Information
-
Patent Grant
-
6322384
-
Patent Number
6,322,384
-
Date Filed
Friday, November 3, 200024 years ago
-
Date Issued
Tuesday, November 27, 200123 years ago
-
Inventors
-
Original Assignees
-
Examiners
Agents
- Baumann; Russell E.
- Telecky, Jr.; Frederick J.
-
CPC
-
US Classifications
Field of Search
US
- 439 330
- 439 331
- 439 264
- 439 266
- 439 70
- 439 71
-
International Classifications
-
Abstract
A socket (10) includes an adaptor (28) which has a seating surface (28b) for an IC (100) and which has a plurality of contact member receiving holes (28d) in the seating surface. The tips (14c) of a plurality of contact members (14) are received through the contact member receiving holes (28d) of the adaptor, with contact established with each respective terminal (101) of the IC (100) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (22). The latches (22) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (32) fixed to the base. A cover (20) is movable between first and second positions and a links (24) connected to the cover (24) open the latches when the cover is at a first position and close the latches when the cover is at a second position.
Description
FIELD OF THE INVENTION
This inventions relates generally to a socket suitable for removably receiving an electrical part such as an integrated circuit (IC) having a plurality of terminals of the LGA or BGA, etc., type and more particularly to a socket for use in a burn-in test of the IC.
BACKGROUND OF THE INVENTION
Various tests are conducted for the purpose of identifying and discarding those IC packages that do not meet the required specifications for newly manufactured semiconductor integrated circuits. The burn-in procedure tests the IC's heat resistance properties by causing them to perform for a certain period of time at high temperature, thereby making it possible to cull out those that do not meet the required specifications. In a burn-in test, the IC is mounted on the socket that has been prepared exclusively for that purpose and the socket is in turn mounted on a printed circuit substrate for placement in a heating oven. Various kinds of sockets have been proposed for use in burn-in tests of IC packages of the LGA (Land Grid Array) or BGA (Ball Grid Array) types which have become popular in recent years. Basically, such sockets have a base member made of an insulating material and have a plurality of contact members that correspond to the terminals arranged on one surface of the IC. The contact members are arranged on the seating surface of the socket to correspond to each terminal of the IC to be brought in touch with the same when the IC has been placed on the seating surface. In a typical kind of socket, a cover is provided for holding the IC on the seating surface, with the IC being held on and removed from the seating surface by moving the cover up and down.
With reference to
FIGS. 13 and 14
, one such prior art socket has one side of a cover
142
rotatably supported on a base
141
. When cover
142
is opened as shown in
FIG. 14
, IC
100
is placed onto seating surface
141
a
and cover
142
is closed by means of an automatic unit, not shown in the drawing. A hook
143
is engaged with a latch on base
141
to maintain cover
142
in a closed position. IC
100
on seating
141
a
is compressed from above by a compression surface
142
a
inside cover
142
, with the terminals of the IC brought into engagement with the tip of respective contact members.
A problem with this type of socket is that when closing cover
142
, compression surface
142
a
approaches the base in a way which is inclined Is relative to IC
100
with a result that a bias load is applied to the IC. This biased load can damage the IC itself and, at the same time, can result in an uneven compressive force of the contact elements
144
against the terminals of the IC. In addition, the construction of the automatic unit for the switching action of cover
142
is complicated.
Another type of prior art socket is equipped with a mechanism for the vertical movement of the cover member relative to the base member and a latch that opens or closes in linkage with the movement of the cover. It is generally the case that the latch opens when the cover member is lowered, thereby making it possible for the IC to be placed on the seating surface of the base and closes when the cover member is elevated, thereby making it possible for the IC on the seating surface to be held from above.
This type of socket is subject to the following limitations:
(1) The latch needs to have its holding portions extend onto the upper surface of the IC when it is closed and recede from the upper surface of the IC hen it is opened. In order to realize this mechanism, usually a latch and a driving mechanism therefor are arranged around the seating surface of the IC. Because of this, there is a tendency to increase the external size of the socket.
(2) This type of socket for use in burn-in tests has a comparatively large number of parts requiring much time for its assembly.
(3) In this type of socket, the contact members have a curved part pressed against the terminals of the IC with a spring force based on the bending of the curved part when they are pressed. Along with an ever-increasing density of the IC terminals, there is a concomitant demand for the socket to have a contact member with high connective reliability.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide a socket whose outside shape is comparatively small relative to the size of the IC that is to be tested. Another object of the invention is the provision of a socket which is easily and quickly assembled. Still another object of the invention is the provision of a socket having increased reliability of contact engagement of contact members with the terminals of the IC.
The invention relates to a socket for use with an IC having a plurality of terminals on at least one surface thereof. A socket made according to the invention has a seating surface for the IC on an adaptor received on a base with the adaptor being provided in such a way as to have a plurality of contact member receiving holes on the seating surface. The tips of a plurality of contact members corresponding to the terminals of the IC are received through the contact member receiving holes of the adaptor, thereby establishing contact with each terminal of the IC that has been placed on the seating surface. The IC on the seating surface is held by means of a rotary latch having a shaft fixed to the base. The latch has an open position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC on the seating surface from above the IC. The socket has a cover arranged over the base and a linking member that links the cover and the latch. The cover is supported for movement between a first position which is close to the base and a second position which is removed from the base. The linking member opens the latch when the cover is at the first position and closes the latch when the cover is at the second position.
In a preferred embodiment of the invention, the rotary shaft of the latch is positioned below the seating surface of the adaptor. The cover preferably is normally biased away from the base to its second position. In this connection, preferably the straight line distance between the connecting point of the linking member and the latch and the rotary shaft of the latch varies in conformity with the position of the cover. In a specific example, the connecting point is guided by a slot formed in the latch which is elongated generally in the direction of the rotary shaft. Preferably, a guide is provided on the base so that the connecting point will be guided to a position which is close to the rotary shaft of the latch when the latch is opened and to a position which is away from the rotary shaft of the latch when the latch is closed. The base preferably has four sides, with a latch being provided adjacent to two opposed sides. It is desirable for the adaptor to comprise an assembly having a fixed mounting block, a movable adaptor member and spring members. The mounting block is fixed to the base for holding a plurality of contact members. The adaptor member has a seating surface for an IC device and is movably disposed on the mounting block, the adaptor member receiving the plurality of contact members within the seating surface and being supported in such a manner as to be in contact with or separated from the mounting block and the spring members bias the adaptor member in a direction away from the mounting block.
The plurality of contact members each has a tip part that contacts a respective terminal of a semiconductor device placed on the seating surface and a curved part that provides a compressive force to the tip part against the terminal, some of the plurality of contact makers having the curved parts arranged to extend in a first direction and others having the curved parts arranged to extend in a second direction. Preferably, approximately one half of the plurality of contact members have their curved parts arranged to extend in the first direction and approximately the remaining half have the curved part arranged to extend in the second direction. Preferably, the first direction and the second direction are opposite to each other. The plurality of contact members are preferably arranged in a plurality of rows and their curved parts face in a single direction within a row.
These and other objects and features of the invention will be apparent from the following description taken with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A
is a top plan view of an electrical socket made in accordance with the invention,
FIG. 1B
is a front elevational view thereof and
FIG. 1C
is a side elevational view of the
FIG. 1A
socket;
FIG. 2
is a cross sectional view taken along line
2
—
2
in
FIG. 1A
showing an IC held thereon;
FIG. 3
is a cross sectional view taken along line
3
—
3
in
FIG. 1A
as specifically modified in
FIG. 8
showing an IC held thereon;
FIG. 4
is a view similar to
FIG. 2
but showing the
FIG. 1A
socket with the IC released;
FIG. 5
is a view similar to
FIG. 3
but showing the
FIG. 1A
socket with the IC released;
FIG. 6
is a bottom plan view of an IC that is to be mounted on a socket made in accordance with the invention;
FIGS. 7A and 7B
are enlarged portions of
FIGS. 5 and 3
respectively shown for the purpose of explaining the operation of the contact members;
FIG. 8
is a top plan view of an adaptor used in the
FIG. 1A
socket;
FIGS. 9A-9E
are schematic illustrations used in conjunction with a description of steps taken in assembling the base assembly;
FIGS. 10A-10C
are schematic illustrations used in conjunction with a description of steps taken in assembling the adaptor assembly;
FIGS. 11A and 11B
are schematic illustrations used in conjunction with a description of steps taken in assembling the socket;
FIG. 12
is an exploded cross sectional view of components of the socket as shown in
FIG. 2
;
FIG. 13
is a cross sectional view of a prior art electrical socket shown with the cover in the raised position; and
FIG. 14
is a cross sectional view similar to
FIG. 13
but showing the prior art socket with the cover closed.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The preferred embodiment of the invention will be explained below with reference to FIG.
1
A through FIG.
12
. Socket
10
is made basically by incorporating an adaptor assembly
16
(see FIG.
2
), including contact members
14
, into a base assembly
12
. Base assembly
12
comprises a base
18
, shaped in a suitable configuration, such as rectangular when viewed from above, formed of an electrically insulating material such as plastic. Base
18
has a recessed part
18
a
for receiving adaptor assembly
16
in the center of the base. The lower part of contact members
14
protrude from the lower surface of the base through holes
18
b
when the adaptor assembly is inserted into recess
18
a
. Socket
10
is placed on a printed circuit substrate, not shown in the drawing, and each contact member
14
is electrically connected to the circuit pattern on the substrate.
Base assembly
12
also includes a cover
20
, shaped in correspondence with base
18
, formed of an electrically insulating material such as plastic. Cover is movably mounted on base
18
toward and away from the base in a perpendicular direction. The center of cover
20
is formed with an opening
20
a
to permit insertion of IC
100
from above the socket. Four springs
21
are arranged at the corners of the socket between base
18
and cover
20
to bias the cover away from the base as shown in
FIGS. 1B
,
1
C and
2
. That is, the force of springs
21
cause cover
20
to normally assume a position which is raised relative to base
18
. When the cover is raised, an outwardly extending stop surface
18
d
of base
18
and an inwardly extending stop surface
20
b
of the cover are engaged (see FIG.
3
). Cover
20
is linked to base
18
through a pair of latches
22
and four links
24
that are included in base assembly
12
. The function of latches
22
is to fix or hold an IC
100
that has been placed inside socket
10
. The latches are rotatable between an opened position and a closed position in linkage with vertical movement of cover
20
by means of links
24
. Details of the latches
22
and their operation will be described below.
Adaptor assembly
16
includes contact members
14
, whose number and placement correspond to the number and placement of terminal pads
101
of an IC
100
that is to be tested (see FIG.
6
), a mounting block
26
that holds contact members
14
and an adaptor member
28
that is placed thereon. Mounting block
26
is made of an electrically insulating material such as plastic and has slots
26
a
for receipt of respective contact members
14
running vertically through the slots. Each contact member
14
is engaged and held at the lower portion of a hole
18
b
at an engagement part
14
a
which is located approximately at the center of the contact member. As shown in
FIGS. 3 and 5
, slots
26
a
are formed having an expanded width to allow curved part
14
b
of the contact members to freely assume a curved configuration therein. An engagement latch
26
b
is formed on the outer peripheral wall of mounting block
26
which is engaged with engagement latch
18
c
of base
18
to fixedly attach mounting block
26
to base
18
. Further, an inwardly extending engagement latch
26
c
is formed on the mounting block
26
and this engages with an outwardly extending engagement latch
28
a
of adaptor member
28
.
Adaptor member
28
is made of an electrically insulating material such as plastic and is arranged on mounting block
26
. Adaptor member
28
is vertically movable relative to mounting block
26
having a comparatively small stroke. Four coil springs
30
are placed between the base and adaptor member
28
to bias the adaptor member upwardly relative to mounting block
26
. When adaptor member
28
is raised, as shown in
FIG. 5
, engagement latch
26
c
of mounting block
26
and engagement latch
28
a
of adaptor
28
are engaged with each other thereby limiting the stroke of movement. Adaptor member
28
has a seating surface
28
b
for IC
100
on its upper surface. Seating surface
28
b
corresponds to the generally planar lower surface of IC
100
, with its periphery being defined by the lower end of wall
28
c
. Accordingly, an IC
100
that has been placed on seating surface
28
b
has its approximate position determined by wall
28
c
. As shown in
FIGS. 7A and 7B
, receiving holes
28
d
are located on seating surface
28
b
of adaptor
28
in conformity with the position of pads
101
of IC
100
. Tip
14
c
of each respective contact member
14
mounted in mounting block
28
protrudes slightly from a receiving hole
28
d
and it contacts a pad
101
of an IC on seating surface
28
b
. When the IC is held as shown in
FIGS. 2 and 3
, adaptor member
28
is depressed together with IC
100
by the force of latches
22
in opposition to the force of springs
30
. In this position, tip
14
c
of each contact member
14
is pushed down by a respective pad
101
of the IC, with a result that the force of contact between the pad and the contact member
14
is increased. Details of the operation of the contact members
14
as IC
100
is being depressed will be described infra.
Next, latches
22
and their operation will be explained. Each latch
22
is formed of an electrically insulating material such as plastic and has a selected length that extends along one of the sides of IC
100
(see
FIGS. 1A
,
3
and
5
) and, at the same time, its front elevation has a shape similar to the claw of a crab (see FIGS.
2
and
4
). As shown in
FIGS. 2 and 4
, latches
22
are arranged to face each other along two opposing sides of IC
100
and are rotatably supported on base
18
by means of respective shafts
32
. Each shaft
32
has both ends thereof installed in base
18
at a location lower than seating surface
28
b
of adaptor member
28
. A recessed portion
22
b
is formed on each latch
22
to avoid interference with adaptor member
28
as well as IC
100
so IC
100
can be depressed from above by tip
22
a
as shown in
FIG. 2
despite the position of the rotational fulcrum of shaft
32
. Two pairs of links
24
extend generally vertically downwardly supported by shafts
40
on cover
20
with each pair connected at their bottom portions to opposite ends of a respective latch
22
. An elongated slot
22
c
is provided in each latch
22
and a shaft
34
that is installed at the lower end portion of each link
24
is movably received through the slot. Slots
22
c
of latches
22
extend in such a direction that the respective shaft
34
can generally approach or move away from shaft
32
of the respective latch
22
. When latches
22
are closed as shown in
FIG. 2
, shafts
34
are located at the outer extremity of slots
22
c
at a position which is furthest away from shafts
32
and links
24
are approximately in a vertical position. When latches
22
are opened as shown in
FIG. 4
, shafts
34
are located at the inner extremity of slots
22
c
, or a position which is close to the respective shafts
32
with the bottom portion of links
24
pulled inwardly so that the links are tilted from the perpendicular direction. A guide groove
36
is formed in base
18
for guiding the bottom of each link
24
and respective shaft
34
, i.e., connecting point, when cover
20
is moved. When cover
20
is pressed downwardly from the
FIG. 2
to the
FIG. 4
positions, the lower end of links
24
and both ends of the respective shafts
34
are guided toward the center of base
18
along the bottom surface of the respective guide groove
36
toward a position below the respective shaft
32
. When cover
20
has been raised upwardly as shown in
FIG. 2
, they are guided toward the outside of base
18
along the bottom surface of guide grooves
36
. The bottom surface of guide grooves
36
comprise two steps for the purpose of guiding the lower end of links
24
and shafts
34
.
Next, the procedures for mounting IC
100
on socket
10
and the operation of the socket will be explained. When no external force is applied to cover
20
, socket
10
is in the state shown in
FIGS. 2 and 3
. For the purpose of this explanation, it is assumed that IC
100
has not yet been received on the socket. In this state, cover
20
is in the raised position relative to base
18
by the force of springs
21
and latches
22
are closed. When cover
20
is pressed downwardly toward base
18
by an automatic unit, not shown in the drawing, the bottom of links
24
start on their guided path toward the center of the base in conformity with guide grooves
36
. Along with movement of the lower end of links
24
, latches
22
tart their outwardly rotation. Shafts
34
of links
24
that have been guided by slots
22
c
gradually move toward the respective shaft
32
of the latches. When cover
20
has completed its downwardly movement as shown in
FIGS. 4 and 5
, latches
22
are rotated approximately 90°, with their tips
22
a
completely removed from the seating surface of adaptor member
28
. Socket
10
can then receive IC
100
from above. In this state, adaptor member
28
has been raised upwardly by the force of springs
30
.
The IC
100
that is supplied onto adaptor member
28
through opening
20
a
of cover
20
is positioned and arranged on the seating surface
28
b
with each pad
101
of the IC
100
lightly engaging the tip
14
c
of a contact member
14
that extends through a respective receiving hole
28
d
of adaptor member
28
. When the downward force on cover
20
is removed, the cover rises due to the force of springs
21
pulling links
24
upwardly and their bottom portions shifting toward the outside of base
18
in conformity with guide groove
36
. Along with this, latches
22
are rotated about shafts
32
with their tips
22
a
extending toward the top of IC
100
and finally pressing down IC
100
from above as shown in
FIGS. 2 and 3
. Because of the compressive force from latches
22
, adaptor member
28
is pushed down against the force of springs
30
so that the curve of each contact member
14
at intermediate portions
14
b is increased along with the contact force with the respective pads
101
of the IC.
Details of contact members
14
in the
FIGS. 5 and 3
positions are shown respectively in
FIGS. 7A and 7B
. Each receiving hole
28
d
is enlarged along its width on the seating surface side at
70
and has an enlarged tapered opening
72
on the side opposite to seating surface
28
b
. Accordingly, tip
14
c
of each respective contact member
14
is held by a narrow supporting neck part
74
located between the enlarged openings
70
and
72
. Due to the curve of each curved part
14
b
conforming to the vertical movement of adaptor
28
, the orientation of each tip
14
c
shifts laterally, albeit slightly, using support part
74
as a fulcrum. In other words, the point of engagement of contact members
14
with pads
101
shift because of the enlarged opening at
70
. When adaptor
28
has been lowered, therefore, tips
14
c
of contact members
14
move horizontally, while maintaining their engagement with the respective pads
101
of IC
100
as shown in FIG.
7
B. As a result of this, tips
14
c
of the contact members wipe the surfaces of pads
101
. Because of this wiping acting, the electrical reliability of the connection at the tips is enhanced.
FIG. 8
, a plan view of adaptor assembly
16
, shows adaptor member
28
with seating surface
28
b
for IC
100
, walls
28
c
around the seating surface and the receiving holes
28
d
for the contact members formed in the seating surface. The receiving holes
28
d
on the seating surface
28
b
are arranged in four rows in the longitudinal direction at locations in conformity with the pads
101
of IC
100
as shown in FIG.
6
. Tip
14
c
of each contact member
14
is inserted in a respective receiving hole
28
d
, as described earlier, subsequent to the preparation of the adaptor assembly; however, the contact members are disposed so that the curved portions
14
b
extend in different directions in the two rows of receiving holes on the outside and the two rows of receiving holes on the inside. In other words, the curved part
14
b
of each contact member
14
is inserted in such a way as to form a convex configuration in a first or right-hand direction for the two rows of receiving holes
28
d
on the outside, while the curved part
14
b
is inserted in such a manner as to form a convex configuration in the opposite, second or left hand direction for the two rows of receiving holes
28
d
on the inside. This is clearly shown in
FIGS. 3 and 5
which show the cross section taken along line
3
—
3
in
FIG. 8
showing the adaptor assembly
16
. The wiping at tips
14
c
of the contact members tend to move IC
100
in a given direction. In a case where the orientation of the curved portions of the contact members
14
is the same, despite the fact that IC
100
is held by latch
22
, a positional shift of the IC
100
can occur thereby making it impossible to effectively achieve optimum effect of the wiping. Thus, by changing the orientational direction of the contact members
14
as described above, the forces for causing the positional shift on the part of IC
100
are offset.
Next, the assembling of socket
10
will be explained below by referring to
FIGS. 9A through 12
. Socket
10
is composed of base assembly
12
and adaptor assembly
16
, with each assembly being built in parallel, followed by the incorporation of the adaptor assembly into the base assembly.
FIGS. 9A-9E
show the procedures for assembling base assembly
12
. In the initial assembly step,
FIG. 9A
, four links
24
are installed on cover
20
by using shafts
40
. In the assembly step
FIG. 9B
, latches
22
are arranged between a respective pair of links
24
, and as shaft
34
is inserted into each respective pair, cover
20
is attached to the latches. In this manner, the cover assembly
38
is completed. In the next assembly step,
FIG. 9D
, cover assembly
38
is installed on base
18
through four springs
21
. In this case, stop surface
20
b
on the sides of the cover are engaged with stop surface
18
d
on the sides of the base, with a result that cover assembly
38
is attached in such a manner as to be capable of vertical movement relative to base
18
. In the assembly step
FIG. 9E
, rotary shaft
32
is inserted from the side of base
18
and each latch
22
is rotatably installed on base
18
. In this manner, the assembly is completed.
FIGS. 10A-10C
show the order of the assembling of adaptor assembly
16
. In the initial assembling step
FIG. 1A
, adaptor member
28
is installed on mounting block
26
through four springs
30
. In this connection, engaging latch
28
a
on the sides of the adaptor member engage with the engaging latch
26
c
(not shown in
FIG. 10A
) on the side of the mounting block, thereby making it possible for adaptor member
28
to be mounted on mounting block
26
in such a fashion as to be vertically movable relative to the mounting block.
In the assembly step
FIG. 10B
, the mounting block and adaptor member are inverted and contact members
14
are placed inside mounting block
26
by employing a pedestal
110
. In this manner, the adaptor assembly
16
is completed as seen in FIG.
10
C.
FIGS. 11A
,
11
B show the final assembling steps for socket
10
. With reference to
FIG. 11A
, the adaptor assembly
16
that has been assembled as shown in
FIG. 10C
is incorporated, from above, into base assembly
12
that has been assembled in the steps shown in
FIGS. 9A-9E
above. At this juncture, the engagement latch
18
c
on the side of the base assembly and the engagement latch
26
b
on the side of the adaptor assembly are engaged with each other. (Reference should be made to
FIGS. 3 and 5
.)
In this manner, socket
10
is finally assembled as indicated in FIG.
11
B. Thus, the assembling of base assembly
12
(in steps shown in
FIGS. 9A-9E
) and the assembling of adaptor assembly
16
(in steps shown in
FIGS. 10A-10C
) can be carried out in parallel, thereby achieving high assembly efficiency.
A drawing of socket
10
corresponding to
FIG. 2
is shown in
FIG. 12
showing adaptor assembly
16
, cover assembly
38
and base
18
separated from one another. Cover assembly
38
is installed on base
18
in accordance with the steps described earlier and adaptor assembly
16
is then installed.
The preferred embodiment of this invention has been explained above by referring to the attached drawings. It is obvious that the scope of the invention is not intended to be limited to the specifics of what has been described in the above embodiment. In the described embodiment, a socket for an IC whose number of terminals is comparatively small was used. However, it will be clear to those in the industry that sockets made according to the invention can also be used with IC's having a greater number of terminals.
According to the invention which has been explained in detail above, the outside shape of the socket as compared with the size of the IC to be tested can be decreased. According to the invention, the socket is composed of a plurality of assemblies, with a result that the time required for assembling the socket can be shortened. Further, according to the invention, the wiping at the tip of the contact maker can be carried out effectively and, accordingly, the connective reliability for the IC terminals can be improved.
It is the intention that the invention include all modifications and equivalents of the disclosed embodiment falling within the scope of the claims.
Claims
- 1. A socket for use with a semiconductor device having a plurality of terminals on at least one surface comprising a base, an adaptor member received on the base having a seating surface for a semiconductor device, the adaptor member having a plurality of contact member receiving holes extending through the seating surface, a plurality of contact members having tips received in each of the contact member receiving holes to be placed in contact with each terminal of the semiconductor device placed on the seating surface, a rotary latch having a rotational axis fixed to the base and having an opened position away from the seating surface to enable the semiconductor device to be placed on the seating surface of the adaptor member and a closed position at the seating surface to enable the semiconductor device on the seating surface to be held from above, a cover which is arranged on the base and supported for movement between a first position which is close to the base and a second position which is separated from the base, and a link having one coupling mechanism connecting the link to the cover and another coupling mechanism connecting the link to the rotary latch which opens the rotary latch when the cover is at the first position and closes the rotary latch when the cover is at the second position, the coupling mechanism connecting the link to the rotary latch comprising a slot in the rotary latch which extends generally toward and away from the rotational axis of the rotary latch.
- 2. A socket according to claim 1 further comprising a spring for biasing the cover toward the second position.
- 3. A socket according to claim 1 wherein the base is formed with a guide surface for guiding the coupling mechanism of the link to the rotary latch to a position which is located closer to the rotational axis of the rotary latch when the rotary latch is opened and to a position which is separated from the rotational axis of the rotary latch when the rotary latch is closed.
- 4. A socket according to claim 1 wherein the base has four sides and a rotary latch is provided on at least two opposing sides of the base.
- 5. A socket according claim 1 further comprising a mounting block that holds the plurality of contact members, the mounting block being fixed to the base, the adaptor member being movable toward and away from the mounting block and a spring member biasing the adaptor member in a direction away from the mounting block.
- 6. A socket according to claim 1 wherein the rotational axis of the rotary latch is positioned below the seating surface of the adaptor member.
- 7. A socket according to claim 6 wherein a straight line distance between the coupling mechanism of the link to the cover and the rotational axis of the rotary latch varies in conformity with the position of the cover.
- 8. A socket according to claim 1 wherein the contact members have a convex configuration along their length with the tip parts being forced downwardly into the contact member receiving holes when the semiconductor device is placed on the seating surface, some of the plurality of contact members having the convex configuration facing in a first direction and other contact members having the convex configuration facing in second, different, direction.
- 9. A socket according to claim 8 in which the plurality of contact members are arranged in a plurality of rows, with the convex configuration facing in the same direction in a given row.
- 10. A socket according to claim 8 further comprising a mounting block fixed to the base, the adaptor member being movable toward and away from the mounting block and a spring member placing a bias on the adaptor member in a direction away from the mounting block.
- 11. A socket as described in claim 8 in which approximately half of the plurality of contact members have their convex configuration facing in the first direction and approximately the remaining half have their convex configurations facing in the second, different, direction.
- 12. A socket according to claim 11 in which the first direction and second, different, direction are opposite to each other.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-366574 |
Dec 1999 |
JP |
|
US Referenced Citations (4)