The present invention relates generally to the field of electrically conductive modules, and more particularly to conductive modules which are engaged with one or more conductive structural elements so as to conduct electric power or signals between the one or more conductive structural elements and an electrical device, such as a light fixture, building automation system, environmental sensors/controls, sound masking system, or speaker, connected to the conductive module. In a preferred form, the conductive modules are ceiling tiles with conductive layers formed thereon, and the conductive structural elements are conductive beams of a suspended ceiling grid.
The modules could also be panels made with metal, wood, gypsum, synthetic materials, fibrous materials, mineral materials, or they could be other surfaces such as gypsum board. Such modules may be ceiling or wall panels or surfaces. Electrical conductors and wiring in houses, buildings, office furniture, office partitions, airplanes, trains, boats, motor vehicles and the like are conventionally installed in dedicated locations and terminated in standardized receptacles which are difficult to either relocate or supplement without substantial modification to the respective structure. Often, the electrical supply is not in all the locations a user would like even in new buildings, houses, or transportation equipment. Moreover, changing the layout of the electrical system is difficult using traditional wiring technology. For example, relocating a light fixture from one location in a ceiling to another will likely require an electrician to relocate and/or install new electrical wiring, structural connections, and junction box to the new location. Similarly, lighting or speaker location in a vehicle or airplane may not be adequately positioned when the seating is reconfigured, and the modification to the wiring and structural support elements is likely to be expensive and difficult. Even in new systems and buildings, relocating wiring during assembly/construction is difficult due to conventional wiring requirements. The use of conductive modules allow for greater flexibility in locating the devices, including the ability to customize the location, type, and quantity of devices to meet a users need.
In a first aspect of the invention, an electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements.
In a second aspect of the invention, a system is provided. The system includes one or more conductive structural elements, and a module having a panel configured to engage with the conductive structural elements. The module further includes conductive layers formed on or in the panel, wherein each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements.
In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element.
In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.
In a third aspect of the invention, a method for forming an electrically conductive module. The method includes the steps of providing a panel configured to engage with one or more conductive structural elements, and forming a plurality of conductive layers on or in the panel, wherein each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. The conductive layers may be formed using a conductive composition, preferably a conductive ink. The conductive ink preferably includes silver or copper, and is sprayed or printed on the panel to form the conductive layers.
The features and advantages of the present invention will become more apparent from the following description of the invention taken in conjunction with the accompanying drawings, wherein like reference characters designate the same or similar parts, and wherein:
In order to overcome some of the problems discussed above, an electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements.
One exemplary embodiment of an electrically conductive module in accordance with the invention is shown in
The panel 101 may be made of a rigid or flexible material. For example, the panel 101 may be formed as a rigid tile, such as the acoustical ceiling tile shown in
The electrically conductive module 100 is configured to engage with, and in certain circumstances be supported by, a conductive structural element. For example,
The panel 101 of
The terminals 102a, 103a shown in
In one embodiment the terminals 102a, 103a resiliently engage the conductive structural elements 200 (
The module 100 shown in
The other terminals 102b, 103b of the pairs of terminals are configured to be in electrical communication with an electrical device (not shown). As shown in
Other electrical devices may be mounted to the panel 101, including low voltage devices, antennas, cameras, and sensors (e.g., motion, fire/smoke, and temperature), or receptacle (e.g., a power outlet or junction box) to form at least a portion of a circuit between the terminals 102b, 103b. As discussed above, the device may be a light fixture that is configured to be positioned substantially within the surface of the panel 101 and have ends which are flush with the top and bottom sides of the surface. Such a design has the advantages of conserving space in shipping and in use. For example, ceiling tiles may be manufactured configured with integrated LED lighting in similar sized packaging as is used for conventional ceiling tiles. Moreover, additional space above the ceiling beams need not be provided to house a light fixture. This may be advantageous where the ceiling height of the room is too low to install a fully suspended ceiling grid, but where such tiles could be installed in close proximity to the ceiling. Such a system may be possible by inverting the panel and the beams shown in
In another example embodiment (not shown), the circuit includes a heating element connected on or through the surface. Such a heating element may be self regulated, controlled via an embedded controller, or connected to a remote temperature controller. In this embodiment the surface is constructed of a material that is suitable for conducting and radiating heat generated by the heating element. Such materials are suitable, for example, by not melting, burning, or deforming during the operation of the heating element. Modules 100 configured with heating elements can be engaged with conductors on walls and floors to provide radiant heating for the occupants.
In another example embodiment (not shown), the circuit can include a sensor, such as a pressure sensor. For example, the terminals 102b, 103b of module 100 sensor may be connected to a pressure sensor embedded in a flexible surface, such as a seat cushion of a vehicle, which can indicate the presence of an occupant. For example, in an automobile, such a sensor may either open or close the circuit depending on the configuration of other electrical conductors in the vehicle connected to the terminals to activate a cutoff switch connected to an airbag.
In another example embodiment (not shown), the circuit includes a receptacle or junction box, such as for routing power terminals for an electrical outlet. Such a power outlet can be used for example to connect electrical devices similarly to electrical outlets wired in occupancies, vehicles, planes, trains, etc. For example, an additional use of such an outlet can be to route power to a video monitor or digital picture frame which can be mounted on the module 100.
In another example embodiment (not shown), the circuit can include a plurality of conductors connected in parallel between the terminals so as to create a mini-grid or network either on or within the module 100. Such a mini-grid can be used, for example, to connect electrical devices to the conductors at various positions on a side of the module 100. In one embodiment where the conductors are embedded in the surface of the panel, an external device, such as a light fixture can be connected to the conductors by inserting terminals through a side of the surface to the depth where the terminals of the device contact the embedded conductors. The device may be further connected to the panel by fasteners or other connection means. By virtue of this feature electrical devices can be simply electrified by being pushed into place like a push pin into a cork board. By virtue of such a connection, panels can be manufactured with an electrical grid in or on the surface without having to include openings for devices in the surface such as hole 104 in
In one example embodiment, the conductive structural element is an inverted “T” ceiling grid beam, in which the first conductive portion is the metallic beam itself, and the second conductive portion is a conductive layer formed on or attached to the bottom of a horizontal flange of the beam, with an insulator separating the first and second conductive portions. This type of beam is described in U.S. patent application Ser. No. 12/552,487, entitled “Electrically Conductive Element, System, and Method of Manufacturing,” filed concurrently herewith and the entire contents of which are herein incorporated by reference.
In particular, the module 300 shown in
In particular,
The arrangement of the terminals 302a, 303a on the panel 301 and the corresponding configuration of the conductors 403, 404 on the conductive element 400 allows for an advantageous simplification of the system shown in
Such a simplified system can be especially useful in applications where it is inconvenient or unsightly to install a second conductive element
Other combinations of conductive structural elements and modules may be arranged. For example, the two conductive beams 200 of
Furthermore, as mentioned above, by virtue of the electrically conductive module 100, 300, power can be distributed between the conductive structural element(s) to an electrical device connected to the module. As discussed above, an AC or DC power supply (not shown) may be connected across two separate conductive structure elements (See, e.g.,
Of course the embodiments described here in are not limited to electrical power distribution and/or transmission, and it will be appreciated that other electrical signals may be distributed and/or transmitted through the panel. For example, analog or digital signals can be generated by any known signal generator, for example, an audio system or a computer system, and distributed and/or transmitted through the conductive structural elements and module to an appropriate electrical device. In this regard, the number of conductive layers and terminals are not limited to two, but as mentioned above, can be more than two. For example, the conductive layers and terminals can be configured as a multi-conductor bus to conduct a plurality of audio channels or computer signals, commensurate with the number of conductive paths on the conductive structural element and electrical device.
In addition, in the context of building panels, the electrically conductive element may be disposed between the facing and the core of the building material such as, for example, a ceiling tiles core and its facing material. The element can also be disposed between the facing material and an aesthetic coating or even directly on the exposed face of the building material. Moreover, the elements can be on the exposed or unexposed sides of the building materials or both.
A method for forming an electrically conductive module is also provided. The method includes the steps of providing a panel configured to engage with one or more conductive structural elements, and forming a plurality of conductive layers on or in the panel, wherein each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. The conductive layers may be formed using a conductive composition, preferably a conductive ink. The conductive ink preferably includes silver or copper, and is sprayed, laminated or printed on the panel to form the conductive layers.
Although the invention herein has been described with reference to particular methods and embodiments, it is to be understood that these methods and embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the described methods and embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the following claims.
This application claims the priority of U.S. Provisional Application No. 61/093,796, filed Sep. 3, 2008.
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