified equation for such situations could be of the form:
t=A/(Br2−Sr) (1.1)
where t, r, and S are the same as presented above and A and B are numerical values resulting from combining one or more of the numerical parameters presented above.
For some embodiments of the present invention, the cross-section width of the sinusoidal heating element is derived from the equation:
w=2πGr−S (2)
where w is the cross-section width of the heating element, r is the radial position on the heating element, π is the mathematical constant pi, G is a geometry factor equaling the angular width of the heating element spoke divided by the angular size of the heater, and S is a spacing between facing side surfaces of the heating element. The width of the heating element as a function of radial position can be calculated for more one or more embodiment of the present invention with designer specified values for angular width of the heating element spoke, the angular size of the heater, and the spacing.
A variety of materials may be used for sinusoidal heating element 222. According to one embodiment of the present invention, sinusoidal heating element 222 comprises a refractory electrical conductor. The sinusoidal heating element 222 may comprise graphite such as molded graphite. Further modifications can be made such as coating the graphite with a material such as silicon carbide to produce sinusoidal heating element 222 having, as an example, a graphite conductor coated with silicon carbide. Examples of other materials that can be used for sinusoidal heating element 222 include, but are not limited to, nickel-chromium alloy, molybdenum, tantalum, tungsten, and other materials used for electrical resistance heating.
According to one embodiment of the present invention, spacing 232 between facing side surfaces of sinusoidal heating element 222 is at vacuum or filled with gas during operation of sinusoidal heating element 222.
Reference is now made to
According to one embodiment of the present invention, electrical adapter 240 is formed so as to make a press-fit, also known in the art has an interference fit, coupling to electrical contact 238. For some embodiments of the present invention, serpentine heating element 222 may be made of graphite; as an option for those embodiments, electrical adapter 240 may be made of graphite. Optionally, electrical adapter 240 may be made of materials other than graphite that are also suitable for electrical connections.
The present inventors have found that a synergistic benefit may be occurring for embodiments of the present invention that use graphite for sinusoidal heating element 222 and graphite for electrical adapter 240 in a press-fit coupling configuration and a silicon carbide coating process. More specifically, applying a thermal coating of silicon carbide to sinusoidal heating element 222 and press-fit coupled electrical adapter 240 produces a mechanically strong connection between sinusoidal heating element 222 and electrical adapter 240 with a low contact resistance. Consequently, a strong mechanical connection is formed that is electrically conductive and it may be accomplished without complicated machining steps beyond a press-fit coupling.
The deposition conditions used for forming the silicon carbide coatings are the same as those typically used for coating graphite. Generally, a silicon source and a carbon source are caused to react at elevated temperatures such as about 1200° C. to produce a deposited coating of silicon carbide.
Reference is now made to
Reference is now made to
The cross-section area of sinusoidal heating element 222 is given by the multiplying the cross-section width of sinusoidal heating element 222 generally at each radial position by the cross-section thickness of sinusoidal heating element 222 generally at each radial position. The cross-section area is held at a selected constant based on the size of the surface to be heated and the wattage requirement. Additional factors that determine the cross-section area of the sinusoidal heating element are the number of oscillations in the sinusoidal heating element, resistivity of the heating element, spacing between facing sides of the sinusoidal heating element, and the length of the sinusoidal heating element.
As indicated above, the cross-section thickness and the cross-section width of the heating element at each radial position are functions of the radial position on the sinusoidal heating element. The thickness can be represented in general by a function of the form f1(1/r) where r is radial position on the sinusoidal heating element and f1 is the function. The term 1/r is used to indicate that the relation is an inverse relation. The width can be represented in general by a function of the form f2(r) where r is radial position on the sinusoidal heating element and f2 is the function. Consequently, the cross-section area of the sinusoidal heating element is a function of the form (f1(1/r))(f2(r)).
For some embodiments of the present invention, the cross-section thickness of the sinusoidal heating element is derived from the equation:
t=2πri2Gti/(2πr2G−Sr) (1)
where t is cross-section thickness of the heating element, r is radial position on the heating element, π is the mathematical constant pi, ri is an inside radius of the heating element, ti is an initial trial thickness, G is a geometry factor equaling the angular width of the heating element spoke divided by the angular size of the heater, and S is the spacing between facing side surfaces of the heating element. More specifically, t and r are variables and π, ri, ti, G, and S are numerical parameters. With the knowledge of the numerical parameters for a heater, the thickness can be calculated as a function of radial position.
As will be recognized by persons of ordinary skill in the art, Equation 1 and the numerical parameters are the result of only one approach to obtaining a numerical representation of the dimensions of heaters according to one or more embodiments of the present invention. Other approaches will be recognized by persons of ordinary skill in the art in view of the disclosure in this specification. The derivation of Equation (1) was accomplished using π the mathematical constant, ri as a designer choice, an outside radius of the heater as a designer choice, G as a designer choice, and S as a designer choice. The initial trial thickness of the heater element at the inside radius, ti, is also a designer choice, but optionally ti may have to be refined by iteration so that the resistance of the heater element is more suitably matched for use with the full voltage and current capacity of the power source to be used with the heater. The capacity of the power source is also a designer choice. One possible iteration procedure is presented below in an example heater design.
It is also possible to derive the numerical parameters or equivalent constants for an equation similar to Equation (1) if heater thickness data as a function of radial position is known for a heater. A further simplified equation for such situations could be of the form:
t=A/(Br2−Sr) (1.1)
where t, r, and S are the same as presented above and A and B are numerical values resulting from combining one or more of the numerical parameters presented above.
For some embodiments of the present invention, the cross-section width of the sinusoidal heating element is derived from the equation:
w=2πGr−S (2)
where w is the cross-section width of the heating element, r is the radial position on the heating element, π is the mathematical constant pi, G is a geometry factor equaling the angular width of the heating element spoke divided by the angular size of the heater, and S is a spacing between facing side surfaces of the heating element. The width of the heating element as a function of radial position can be calculated for more one or more embodiment of the present invention with designer specified values for angular width of the heating element spoke, the angular size of the heater, and the spacing.
A variety of materials may be used for sinusoidal heating element 222. According to one embodiment of the present invention, sinusoidal heating element 222 comprises a refractory electrical conductor. The sinusoidal heating element 222 may comprise graphite such as molded graphite. Further modifications can be made such as coating graphite with a material such as silicon carbide to produce sinusoidal heating element 222 having, as an example, a graphite conductor coated with silicon carbide. Examples of other materials that can be used for sinusoidal heating element 222 include, but are not limited to, nickel-chromium alloy, molybdenum, tantalum, tungsten, and other materials used for electrical resistance heating.
Reference is now made to
According to one embodiment of the present invention, electrical adapter 240 is formed so as to make a press-fit, also known in the art has an interference fit, coupling to electrical contact 238. For some embodiments of the present invention, serpentine heating element 222 may be made of graphite; as an option for those embodiments, electrical adapter 240 may be made of graphite. Optionally, electrical adapter 240 may be made of materials other than graphite that are also suitable for electrical connections.
Reference is now made to
Heater assembly 244 further comprises an electrical resistance heater 220 surrounding first heater 246. Electrical resistance heater 220 is essentially the same as described for electrical resistance heaters 220 in
Heater assembly 244 further comprises 12 electrical resistance heaters 242 shaped as quarter ring sections and disposed so as to form a substantially planar array of concentric rings for a substantially circular heated area. Electrical resistance heater 242 is essentially the same as described for electrical resistance heaters 242 in
Heater assemblies according to embodiments of the present invention include at least one electrical resistance heater selected from the group consisting of: electrical resistance heater 220, electrical resistance heater 220-1, electrical resistance heater 242, and electrical resistance heater 242-1.
Reference is now made to
Heater assembly 244-1 further comprises an electrical resistance heater 220-1 surrounding first heater 246-1. Electrical resistance heater 220-1 is essentially the same as described for electrical resistance heaters 220-1 in
Heater assembly 244-1 further comprises 12 electrical resistance heaters 242-1 shaped as quarter ring sections and disposed so as to form a substantially planar array of concentric rings for a substantially circular heated area. Electrical resistance heater 242-1 is essentially the same as described for electrical resistance heaters 242-1 in
An apparatus according to another embodiment of the present invention is an electrical resistance heater that comprises a graphite heating element. The graphite heating element has one or more graphite electrical contacts. The electrical resistance heater further comprises one or more graphite electrical adapters such as electrical adapters 240 and electrical adapters 240-1 described above. The one or more electrical adapters are press-fit coupled to the one or more graphite electrical contacts. The electrical resistance heater further includes a layer of silicon carbide overcoating the heating element and electrical adapter. The silicon carbide overcoating is applied after press-fit coupling the one or more graphite electrical contacts to the one or more electrical adapters. The silicon carbide coating may be applied using a high temperature chemical vapor deposition process.
The apparatuses described supra may be used for a wide variety of processes according to embodiments of the present invention. Reference is now made to
As an option, exemplary process diagram 248 may also include one or more modifications for additional embodiments of the present invention. Exemplary modifications may include, but are not limited to, the following: Providing a process chamber capable of holding the one or more substrates so that the thermal process is performed in the process chamber. Providing a plurality of substrates for substantially simultaneous substrate processing. Rotating the substrate during heating the substrate 248-6. Providing a substrate 248-2 includes a substrate comprising a semiconductor wafer. Providing a substrate 248-2 includes a substrate for fabricating electronic and/or optoelectronic devices.
Embodiments of the present invention also include methods and apparatus for growing layers of materials such as elemental materials, compounds, compound semiconductors, and compound dielectric materials.
Presented next is an exemplary procedure that may be used to design a heater according to one embodiment of the present invention. The heater for this design is similar in configuration to the ring heater shown in
Additional related calculations are also shown in Table 1 such as cross-section area of the heating element as a function of radial position and the resistance for each of the segmented lengths. The resistance for the segment lengths are totaled to give the total resistance for the spoke and multiplied by the number of spokes to determine the total resistance for the heating element. These calculations also aid in showing a possible approach a designer can use to modify the design of the heater so that it more closely matches a desired or optimum utilization of the power source capability. Specifically, a designer can select a different initial trial thickness and repeat the calculations to obtain the total resistance for the heating element for comparison with the desired or optimum resistance for use with a power supply. This iteration process can be continued until the total resistance for the heating element is an optimum or desired match of resistance for use with the power source.
In the foregoing specification, the invention has been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of present invention.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims.
As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having,” “at least one of,” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of elements is not necessarily limited only to those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
While there have been described and illustrated specific embodiments of the invention, it will be clear that variations in the details of the embodiments specifically illustrated and described may be made without departing from the true spirit and scope of the invention as defined in the appended claims and their legal equivalents.
The present application claims benefit of U.S. Patent Application Ser. No. 61/369,077, Docket No. LAS-002, titled “ELECTRICAL RESISTANCE HEATER AND HEATER ASSEMBLIES,” to Ronald L. Colvin et al., filed Jul. 30, 2010. The present application is related to: U.S. patent application Ser. No. 13/193,498, filed Jul. 28, 2011; U.S. Patent Application Ser. No. 61/369,047, Docket No. LAS-001, titled “SUBSTRATE PROCESSING APPARATUSES AND SYSTEMS,” to Ronald L. Colvin et al., filed Jul. 29, 2010; U.S. Patent Application Ser. No. 61/369,072, Docket No. LAS-003, titled “SYSTEMS, APPARATUSES, AND METHODS FOR CHEMICALLY PROCESSING SUBSTRATES USING THE COANDA EFFECT,” to Ronald L. Colvin et al., filed Jul. 30, 2010; U.S. Pat. No. 6,331,212, filed 17 Apr. 2000; and U.S. Pat. No. 6,774,060, filed 7 Jul. 2001. The contents of all of these applications and patents are incorporated herein in their entirety by this reference.
| Number | Date | Country | |
|---|---|---|---|
| 61369077 | Jul 2010 | US | |
| 61369072 | Jul 2010 | US |