BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1(
a) is a perspective view of double-coated film with at least one hole filled with a conductor. FIG. 1b) shows a cross-sectional view of a double-coated film with at least one hole filled with conductor and overcoated with compliant and release layers.
FIG. 2(
a) is a perspective view of double-coated film with seam and a conductive adhesive filled joint. FIG. 2 (b) shows a cross-sectional view of a double-coated film with seam and a conductive adhesive filled joint and overcoated with compliant and release layers.
FIG. 3(
a) is a perspective view of double-coated film with seam and tape with conductive adhesive folded over the edge of the film. FIG. (3b) shows a cross-sectional view of a double-coated film with seam and tape with conductive adhesive folded over the edge of the film and overcoated with compliant and release layers.
FIG. 4(
a) is a perspective view of double-coated film with seam and tape with conductive adhesive folded over the edge of the film. FIG. (4b) shows a cross-sectional view of a double-coated film with seam and tape with conductive adhesive folded over the edge of the film and overcoated with compliant and release layers.
FIG. 5(
a) is a perspective view of double-coated film with perforations. FIG. 5(b) shows a cross-sectional view of a double-coated film with perforations, overcoated with an elastomer that fills the perforations and further overcoated with a release layer.
FIG. 6(
a) is a cross-sectional view, not to scale, of a double-sleeved intermediate transfer member (DSITM) roller according to an embodiment of the invention. FIG. 6(b) is a cross-sectional view, not to scale, of a DSITM roller according to an embodiment of the invention.
FIG. 7 is a schematic perspective view, not to scale, of a DSITM outer sleeve support layer (OSSL) according to an embodiment of the invention.
For better understanding of the present invention, together with other advantages and capabilities thereof, reference is made to the following detailed description in connection with the above-described drawings.
DETAILED DESCRIPTION OF THE INVENTION
In the detailed description of the preferred embodiments of the invention presented below, reference is made to the accompanying drawings, in some of which the relative relationships of the various components are illustrated, it being understood that orientation of the apparatus may be modified. For clarity of understanding of the drawings, relative proportions depicted or indicated of the various elements of which disclosed members are included may not be representative of the actual proportions, and some of the dimensions may be selectively exaggerated.
A preferred embodiment of the invention may be found in FIGS. 1 (a) and 1 (b). Shown in FIG. 1 (a) is intermediate transfer substrate 10 including an insulating plastic film 12 having surface conductive layers 13 and 14 deposited on either side of film 12. A hole or perforation has been made in intermediate transfer substrate 10 and filled with conductive material 16. Conductive material 16 provides a low resistance electrical path between conductive layers 13 and 14. Subsequently, the ends of film 12 are joined so as to form an endless belt or sleeve. Shown in FIG. 1 (b) is intermediate transfer member 11, including intermediate transfer substrate 10 with compliant layer 18 coated on top of conductive layer 14. Preferably, a release layer 19 is coated on top of compliant layer 18.
Suitable materials for use as an insulating plastic film 12 include, but are not limited to, polyesters, polyurethanes, polyimides, polyvinyl chlorides, polyolefins (such as polyethylene and polypropylene) and/or polyamides (such as nylon), polycarbonates, or acrylics, or blends, or copolymers, or alloys of such materials, or fluorinated polymers, or any other substrate material that would meet the requirements of flexibility, strength, and durability, to maintain integrity under the conditions of use (e.g. pressure and tension).
Suitable materials for use as surface conductive layers 13 and 14 include, but are not limited to, vapor deposited aluminum, nickel, or indium tin oxide, or solution coated polythiophene, tin oxide, carbon black, carbon nanotubes, or polyaniline.
Suitable materials for use as a conductive material 16 include, but are not limited to, solder or a paint, epoxy, or paste that is filled with a conductive material such as silver, carbon black, carbon fibers or carbon nanotubes.
Suitable means for joining the ends of intermediate transfer substrate 10 include, but are not limited to, adhesive bonding, adhesive tape, welding, mechanical interlocking, sewing, wiring, or stapling.
Suitable materials for a compliant layer 18 include, but are not limited to, polyurethanes, neoprenes, silicones, fluoropolymers, silicone-fluoropolymer hybrids, nitrites, or silicon-nitriles.
Suitable materials for a release layer 19 include, but are not limited to, a sol-gel, a ceramer, a polyurethane or a fluoropolymer, but other materials having good release properties including low surface energy materials may also be used.
A second embodiment of the invention may be found in FIGS. 2 (a) and 2 (b). Shown in FIG. 2 (a) is intermediate transfer substrate 20 including an insulating plastic film 22 having surface conductive layers 23 and 24 deposited on either side of film 22. The ends of intermediate transfer substrate 20 are then joined together using a conductive adhesive 26 to form an endless belt or sleeve. Conductive adhesive 26 provides a low resistance electrical path between conductive layers 23 and 24. Shown in FIG. 2 (b) is intermediate transfer member 21, including intermediate transfer substrate 20 with compliant layer 28 coated on top of conductive layer 24. Preferably, a release layer 29 is coated on top of compliant layer 28. The materials for use as intermediate transfer member 21, compliant layer 28, and release layer 29 in this embodiment are the same as those listed for the first embodiment shown in FIGS. 1 (a) and 1 (b).
Suitable materials for conductive adhesive 26 include, but are not limited to, hot melt adhesives such as polyamides, urethanes, or polyesters, or UV-curable adhesives such as acrylic epoxies, polyvinyl butyrals, or the like, where electrical conductivity is provided by incorporating into the adhesive a conductive component such as silver, indium tin oxide, cuprous iodide, tin oxide, 7,7′,8,8′-tetracyanoquinonedimethane (TCNQ), quinoline, carbon black, NiO and/or ionic complexes such as quaternary ammonium salts, metal oxides, graphite, or like conductive fillers in particulate, flake or fiber form and conductive polymers such as polyaniline and polythiophenes.
A third embodiment of the invention may be found in FIGS. 3 (a) and 3 (b). Shown in FIG. 3 (a) is intermediate transfer substrate 30 including an insulating plastic film 32 having surface conductive layers 33 and 34 deposited on either side of film 32. The ends of intermediate transfer substrate 30 are then joined together to form an endless belt or sleeve using a tape 36 having a conductive adhesive 37 and folded over at least one edge of intermediate transfer substrate 30. Conductive adhesive 37 provides a low resistance electrical path between conductive layers 33 and 34. In addition, tape 36 may also be conductive so as to minimize the loss of electric field in a transfer nip. Shown in FIG. 3 (b) is intermediate transfer member 31, including intermediate transfer substrate 30 with compliant layer 38 coated on top of conductive layer 34. Preferably, a release layer 39 is coated on top of compliant layer 38. The materials for use as intermediate transfer member 30, compliant layer 38, and release layer 39 in this embodiment are the same as those listed for the first embodiment shown in FIGS. 1(a) and 1(b).
A fourth embodiment of the invention may be found in FIGS. 4 (a) and 4 (b). Shown in FIG. 4 (a) a is intermediate transfer substrate 40 including an insulating plastic film 42 having surface conductive layers 43 and 44 deposited on either side of film 42. A tape 46 having a conductive adhesive 47 is folded over one edge of intermediate transfer substrate 40. This electrical connection using tape 46 may be repeated in multiple locations. Conductive adhesive 47 provides a low resistance electrical path between conductive layers 43 and 44. In addition, tape 46 may also be conductive so as to minimize the loss of electric field in a transfer nip. Shown in FIG. 4 (b) is intermediate transfer member 41, including intermediate transfer substrate 40 with compliant layer 48 coated on top of conductive layer 44. Preferably, a release layer 49 is coated on top of compliant layer 48. The materials for use as intermediate transfer member 40, compliant layer 48, and release layer 49 in this embodiment are the same as those listed for the first embodiment.
An example of a conductive tape 46 having a conductive adhesive 47 is 3M™ 1181 EMI Copper Foil Shielding Tape 1181.
A fifth embodiment of the invention may be found in FIGS. 5 (a) and 5 (b). Shown in FIG. 5 (a) is intermediate transfer substrate 50 including an insulating plastic film 52 having surface conductive layers 53 and 54 deposited on either side of film 52. A pattern of holes or perforations 56 has been made in intermediate transfer substrate 30. Shown in FIG. 5 (b) is intermediate transfer member 51, consisting of intermediate transfer substrate 50 with compliant layer 58 coated on top of conductive layer 54 and filling in perforations 56. Preferably, a release layer 59 is coated on top of compliant layer 58. The materials for use as intermediate transfer member 50, compliant layer 58, and release layer 59 in this embodiment are the same as those listed for the first embodiment.
The pattern of perforations 56 is designed such that the remaining plastic film material has sufficient strength so as to provide the rigidity required to serve as a substrate for an intermediate transfer member. If there are too many perforations then the mechanical integrity and strength of film 52 will be significantly reduced. On the other hand, the pattern must provide a sufficient number of channels to effectively provide electrical communication between conductive layers 53 and 54. If there is a sufficient number of perforations then the electrical current flow between conductive layers 53 and 54 will be too low, resulting in a reduction in the toner transfer capability of intermediate transfer member 50.
EXAMPLE
An outer sleeve member (OSM) was made as described below, with reference to OSM 30 in FIG. 6(a). An outer sleeve support layer (OSSL) 63 was assembled from two polyester films of about 0.125 mm thickness with nickel disposed on one surface and an adhesive disposed on the opposite surface of each film. The first layer polyester film was wrapped on an aluminum fabrication mandrel, with an outside diameter of about 172.000 mm (d4), so that the nickel coated surface was in intimate contact with the aluminum mandrel and the ends of the film were brought together to form a butt seam. The seam of the first layer polyester film formed an angle of about 30 degree when measured from a line drawn on the film parallel to the axis of the cylinder. The second layer polyester film was wrapped on the first polyester film so that the adhesives of each film were brought in contact with one another and the ends of the film were brought together to form a second butt seam. The seam of the second layer polyester film was established about 180 deg from the original seam when measured about the axis of the mandrel cylinder and formed an angle of about 30 deg when measured from a line drawn on the film parallel to the axis of the mandrel cylinder. The resulting OSSL is shown in FIG. 7. An outer sleeve compliant layer (OSCL) 65 of polyurethane was cast onto the OSSL, ground to a thickness of about 1.1 mm and ring-coated with about a 6 micrometer thick layer of ceramer to form an outer sleeve release layer (OSRL) 64. An area of roughly 5 cm2 was left uncoated on either side of the OSSL, leaving the nickel surface exposed on both sides. A piece of copper tape having a conductive adhesive was used to electrically connect both conductive surfaces of the OSSL, thus effectively removing the insulating polyester film from the effective impedance of the DSITM. The OSM with an inner diameter of 172.000 mm (d4) was then removed from the fabrication mandrel. An inner sleeve member (ISM) was made as described below with reference to ISM 32 in FIG. 6(a). Polyurethane was cast onto a cylindrical nickel core member in a mold, cured and ground so that the final outer diameter was 172.500 mm when mounted on a 154.000 mm device mandrel 31 resident in an electrophotographic machine (a Kodak NexPress 2100). When the ISM was removed from the device mandrel the outside diameter relaxed to a dimension of about 170.3 mm (d3) such that the OSM of about 172.000 mm (d4) inner diameter was slipped over the ISM without interference to form a double-sleeved member (DSM). To mount the DSM device mandrel in the electrophotographic machine a source of a pressurized air delivered by the mandrel was applied to the inner surface of the DSM to elastically expand the ISM member from its initial inner diameter size of about 151.800 mm (d2) to a dimension slightly larger than the mandrel dimension of about 154.000 mm (d1). At the same time the ISM outside dimension of about 170.300 mm (d3) is expanded to about 172.500 mm with the same applied pressurized air creating an interference with the OSM inner diameter of about 172.00 mm (d4). The expansion and subsequent contact between the ISM and OSM that formed the DSM allowed the ISM and OSM to simultaneously move along the surface of a core member until it reached a predetermined position surrounding the core member. Shutting off the source of the pressurized air allowed the DSM to relax and grip the said core member under tension. The roller was subsequently tested as an intermediate transfer member in an electrophotographic machine and was found to make images on the receiver sheets. The DSM was then removed with pressurized air in a similar way to that described for installation with the ISM and OSM simultaneously moving along the surface of a core member until completely removed from the device mandrel. Once removed from the machine the ISM and OSM were separated into two pieces.
The invention has been described in detail with particular reference to certain preferred embodiments thereof, but it will be understood that variations and modifications can be effected within the spirit and scope of the invention.
Patent Application
20080038566
