The present invention generally relates to the joining of device components, and more particularly relates to the electrical bonding of device components in a manner that provides electrical conductivity between the components.
Valve assemblies are commonly used in aircraft applications to control the flow of a fluid. Some specific examples of valve assemblies utilized in aircraft applications include those commonly found in environmental control systems and may include high stage bleed air valves, mid-stage bleed air valves, bleed air isolation valves, pressure regulating and shutoff valves, load control valves, anti-ice valves, trim air valves, and temperature control valves.
In one specific example, an air turbine starter (ATS) within a turbofan jet engine may be coupled to a high pressure fluid source such as compressed air. The flow of compressed air may be controlled by, for example, a valve, such as a pneumatic valve. The flow of compressed air impinges upon a turbine wheel in the ATS causing it to rotate at a relatively high rate of speed.
It is well-known that valve assemblies may be partially disposed within an airway to control the flow of a fluid (e.g., air) there through and thus perform any one of a number of functions (e.g., temperature regulation). Valve assemblies of this type typically comprise a valve (e.g., a butterfly valve) that is coupled by way of a linkage assembly to an actuator. Static electrical discharge generated by the valve assembly or lightning strikes may damage the turbine engine as well as other aircraft systems. Previous attempts to alleviate this problem include the fastening of a p-clamp and/or a bonding strap between components of the valve assembly and a remote ground point, such as an associated component. The p-clamp or bonding strap provides a discharge path for the static electricity in the device. Although this type of bonding or grounding of the valve operates safely this method can suffer certain drawbacks. For instance, the p-clamp or bonding strap may rotate or move where clamping or attachment takes place. This relative motion of the p-clamp or bonding strap can potentially result in an increase in the bonding resistance across the joint and the buildup of static electricity within the valve assembly. Furthermore, the p-clamp or bonding strap may be easily damaged by physical handling of the component, handling of the p-clamp or bonding strap itself, or vibration of the components.
It should thus be appreciated from the above that it would be desirable to provide an improved device assembly including a means for providing electrical bonding of the assembly for the discharge of static electricity during operation of the device assembly. Therefore, there is a need for a means for joining components in a device that will provide a low electrical resistance bonding path and thus permit the discharge of static electricity. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description of the invention and the appended claims, taken in conjunction with the accompanying drawings and this background of the invention.
The present invention provides a bonding means for electrically coupling a first component and a second component at an interface. In one embodiment and by way of example only, the bonding means comprises at least one electrically conductive bonding puck positioned between the first component and the second component. The at least one electrically conductive bonding puck is disposed within a recess formed in at least one of the first component or the second component. Te at least one electrically conductive bonding puck is formed of an electrically conductive material and provides electrical bonding between the first component and the second component and establishes electrical continuity therebetween.
In another particular embodiment, and by way of example only, there is provided a bonding means for electrically coupling a first component and a second component at an interface wherein the bonding means comprises at least one electrically conductive bonding puck positioned between the first component and the second component. The at least one electrically conductive bonding puck is defined by a first planar surface, a second planar surface and a sidewall extending therebetween. The at least one electrically conductive bonding puck provides electrical bonding between the first component and the second component and establishes electrical continuity therebetween.
In yet another particular embodiment, and by way of example only, there is provided a valve assembly including a bonding means for electrically coupling a first component and a second component at an interface. The valve assembly comprises at least one valve body, an actuator housing, a servo housing, and an electrical bonding means electrically coupling the actuator housing and the servo housing at an interface. The at least one valve body includes a flow passage defined therein. The actuator housing has housed therein an actuator assembly for control of the at least one valve body. The servo housing has disposed therein a servo regulator for regulating the actuator assembly. The electrical bonding means comprises at least one electrically conductive bonding puck positioned between the actuator housing and the servo housing. The bonding puck is disposed within a recess formed in at least one of the actuator housing or the servo housing. The at least one electrically conductive bonding puck provides electrical bonding between the actuator housing and the servo housing and establishes electrical continuity therebetween.
Other independent features and advantages of the preferred bonding means will become apparent from the following detailed description, taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.
The present invention will hereinafter be described in conjunction with the following drawing figures, wherein like numerals denote like elements, and
2 is an isometric view of portion of the second component of
The following detailed description is merely exemplary in nature and is not intended to limit the invention or the application and uses of the invention. Furthermore, there is no intention to be bound by any theory presented in the preceding background or the following detailed description.
The embodiment disclosed herein is described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the scope of the present invention. Furthermore, it will be understood by one of skill in the art that although the specific embodiment illustrated below is directed at the electrical bonding of an actuator housing and a servo housing typically found in an aircraft, for purposes of explanation, the apparatus may be used in various other embodiments employing various types of components that are require electrical bonding. The following detailed description is, therefore, not to be taken in a limiting sense.
The valve assembly 100 further includes an electrical bonding means (not shown) generally comprised of a bonding puck (described presently) that electrically bonds the first component 102 to the second component 104. The bonding puck provides bonding and thus electric discharge of any static electricity that may build up in the first component 102 and the second component 104 during operation. The bonding puck provides a bonding path from the first component 102 through the second component 104 and to a ground, generally referenced 116.
Referring now to
Referring now to
The bonding puck 300 is configured to be maintained in compression during thermal excursions of at least one of the first component 102 or the second component 104. To accomplish this the bonding puck 300 may optionally include cut-out portions 308 to provide for flexibility of the bonding puck 300 in response to the compressive forces acting upon it when the first component 102 and the second component 104 are assembled together and during thermal excursions of the first component 102 or the second component 104. The cutouts 308 extend from the sidewall 306 toward a center axis of the bonding puck 300. The cutouts 308 make the bonding puck 300 more spring-like and compliant, helping the bonding puck 300 to conform to any thermal length changes that the first component 102 and the second component 104 will go through during operation of the valve assembly 100.
The bonding puck 300 provides an electrical path or bonding path for the discharge of static electricity that may buildup or from lightning strikes. When implemented into a valve assembly in an aircraft, the bonding puck 300 minimizes the buildup of static electricity and provides for the safe conduction of a lightning strike through the aircraft.
Accordingly, disclosed is a bonding means for device components, such as those commonly found in aircraft applications, that provides a means for electrically bonding two device components so as to assure low electrical resistance and provide an electrical bonding path.
While at least one exemplary embodiment has been presented in the foregoing detailed description of the invention, it should be appreciated that a vast number of variations exist. For example, although the specific embodiments illustrated are directed at joining a flow valve and an actuator, such as those found in an aircraft, the method and apparatus may be used in various embodiments employing various types of device components, such as in actuators, including pneumatic, hydraulic, electric, and electromechanical, starters, sensors, electronic controllers, etc. Furthermore, while the specific embodiment is disclosed as having a recess formed on the second component and an optional recess formed in the first component for placement of the bonding puck, it should be appreciated that the fabrication of a recess is design specific and may be formed on either component and/or on both components. Furthermore, the size and shape of the bonding puck and the recess are design specific and not limited to those illustrated. It should also be appreciated that the exemplary embodiment or exemplary embodiments are only examples, and are not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing an exemplary embodiment of the invention. It being understood that various changes may be made in the function and arrangement of elements described in an exemplary embodiment without departing from the scope of the invention as set forth in the appended claims.