Electrical socket apparatus

Information

  • Patent Grant
  • 6322384
  • Patent Number
    6,322,384
  • Date Filed
    Friday, November 3, 2000
    23 years ago
  • Date Issued
    Tuesday, November 27, 2001
    22 years ago
Abstract
A socket (10) includes an adaptor (28) which has a seating surface (28b) for an IC (100) and which has a plurality of contact member receiving holes (28d) in the seating surface. The tips (14c) of a plurality of contact members (14) are received through the contact member receiving holes (28d) of the adaptor, with contact established with each respective terminal (101) of the IC (100) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (22). The latches (22) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (32) fixed to the base. A cover (20) is movable between first and second positions and a links (24) connected to the cover (24) open the latches when the cover is at a first position and close the latches when the cover is at a second position.
Description




FIELD OF THE INVENTION




This inventions relates generally to a socket suitable for removably receiving an electrical part such as an integrated circuit (IC) having a plurality of terminals of the LGA or BGA, etc., type and more particularly to a socket for use in a burn-in test of the IC.




BACKGROUND OF THE INVENTION




Various tests are conducted for the purpose of identifying and discarding those IC packages that do not meet the required specifications for newly manufactured semiconductor integrated circuits. The burn-in procedure tests the IC's heat resistance properties by causing them to perform for a certain period of time at high temperature, thereby making it possible to cull out those that do not meet the required specifications. In a burn-in test, the IC is mounted on the socket that has been prepared exclusively for that purpose and the socket is in turn mounted on a printed circuit substrate for placement in a heating oven. Various kinds of sockets have been proposed for use in burn-in tests of IC packages of the LGA (Land Grid Array) or BGA (Ball Grid Array) types which have become popular in recent years. Basically, such sockets have a base member made of an insulating material and have a plurality of contact members that correspond to the terminals arranged on one surface of the IC. The contact members are arranged on the seating surface of the socket to correspond to each terminal of the IC to be brought in touch with the same when the IC has been placed on the seating surface. In a typical kind of socket, a cover is provided for holding the IC on the seating surface, with the IC being held on and removed from the seating surface by moving the cover up and down.




With reference to

FIGS. 13 and 14

, one such prior art socket has one side of a cover


142


rotatably supported on a base


141


. When cover


142


is opened as shown in

FIG. 14

, IC


100


is placed onto seating surface


141




a


and cover


142


is closed by means of an automatic unit, not shown in the drawing. A hook


143


is engaged with a latch on base


141


to maintain cover


142


in a closed position. IC


100


on seating


141




a


is compressed from above by a compression surface


142




a


inside cover


142


, with the terminals of the IC brought into engagement with the tip of respective contact members.




A problem with this type of socket is that when closing cover


142


, compression surface


142




a


approaches the base in a way which is inclined Is relative to IC


100


with a result that a bias load is applied to the IC. This biased load can damage the IC itself and, at the same time, can result in an uneven compressive force of the contact elements


144


against the terminals of the IC. In addition, the construction of the automatic unit for the switching action of cover


142


is complicated.




Another type of prior art socket is equipped with a mechanism for the vertical movement of the cover member relative to the base member and a latch that opens or closes in linkage with the movement of the cover. It is generally the case that the latch opens when the cover member is lowered, thereby making it possible for the IC to be placed on the seating surface of the base and closes when the cover member is elevated, thereby making it possible for the IC on the seating surface to be held from above.




This type of socket is subject to the following limitations:




(1) The latch needs to have its holding portions extend onto the upper surface of the IC when it is closed and recede from the upper surface of the IC hen it is opened. In order to realize this mechanism, usually a latch and a driving mechanism therefor are arranged around the seating surface of the IC. Because of this, there is a tendency to increase the external size of the socket.




(2) This type of socket for use in burn-in tests has a comparatively large number of parts requiring much time for its assembly.




(3) In this type of socket, the contact members have a curved part pressed against the terminals of the IC with a spring force based on the bending of the curved part when they are pressed. Along with an ever-increasing density of the IC terminals, there is a concomitant demand for the socket to have a contact member with high connective reliability.




SUMMARY OF THE INVENTION




Accordingly, it is an object of the invention to provide a socket whose outside shape is comparatively small relative to the size of the IC that is to be tested. Another object of the invention is the provision of a socket which is easily and quickly assembled. Still another object of the invention is the provision of a socket having increased reliability of contact engagement of contact members with the terminals of the IC.




The invention relates to a socket for use with an IC having a plurality of terminals on at least one surface thereof. A socket made according to the invention has a seating surface for the IC on an adaptor received on a base with the adaptor being provided in such a way as to have a plurality of contact member receiving holes on the seating surface. The tips of a plurality of contact members corresponding to the terminals of the IC are received through the contact member receiving holes of the adaptor, thereby establishing contact with each terminal of the IC that has been placed on the seating surface. The IC on the seating surface is held by means of a rotary latch having a shaft fixed to the base. The latch has an open position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC on the seating surface from above the IC. The socket has a cover arranged over the base and a linking member that links the cover and the latch. The cover is supported for movement between a first position which is close to the base and a second position which is removed from the base. The linking member opens the latch when the cover is at the first position and closes the latch when the cover is at the second position.




In a preferred embodiment of the invention, the rotary shaft of the latch is positioned below the seating surface of the adaptor. The cover preferably is normally biased away from the base to its second position. In this connection, preferably the straight line distance between the connecting point of the linking member and the latch and the rotary shaft of the latch varies in conformity with the position of the cover. In a specific example, the connecting point is guided by a slot formed in the latch which is elongated generally in the direction of the rotary shaft. Preferably, a guide is provided on the base so that the connecting point will be guided to a position which is close to the rotary shaft of the latch when the latch is opened and to a position which is away from the rotary shaft of the latch when the latch is closed. The base preferably has four sides, with a latch being provided adjacent to two opposed sides. It is desirable for the adaptor to comprise an assembly having a fixed mounting block, a movable adaptor member and spring members. The mounting block is fixed to the base for holding a plurality of contact members. The adaptor member has a seating surface for an IC device and is movably disposed on the mounting block, the adaptor member receiving the plurality of contact members within the seating surface and being supported in such a manner as to be in contact with or separated from the mounting block and the spring members bias the adaptor member in a direction away from the mounting block.




The plurality of contact members each has a tip part that contacts a respective terminal of a semiconductor device placed on the seating surface and a curved part that provides a compressive force to the tip part against the terminal, some of the plurality of contact makers having the curved parts arranged to extend in a first direction and others having the curved parts arranged to extend in a second direction. Preferably, approximately one half of the plurality of contact members have their curved parts arranged to extend in the first direction and approximately the remaining half have the curved part arranged to extend in the second direction. Preferably, the first direction and the second direction are opposite to each other. The plurality of contact members are preferably arranged in a plurality of rows and their curved parts face in a single direction within a row.




These and other objects and features of the invention will be apparent from the following description taken with reference to the accompanying drawings.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1A

is a top plan view of an electrical socket made in accordance with the invention,

FIG. 1B

is a front elevational view thereof and

FIG. 1C

is a side elevational view of the

FIG. 1A

socket;





FIG. 2

is a cross sectional view taken along line


2





2


in

FIG. 1A

showing an IC held thereon;





FIG. 3

is a cross sectional view taken along line


3





3


in

FIG. 1A

as specifically modified in

FIG. 8

showing an IC held thereon;





FIG. 4

is a view similar to

FIG. 2

but showing the

FIG. 1A

socket with the IC released;





FIG. 5

is a view similar to

FIG. 3

but showing the

FIG. 1A

socket with the IC released;





FIG. 6

is a bottom plan view of an IC that is to be mounted on a socket made in accordance with the invention;





FIGS. 7A and 7B

are enlarged portions of

FIGS. 5 and 3

respectively shown for the purpose of explaining the operation of the contact members;





FIG. 8

is a top plan view of an adaptor used in the

FIG. 1A

socket;





FIGS. 9A-9E

are schematic illustrations used in conjunction with a description of steps taken in assembling the base assembly;





FIGS. 10A-10C

are schematic illustrations used in conjunction with a description of steps taken in assembling the adaptor assembly;





FIGS. 11A and 11B

are schematic illustrations used in conjunction with a description of steps taken in assembling the socket;





FIG. 12

is an exploded cross sectional view of components of the socket as shown in

FIG. 2

;





FIG. 13

is a cross sectional view of a prior art electrical socket shown with the cover in the raised position; and





FIG. 14

is a cross sectional view similar to

FIG. 13

but showing the prior art socket with the cover closed.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT




The preferred embodiment of the invention will be explained below with reference to FIG.


1


A through FIG.


12


. Socket


10


is made basically by incorporating an adaptor assembly


16


(see FIG.


2


), including contact members


14


, into a base assembly


12


. Base assembly


12


comprises a base


18


, shaped in a suitable configuration, such as rectangular when viewed from above, formed of an electrically insulating material such as plastic. Base


18


has a recessed part


18




a


for receiving adaptor assembly


16


in the center of the base. The lower part of contact members


14


protrude from the lower surface of the base through holes


18




b


when the adaptor assembly is inserted into recess


18




a


. Socket


10


is placed on a printed circuit substrate, not shown in the drawing, and each contact member


14


is electrically connected to the circuit pattern on the substrate.




Base assembly


12


also includes a cover


20


, shaped in correspondence with base


18


, formed of an electrically insulating material such as plastic. Cover is movably mounted on base


18


toward and away from the base in a perpendicular direction. The center of cover


20


is formed with an opening


20




a


to permit insertion of IC


100


from above the socket. Four springs


21


are arranged at the corners of the socket between base


18


and cover


20


to bias the cover away from the base as shown in

FIGS. 1B

,


1


C and


2


. That is, the force of springs


21


cause cover


20


to normally assume a position which is raised relative to base


18


. When the cover is raised, an outwardly extending stop surface


18




d


of base


18


and an inwardly extending stop surface


20




b


of the cover are engaged (see FIG.


3


). Cover


20


is linked to base


18


through a pair of latches


22


and four links


24


that are included in base assembly


12


. The function of latches


22


is to fix or hold an IC


100


that has been placed inside socket


10


. The latches are rotatable between an opened position and a closed position in linkage with vertical movement of cover


20


by means of links


24


. Details of the latches


22


and their operation will be described below.




Adaptor assembly


16


includes contact members


14


, whose number and placement correspond to the number and placement of terminal pads


101


of an IC


100


that is to be tested (see FIG.


6


), a mounting block


26


that holds contact members


14


and an adaptor member


28


that is placed thereon. Mounting block


26


is made of an electrically insulating material such as plastic and has slots


26




a


for receipt of respective contact members


14


running vertically through the slots. Each contact member


14


is engaged and held at the lower portion of a hole


18




b


at an engagement part


14




a


which is located approximately at the center of the contact member. As shown in

FIGS. 3 and 5

, slots


26




a


are formed having an expanded width to allow curved part


14




b


of the contact members to freely assume a curved configuration therein. An engagement latch


26




b


is formed on the outer peripheral wall of mounting block


26


which is engaged with engagement latch


18




c


of base


18


to fixedly attach mounting block


26


to base


18


. Further, an inwardly extending engagement latch


26




c


is formed on the mounting block


26


and this engages with an outwardly extending engagement latch


28




a


of adaptor member


28


.




Adaptor member


28


is made of an electrically insulating material such as plastic and is arranged on mounting block


26


. Adaptor member


28


is vertically movable relative to mounting block


26


having a comparatively small stroke. Four coil springs


30


are placed between the base and adaptor member


28


to bias the adaptor member upwardly relative to mounting block


26


. When adaptor member


28


is raised, as shown in

FIG. 5

, engagement latch


26




c


of mounting block


26


and engagement latch


28




a


of adaptor


28


are engaged with each other thereby limiting the stroke of movement. Adaptor member


28


has a seating surface


28




b


for IC


100


on its upper surface. Seating surface


28




b


corresponds to the generally planar lower surface of IC


100


, with its periphery being defined by the lower end of wall


28




c


. Accordingly, an IC


100


that has been placed on seating surface


28




b


has its approximate position determined by wall


28




c


. As shown in

FIGS. 7A and 7B

, receiving holes


28




d


are located on seating surface


28




b


of adaptor


28


in conformity with the position of pads


101


of IC


100


. Tip


14




c


of each respective contact member


14


mounted in mounting block


28


protrudes slightly from a receiving hole


28




d


and it contacts a pad


101


of an IC on seating surface


28




b


. When the IC is held as shown in

FIGS. 2 and 3

, adaptor member


28


is depressed together with IC


100


by the force of latches


22


in opposition to the force of springs


30


. In this position, tip


14




c


of each contact member


14


is pushed down by a respective pad


101


of the IC, with a result that the force of contact between the pad and the contact member


14


is increased. Details of the operation of the contact members


14


as IC


100


is being depressed will be described infra.




Next, latches


22


and their operation will be explained. Each latch


22


is formed of an electrically insulating material such as plastic and has a selected length that extends along one of the sides of IC


100


(see

FIGS. 1A

,


3


and


5


) and, at the same time, its front elevation has a shape similar to the claw of a crab (see FIGS.


2


and


4


). As shown in

FIGS. 2 and 4

, latches


22


are arranged to face each other along two opposing sides of IC


100


and are rotatably supported on base


18


by means of respective shafts


32


. Each shaft


32


has both ends thereof installed in base


18


at a location lower than seating surface


28




b


of adaptor member


28


. A recessed portion


22




b


is formed on each latch


22


to avoid interference with adaptor member


28


as well as IC


100


so IC


100


can be depressed from above by tip


22




a


as shown in

FIG. 2

despite the position of the rotational fulcrum of shaft


32


. Two pairs of links


24


extend generally vertically downwardly supported by shafts


40


on cover


20


with each pair connected at their bottom portions to opposite ends of a respective latch


22


. An elongated slot


22




c


is provided in each latch


22


and a shaft


34


that is installed at the lower end portion of each link


24


is movably received through the slot. Slots


22




c


of latches


22


extend in such a direction that the respective shaft


34


can generally approach or move away from shaft


32


of the respective latch


22


. When latches


22


are closed as shown in

FIG. 2

, shafts


34


are located at the outer extremity of slots


22




c


at a position which is furthest away from shafts


32


and links


24


are approximately in a vertical position. When latches


22


are opened as shown in

FIG. 4

, shafts


34


are located at the inner extremity of slots


22




c


, or a position which is close to the respective shafts


32


with the bottom portion of links


24


pulled inwardly so that the links are tilted from the perpendicular direction. A guide groove


36


is formed in base


18


for guiding the bottom of each link


24


and respective shaft


34


, i.e., connecting point, when cover


20


is moved. When cover


20


is pressed downwardly from the

FIG. 2

to the

FIG. 4

positions, the lower end of links


24


and both ends of the respective shafts


34


are guided toward the center of base


18


along the bottom surface of the respective guide groove


36


toward a position below the respective shaft


32


. When cover


20


has been raised upwardly as shown in

FIG. 2

, they are guided toward the outside of base


18


along the bottom surface of guide grooves


36


. The bottom surface of guide grooves


36


comprise two steps for the purpose of guiding the lower end of links


24


and shafts


34


.




Next, the procedures for mounting IC


100


on socket


10


and the operation of the socket will be explained. When no external force is applied to cover


20


, socket


10


is in the state shown in

FIGS. 2 and 3

. For the purpose of this explanation, it is assumed that IC


100


has not yet been received on the socket. In this state, cover


20


is in the raised position relative to base


18


by the force of springs


21


and latches


22


are closed. When cover


20


is pressed downwardly toward base


18


by an automatic unit, not shown in the drawing, the bottom of links


24


start on their guided path toward the center of the base in conformity with guide grooves


36


. Along with movement of the lower end of links


24


, latches


22


tart their outwardly rotation. Shafts


34


of links


24


that have been guided by slots


22




c


gradually move toward the respective shaft


32


of the latches. When cover


20


has completed its downwardly movement as shown in

FIGS. 4 and 5

, latches


22


are rotated approximately 90°, with their tips


22




a


completely removed from the seating surface of adaptor member


28


. Socket


10


can then receive IC


100


from above. In this state, adaptor member


28


has been raised upwardly by the force of springs


30


.




The IC


100


that is supplied onto adaptor member


28


through opening


20




a


of cover


20


is positioned and arranged on the seating surface


28




b


with each pad


101


of the IC


100


lightly engaging the tip


14




c


of a contact member


14


that extends through a respective receiving hole


28




d


of adaptor member


28


. When the downward force on cover


20


is removed, the cover rises due to the force of springs


21


pulling links


24


upwardly and their bottom portions shifting toward the outside of base


18


in conformity with guide groove


36


. Along with this, latches


22


are rotated about shafts


32


with their tips


22




a


extending toward the top of IC


100


and finally pressing down IC


100


from above as shown in

FIGS. 2 and 3

. Because of the compressive force from latches


22


, adaptor member


28


is pushed down against the force of springs


30


so that the curve of each contact member


14


at intermediate portions


14


b is increased along with the contact force with the respective pads


101


of the IC.




Details of contact members


14


in the

FIGS. 5 and 3

positions are shown respectively in

FIGS. 7A and 7B

. Each receiving hole


28




d


is enlarged along its width on the seating surface side at


70


and has an enlarged tapered opening


72


on the side opposite to seating surface


28




b


. Accordingly, tip


14




c


of each respective contact member


14


is held by a narrow supporting neck part


74


located between the enlarged openings


70


and


72


. Due to the curve of each curved part


14




b


conforming to the vertical movement of adaptor


28


, the orientation of each tip


14




c


shifts laterally, albeit slightly, using support part


74


as a fulcrum. In other words, the point of engagement of contact members


14


with pads


101


shift because of the enlarged opening at


70


. When adaptor


28


has been lowered, therefore, tips


14




c


of contact members


14


move horizontally, while maintaining their engagement with the respective pads


101


of IC


100


as shown in FIG.


7


B. As a result of this, tips


14




c


of the contact members wipe the surfaces of pads


101


. Because of this wiping acting, the electrical reliability of the connection at the tips is enhanced.





FIG. 8

, a plan view of adaptor assembly


16


, shows adaptor member


28


with seating surface


28




b


for IC


100


, walls


28




c


around the seating surface and the receiving holes


28




d


for the contact members formed in the seating surface. The receiving holes


28




d


on the seating surface


28




b


are arranged in four rows in the longitudinal direction at locations in conformity with the pads


101


of IC


100


as shown in FIG.


6


. Tip


14




c


of each contact member


14


is inserted in a respective receiving hole


28




d


, as described earlier, subsequent to the preparation of the adaptor assembly; however, the contact members are disposed so that the curved portions


14




b


extend in different directions in the two rows of receiving holes on the outside and the two rows of receiving holes on the inside. In other words, the curved part


14




b


of each contact member


14


is inserted in such a way as to form a convex configuration in a first or right-hand direction for the two rows of receiving holes


28




d


on the outside, while the curved part


14




b


is inserted in such a manner as to form a convex configuration in the opposite, second or left hand direction for the two rows of receiving holes


28




d


on the inside. This is clearly shown in

FIGS. 3 and 5

which show the cross section taken along line


3





3


in

FIG. 8

showing the adaptor assembly


16


. The wiping at tips


14




c


of the contact members tend to move IC


100


in a given direction. In a case where the orientation of the curved portions of the contact members


14


is the same, despite the fact that IC


100


is held by latch


22


, a positional shift of the IC


100


can occur thereby making it impossible to effectively achieve optimum effect of the wiping. Thus, by changing the orientational direction of the contact members


14


as described above, the forces for causing the positional shift on the part of IC


100


are offset.




Next, the assembling of socket


10


will be explained below by referring to

FIGS. 9A through 12

. Socket


10


is composed of base assembly


12


and adaptor assembly


16


, with each assembly being built in parallel, followed by the incorporation of the adaptor assembly into the base assembly.

FIGS. 9A-9E

show the procedures for assembling base assembly


12


. In the initial assembly step,

FIG. 9A

, four links


24


are installed on cover


20


by using shafts


40


. In the assembly step

FIG. 9B

, latches


22


are arranged between a respective pair of links


24


, and as shaft


34


is inserted into each respective pair, cover


20


is attached to the latches. In this manner, the cover assembly


38


is completed. In the next assembly step,

FIG. 9D

, cover assembly


38


is installed on base


18


through four springs


21


. In this case, stop surface


20




b


on the sides of the cover are engaged with stop surface


18




d


on the sides of the base, with a result that cover assembly


38


is attached in such a manner as to be capable of vertical movement relative to base


18


. In the assembly step

FIG. 9E

, rotary shaft


32


is inserted from the side of base


18


and each latch


22


is rotatably installed on base


18


. In this manner, the assembly is completed.





FIGS. 10A-10C

show the order of the assembling of adaptor assembly


16


. In the initial assembling step

FIG. 1A

, adaptor member


28


is installed on mounting block


26


through four springs


30


. In this connection, engaging latch


28




a


on the sides of the adaptor member engage with the engaging latch


26




c


(not shown in

FIG. 10A

) on the side of the mounting block, thereby making it possible for adaptor member


28


to be mounted on mounting block


26


in such a fashion as to be vertically movable relative to the mounting block.




In the assembly step

FIG. 10B

, the mounting block and adaptor member are inverted and contact members


14


are placed inside mounting block


26


by employing a pedestal


110


. In this manner, the adaptor assembly


16


is completed as seen in FIG.


10


C.

FIGS. 11A

,


11


B show the final assembling steps for socket


10


. With reference to

FIG. 11A

, the adaptor assembly


16


that has been assembled as shown in

FIG. 10C

is incorporated, from above, into base assembly


12


that has been assembled in the steps shown in

FIGS. 9A-9E

above. At this juncture, the engagement latch


18




c


on the side of the base assembly and the engagement latch


26




b


on the side of the adaptor assembly are engaged with each other. (Reference should be made to

FIGS. 3 and 5

.)




In this manner, socket


10


is finally assembled as indicated in FIG.


11


B. Thus, the assembling of base assembly


12


(in steps shown in

FIGS. 9A-9E

) and the assembling of adaptor assembly


16


(in steps shown in

FIGS. 10A-10C

) can be carried out in parallel, thereby achieving high assembly efficiency.




A drawing of socket


10


corresponding to

FIG. 2

is shown in

FIG. 12

showing adaptor assembly


16


, cover assembly


38


and base


18


separated from one another. Cover assembly


38


is installed on base


18


in accordance with the steps described earlier and adaptor assembly


16


is then installed.




The preferred embodiment of this invention has been explained above by referring to the attached drawings. It is obvious that the scope of the invention is not intended to be limited to the specifics of what has been described in the above embodiment. In the described embodiment, a socket for an IC whose number of terminals is comparatively small was used. However, it will be clear to those in the industry that sockets made according to the invention can also be used with IC's having a greater number of terminals.




According to the invention which has been explained in detail above, the outside shape of the socket as compared with the size of the IC to be tested can be decreased. According to the invention, the socket is composed of a plurality of assemblies, with a result that the time required for assembling the socket can be shortened. Further, according to the invention, the wiping at the tip of the contact maker can be carried out effectively and, accordingly, the connective reliability for the IC terminals can be improved.




It is the intention that the invention include all modifications and equivalents of the disclosed embodiment falling within the scope of the claims.



Claims
  • 1. A socket for use with a semiconductor device having a plurality of terminals on at least one surface comprising a base, an adaptor member received on the base having a seating surface for a semiconductor device, the adaptor member having a plurality of contact member receiving holes extending through the seating surface, a plurality of contact members having tips received in each of the contact member receiving holes to be placed in contact with each terminal of the semiconductor device placed on the seating surface, a rotary latch having a rotational axis fixed to the base and having an opened position away from the seating surface to enable the semiconductor device to be placed on the seating surface of the adaptor member and a closed position at the seating surface to enable the semiconductor device on the seating surface to be held from above, a cover which is arranged on the base and supported for movement between a first position which is close to the base and a second position which is separated from the base, and a link having one coupling mechanism connecting the link to the cover and another coupling mechanism connecting the link to the rotary latch which opens the rotary latch when the cover is at the first position and closes the rotary latch when the cover is at the second position, the coupling mechanism connecting the link to the rotary latch comprising a slot in the rotary latch which extends generally toward and away from the rotational axis of the rotary latch.
  • 2. A socket according to claim 1 further comprising a spring for biasing the cover toward the second position.
  • 3. A socket according to claim 1 wherein the base is formed with a guide surface for guiding the coupling mechanism of the link to the rotary latch to a position which is located closer to the rotational axis of the rotary latch when the rotary latch is opened and to a position which is separated from the rotational axis of the rotary latch when the rotary latch is closed.
  • 4. A socket according to claim 1 wherein the base has four sides and a rotary latch is provided on at least two opposing sides of the base.
  • 5. A socket according claim 1 further comprising a mounting block that holds the plurality of contact members, the mounting block being fixed to the base, the adaptor member being movable toward and away from the mounting block and a spring member biasing the adaptor member in a direction away from the mounting block.
  • 6. A socket according to claim 1 wherein the rotational axis of the rotary latch is positioned below the seating surface of the adaptor member.
  • 7. A socket according to claim 6 wherein a straight line distance between the coupling mechanism of the link to the cover and the rotational axis of the rotary latch varies in conformity with the position of the cover.
  • 8. A socket according to claim 1 wherein the contact members have a convex configuration along their length with the tip parts being forced downwardly into the contact member receiving holes when the semiconductor device is placed on the seating surface, some of the plurality of contact members having the convex configuration facing in a first direction and other contact members having the convex configuration facing in second, different, direction.
  • 9. A socket according to claim 8 in which the plurality of contact members are arranged in a plurality of rows, with the convex configuration facing in the same direction in a given row.
  • 10. A socket according to claim 8 further comprising a mounting block fixed to the base, the adaptor member being movable toward and away from the mounting block and a spring member placing a bias on the adaptor member in a direction away from the mounting block.
  • 11. A socket as described in claim 8 in which approximately half of the plurality of contact members have their convex configuration facing in the first direction and approximately the remaining half have their convex configurations facing in the second, different, direction.
  • 12. A socket according to claim 11 in which the first direction and second, different, direction are opposite to each other.
Priority Claims (1)
Number Date Country Kind
11-366574 Dec 1999 JP
US Referenced Citations (4)
Number Name Date Kind
5697795 Abe Dec 1997
5718595 Tohyama et al. Feb 1998
5752846 Abe May 1998
5865639 Fuchigami et al. Feb 1999