Claims
- 1. A semiconductor device having a plurality of wiring lines, said device comprising:a plurality of conductors, each of said conductors having a conductive layer and an insulating layer above said conductive layer, wherein a first width between said conductive layer of adjacent ones of said conductors is greater than a second width between said insulating layer of adjacent ones of said conductors; first spacers positioned on said insulating layer and said conductive layer of adjacent ones of said conductors; a fuse element positioned between said first spacers of adjacent ones of said conductors and connected to said wiring lines; and second spacers positioned between said fuse element and said first spacers, said second spacers being on a same layer level as said conductive layer, wherein a difference between said first width and said second width is filled by said second spacers.
- 2. The semiconductor device as in claim 1, wherein said second spacers increase thermal insulation of said fuse element.
- 3. The semiconductor device as in claim 1, wherein said first spacers comprise nitride, said second spacers comprise tetraethylorthosilicate and said fuse element comprises polysilicon.
- 4. The semiconductor device as in claim 1, wherein said first width comprises a smallest possible photolithographic width and said fuse element has a third width smaller than said first width.
- 5. The semiconductor device as in claim 1, wherein said conductors comprise gate conductor stacks.
- 6. The semiconductor device as in claim 1, wherein said fuse element is opened with internal operating currents and voltages of said wiring lines.
- 7. The semiconductor device as in claim 1, wherein said fuse element has a bend.
- 8. The semiconductor device as in claim 1, further comprising a void above said fuse element.
CROSS REFERENCED TO RELATED APPLICATION
This application is related to co-pending U.S. application Ser. No. 09/093,910 entitled “Sub-minimum Wiring Structure” filed concurrently with this application.
US Referenced Citations (13)