The present invention relates to a power-supplying module used for wireless power transmission and a power-supplying method of the power-supplying module.
Portable electronic devices such as laptop PCs, tablet PCs, digital cameras, mobile phones, portable gaming devices, earphone-type music players, wireless headsets, hearing aids, recorders, which are portable while being used by the user are rapidly increasing in recent years. Many of these portable electronic devices have therein a rechargeable battery, which requires periodical charging. To facilitate the work for charging the rechargeable battery of an electronic device, there are an increasing number of devices for charging rechargeable batteries by using a power supplying technology (wireless power transmission technology performing power transmission by varying the magnetic field) that performs wireless power transmission between a power-supplying module and a power-receiving module mounted in an electronic device.
For Example, as a wireless power transmission technology, there have been known, for Example, a technology that performs power transmission by means of electromagnetic induction between coils (e.g. see PTL 1), a technology that performs power transmission by means of resonance phenomenon (magnetic field resonant state) between resonators (coils) provided to the power-supplying device (power-supplying module) and the power-receiving device (power-receiving module) (e.g. see PTL 2).
For Example, when wireless power transmission is performed by coupling magnetic fields by utilizing resonance phenomenon (magnetic field resonant state) between resonators (coils) of the power-supplying module and the power-receiving module above, it is necessary to bring the power-receiving module close to the power-supplying module so that the power-receiving module and the power-receiving module are within a distance (power-suppliable region) in which power supply from the power-supplying module to the power-receiving module is possible. In this using process, when the power-supplying module and the power-receiving module are not in the power-suppliable region, power is always supplied to the power-supplying module to prepare for a future arrangement of the power-receiving module in the power-suppliable region, and hence the power is wastefully consumed (i.e., standby power consumption is large).
To solve this problem, a countermeasure has been proposed, that is, a detector (sensor or the like) is provided in the power-supplying module or the power-receiving module, the detector detects a change which is caused when arranging both the power-supplying module and the power-receiving module in the power-suppliable region, and power supply to the power-supplying module starts based on the detection result.
For Example, in a power-supplying device (power-supplying module) of a power-supplying system recited in PTL 3, a detector (current/voltage detector 113) is provided and an impedance is calculated based on a current value or voltage value measured by the detector. By comparing a change in this impedance (e.g., an increase in the impedance; see the paragraph [0047] or the like) with a predetermined threshold, whether a power-supplying device (power-supplying module) and a secondary-side device (power-receiving module) are in a power-suppliable region is determined in this power-supplying device.
Furthermore, by providing the detector as above and determining whether the power-supplying module and the power-receiving module are in the power-suppliable region, the power supply to the power-supplying module is stopped when the power-supplying module and the power-receiving module are not in the power-suppliable region, with the result that wasteful power consumption is prevented.
[PTL 1] Japanese Patent No. 4624768
[PTL 2] Japanese Unexamined Patent Publication No. 2010-239769
[PTL 3] Japanese Unexamined Patent Publication No. 2013-62895
However, additionally providing a detector as above is costly and is disadvantageous in terms of the downsizing of the power-supplying module.
Furthermore, when a detector is provided, it is necessary to activate the detector at predetermined time intervals (i.e., intermittently). The activation of the detector requires power, and hence power is consumed even if the power-supplying module and the power-receiving module are not in the power-suppliable region (see the paragraph [0044] of PTL 3).
An object of the present invention is therefore to provide a power-supplying module and a power-supplying method for the power-supplying module, by which power consumption of the power-supplying module is reduced without providing an additional device, when the power-supplying module and a power-receiving module are not in a power-suppliable region (i.e., in a standby state).
According to an aspect of the invention for solving the problem above is a power-supplying module for supplying power from the power-supplying module connected with a power source to a power-receiving module by utilizing resonance phenomenon, the power-supplying module being driven at a power-source frequency of the power source so that an input impedance of the power-supplying module in a standby state in which no power is supplied from the power-supplying module to the power-receiving module is higher than an input impedance of the power-supplying module and the power-receiving module in a power-supplying state in which the power is supplied from the power-supplying module to the power-receiving module.
According to this arrangement, because the input impedance of the power-supplying module in the standby state is higher than the input impedance of the power-supplying module and the power-receiving module in the power-supplying state, the power consumption of the power-supplying module in the standby state is reduced as compared to the power consumption in the power-supplying state.
According to another aspect of the invention for solving the problem above, the power-supplying module includes a power-supplying coil, a power-supplying resonator, and a power-receiving resonator, the power-receiving module includes a power-receiving coil, and the power is supplied by utilizing the resonance phenomenon occurring between the power-supplying resonator and the power-receiving resonator.
According to the arrangement above, the input impedance of the power-supplying module in the standby state can be used as the input impedance of the power-supplying module including the power-supplying coil, the power-supplying resonator, and the power-receiving resonator.
Because the power-supplying module is formed of at least three elements, i.e., the power-supplying coil, the power-supplying resonator, and the power-receiving resonator, the number of the elements for determining the input impedance of the power-supplying module is large. When the number of the elements for determining the input impedance of the power-supplying module is large, the number of the elements for determining the relationship of the input impedance of the power-supplying module with the power-source frequency of the power source is also large, with the result that the design freedom of the power-supplying module is enhanced.
In addition to the above, because the power-receiving module is arranged to include the power-receiving coil, the downsizing of the power-receiving module is realized.
According to another aspect of the invention for solving the problem above, the power-supplying module includes a power-supplying coil and a power-supplying resonator, the power-receiving module includes a power-receiving resonator and a power-receiving coil, and the power is supplied by utilizing the resonance phenomenon occurring between the power-supplying resonator and the power-receiving resonator.
According to this arrangement, the input impedance of the power-supplying module in the standby state can be used as the input impedance of the power-supplying module including the power-supplying coil and the power-supplying resonator.
Because the power-supplying module is formed of at least two elements, i.e., the power-supplying coil and the power-supplying resonator, the number of the elements for determining the input impedance of the power-supplying module is large. When the number of the elements for determining the input impedance of the power-supplying module is large, the number of the elements for determining the relationship of the input impedance of the power-supplying module with the power-source frequency of the power source is also large, with the result that the design freedom of the power-supplying module is enhanced.
In addition to the above, because the power-receiving module is arranged to include the power-receiving resonator and the power-receiving coil, the downsizing of the power-receiving module is realized.
According to another aspect of the invention for solving the problem above, the power-supplying module includes a power-supplying coil, the power-receiving module includes a power-supplying resonator, a power-receiving resonator, and a power-receiving coil, and the power is supplied by utilizing the resonance phenomenon occurring between the power-supplying resonator and the power-receiving resonator.
According to the arrangement above, the input impedance of the power-supplying module in the standby state can be used as the input impedance of the power-supplying coil.
Because the power-supplying module is formed mainly of one element, i.e., the power-supplying coil, the element for determining the input impedance of the power-supplying module is unified. When the element for determining the input impedance of the power-supplying module is unified, the element for determining the relationship of the input impedance of the power-supplying module with the power-source frequency of the power source is also unified, with the result that the design of the power-supplying module is simplified.
According to another aspect of the invention for solving the problem above, a power-supplying method for a power-supplying module for supplying power from the power-supplying module connected with a power source to a power-receiving module by utilizing resonance phenomenon, comprising the step of: adjusting a power-source frequency of the power source to a band in which an input impedance of the power-supplying module in a standby state in which no power is supplied from the power-supplying module to the power-receiving module is higher than an input impedance of the power-supplying module and the power-receiving module in a power-supplying state in which the power is supplied from the power-supplying module to the power-receiving module.
According to the method above, because the input impedance of the power-supplying module in the standby state is higher than the input impedance of the power-supplying module and the power-receiving module in the power-supplying state, the power consumption of the power-supplying module in the standby state is reduced as compared to the power consumption in the power-supplying state.
A power-supplying module and a power-supplying method for the power-supplying module, by which power consumption of the power-supplying module is reduced without providing an additional device, when the power-supplying module and a power-receiving module are not in a power-suppliable region (i.e., in a standby state) are provided.
The following will describe a power-supplying module for wireless power transmission and a power-supplying method for the power-supplying module according to an embodiment of the present invention.
To begin with, the present embodiment will describe, as an example, a charger 101 including a power-supplying module 2 and a wireless headset 102 including a power-receiving module 3, which realize wireless power transmission.
(Structure of Charger 101 and Structure of Wireless Headset 102)
As shown in
The power-supplying coil 21 of the power-supplying module 2 is connected to an AC power source 6 having an oscillation circuit configured to set the power-source frequency of power supplied to the power-supplying module 2 to a predetermined value. The power-receiving coil 31 of the power-receiving module 3 is connected to a rechargeable battery 9 via a stabilizer circuit 7 configured to rectify the AC power received and a charging circuit 8 configured to prevent overcharge. For the sake of convenience,
Although not illustrated, the charger 101 is provided with a housing groove which is provided for housing the wireless headset 102 and is shaped in accordance with the shape of the wireless headset 102. As the wireless headset 102 is housed in this housing groove of the charger 101, the wireless headset 102 is positioned so that the power-supplying module 2 of the charger 101 and the power-receiving module 3 of the wireless headset 102 oppose each other.
The power-supplying coil 21 plays a role of supplying power obtained from the AC power source 6 to the power-supplying resonator 22 by means of electromagnetic induction. As shown in
The power-receiving coil 31 plays roles of receiving the power having been transmitted as a magnetic field energy from the power-supplying resonator 22 to the power-receiving resonator 32, by means of electromagnetic induction, and supplying the power received to the rechargeable battery 9 via the stabilizer circuit 7 and the charging circuit 8. As shown in
The total impedance of a circuit element constituting the power-receiving coil 31 is Z4. In the present embodiment, the Z4 is the total impedance of the RLC circuit (circuit element) constituting the power-receiving coil 31, which includes the resistor R4, the coil L4, and the capacitor C4. Further, while the total impedance of the power-supplied electronic device 10 connected to the power-receiving coil 31 is ZL, the total load impedance of the stabilizer circuit 7, the charging circuit 8, and the rechargeable battery 9 (power-supplied electronic device 10) connected to the power-receiving coil 31 is implemented in the form of a resistor RL (corresponding to ZL) as shown in
As shown in
In the RLC circuit which is the resonance circuit in each of the power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31, the resonance frequency is f which is derived from (Formula 1) below, where the inductance is L and the capacity of capacitor is C. In the present embodiment, the resonance frequency of the power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31 is set to 1.0 MHz.
Each of the power-supplying resonator 22 and the power-receiving resonator 32 is a solenoid coil with the coil diameter of 15 mmφ, which is formed by winding a copper wire material (coated by an insulation film) with the wire diameter of 0.4 mmφ 18 times. The resonance frequency of the power-supplying resonator 22 and that of the power-receiving resonator 32 are matched with each other, as described above. The power-supplying resonator 22 and the power-receiving resonator 32 may be a spiral coil or a solenoid coil as long as it is a resonator using a coil.
In regard to the above, the distance between the power-supplying coil 21 and the power-supplying resonator 22 is denoted as d12, the distance between the power-supplying resonator 22 and the power-receiving resonator 32 is denoted as d23, and the distance between the power-receiving resonator 32 and the power-receiving coil 31 is denoted as d34 (see
Further, as shown in
The resistance values, inductances, capacities of capacitors, and coupling coefficients K12, K23, and K34 of R1, L1, and C1 of the RLC circuit of the power-supplying coil 21, R2, L2, and C2 of the RLC circuit of the power-supplying resonator 22, R3, L3, and C3 of the RLC circuit of the power-receiving resonator 32, and R4, L4, and C4 of the RLC circuit of the power-receiving coil 31 are parameters variable at the stage of designing and manufacturing.
In the power-supplying module 2 and the power-receiving module 3 above, when the resonance frequency of the power-supplying resonator 22 and the resonance frequency of the power-receiving resonator 32 are arranged to be identical with each other, a magnetic field resonant state is created between the power-supplying resonator 22 and the power-receiving resonator 32. When a magnetic field resonant state is created while the power-supplying resonator 22 and the power-receiving resonator 32 are in resonance, power transmission from the power-supplying resonator 22 to the power-receiving resonator 32 as a magnetic field energy becomes possible. On this account, wireless power transmission from the charger 101 including the power-supplying module 2 to the wireless headset 102 including the power-receiving module 3 is performed, with the result that the rechargeable battery 9 in the wireless headset 102 is charged.
In regard to the above, as shown in
In the meanwhile, as shown in
(Relationship between Input Impedance in Standby State and Input Impedance in Power-Supplying State)
Now, based on the concepts of the standby state and the power-supplying state, the following will describe the relationship between the input impedance in the standby state and the input impedance in the power-supplying state of the power-supplying module 2 and the power-receiving module 3 for reducing the power consumption of the power-supplying module 2 in the standby state.
To begin with, why the power consumption in the standby state should be reduced in power transmission using wireless power transmission will be described. As described above, when wireless power transmission is performed by coupling magnetic fields between the power-supplying resonator 22 and the power-receiving resonator 32 of the power-supplying module 2 and the power-receiving module 3 by means of resonance phenomenon (magnetic field resonant state), it is necessary to bring the power-receiving module 3 close to the power-supplying module 2 so that the distance between the modules are sufficiently close (in the power-suppliable region) for supplying power from the power-supplying module 2 to the power-receiving module 3. In this using process, when the power-supplying module and the power-receiving module are not in the power-suppliable region (i.e., in the standby state), power is always supplied to the power-supplying module to prepare for a future arrangement of the power-receiving module in the power-suppliable region (i.e., in the power-supplying state).
In this case, the power supplied to the power-supplying module 2 in the standby state is wasted.
In the meanwhile, in the standby state, when the power-receiving module is provided in the power-suppliable region, power supply to the power-supplying module 2 must be maintained in consideration of prompt shift to the power-supplying state.
For this reason, the power consumption in the standby state is required to be restrained as compared to the power consumption in the power-supplying state.
To restrain the power consumption in the standby state as compared to the power consumption in the power-supplying state, an input impedance Zin in the standby state is arranged to be higher than an input impedance Zin in the power-supplying state, because the power consumption P is calculated by (Formula 2) below. It is noted that, because a voltage V (effective value) supplied to the power-supplying module 2 by an AC power source 6 is maintained to be constant, the voltage V is not a variable element.
As such, the power-supplying module 2 of the present embodiment is arranged such that the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and driving is performed with a power-source frequency with which the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 of the power-supplying state. Because in this arrangement the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, the power consumption of the power-supplying module 2 in the standby state is arranged to be restrained as compared to the power consumption in the power-supplying state.
The arrangement above will be described with reference to Examples below. In Examples below, by using differently-arranged power-supplying modules 2 and power-receiving modules 3, the input impedance Zin at the power-source frequency in the standby state (OFF) and the input impedance Zin at the power-source frequency in the power-supplying state (ON) were analyzed. In Examples, analysis was performed under a condition that a variable resistor 11 (R1) was connected instead of the stabilizer circuit 7, the charging circuit 8, and the rechargeable battery 9.
In Example 1-1 to Example 2-3, analysis was performed under a condition that a transmission characteristic “S21” with respect to the power-source frequency of the power supplied to the power-supplying module 2 and the power-receiving module 3 in the power-supplying state had the double-hump characteristic. In Example 3-1 to Example 4-3, analysis was performed under a condition that the transmission characteristic “S21” with respect to the power-source frequency of the power supplied to the power-supplying module 2 and the power-receiving module 3 in the power-supplying state had the single-hump characteristic.
The transmission characteristic “S21” is signals measured by a network analyzer connected to the power-supplying module 2 and the power-receiving module 3, and is indicated in decibel. The greater the value, it means the power transmission efficiency is high. The transmission characteristic “S21” relative to the power-source frequency of the power supplied to the power-supplying module 2 and the power-receiving module 3 may have either single-hump or double-hump characteristic, depending on the strength of coupling (magnetic coupling) by the magnetic field between the power-supplying module 2 and the power-receiving module 3. The single-hump characteristic means the transmission characteristic “S21” relative to the power-source frequency has a single peak which occurs in the resonance frequency band (fo) (See dotted line 51
In the power-supplying module 2 and the power-receiving module 3 having the single-hump characteristic, the transmission characteristic “S21” is maximized (power transmission efficiency is maximized) when the power-source frequency is at the resonance frequency f0, as indicated by the dotted line 51 of
On the other hand, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, the transmission characteristic “S21” is maximized in a power-source frequency band (fL) lower than the resonance frequency fo, and in a power-source frequency band (fH) higher than the resonance frequency fo, as indicated by the solid line 52 of
It should be noted that, in general, if the distance between the power-supplying resonator 22 and the power-receiving resonator 32 is the same, the maximum value of the transmission characteristic “S21” having the double-hump characteristic (the value of the transmission characteristic “S21” at fL or fH) is lower than the value of the maximum value of the transmission characteristic “S21” having the single-hump characteristic (value of the transmission characteristic “S21” at f0) (See graph in
For example, when the transmission characteristic “S21” has the double-hump characteristic, if the power-source frequency of the AC power supplied to the power-supplying module 2 is set at a frequency band around a peak (fL) which appears in a frequency band lower than the resonance frequency fo, the power-supplying resonator 22 and the power-receiving resonator 32 are in phase and resonated, with the result that the direction of the current flowing in the power-supplying resonator 22 is identical with the direction of the current flowing in the power-receiving resonator 32. As the result, as shown in the graph of
Further, in the in-phase resonance mode, because the magnetic field generated on the outer circumference side of the power-supplying resonator 22 and the magnetic field generated on the outer circumference side of the power-receiving resonator 32 cancel each other out, the magnetic field spaces each having a lower magnetic field strength than the magnetic field strengths in positions not on the outer circumference sides of the power-supplying resonator 22 and the power-receiving resonator 32 (e.g., the magnetic field strengths on the inner circumference sides of the power-supplying resonator 22 and the power-receiving resonator 32) are formed on the outer circumference sides of the power-supplying resonator 22 and the power-receiving resonator 32, as the influence of the magnetic fields is lowered. When a stabilizer circuit 7, a charging circuit 8, a rechargeable battery 9, and the like desired to have less influence of the magnetic field is placed in this magnetic field space, occurrence of Eddy Current attributed to the magnetic field is restrained or prevented. This restrains negative effects due to generation of heat.
In the meanwhile, when, for example, the transmission characteristic “S21” has the double-hump characteristic and the power-source frequency of the AC power supplied to the power-supplying module 2 is set in a frequency band around the peak (fH) which appears in a frequency band higher than the resonance frequency fo, the power-supplying resonator 22 and the power-receiving resonator 32 are in antiphase and resonated, and hence the direction of the current flowing in the power-supplying resonator 22 is opposite to the direction of the current flowing in the power-receiving resonator 32. As the result, as shown in the graph of
Further, in the antiphase resonance mode, because the magnetic field generated on the inner circumference side of the power-supplying resonator 22 and the magnetic field generated on the inner circumference side of the power-receiving resonator 32 cancel each other out, the magnetic field spaces each having a lower magnetic field strength than the magnetic field strengths in positions not on the inner circumference side of the power-supplying resonator 22 and the power-receiving resonator 32 (e.g., the magnetic field strengths on the outer circumference side of the power-supplying resonator 22 and the power-receiving resonator 32) are formed on the inner circumference sides of the power-supplying resonator 22 and the power-receiving resonator 32, as the influence of the magnetic fields is lowered. When a stabilizer circuit 7, a charging circuit 8, a rechargeable battery 9, and the like desired to have less influence of the magnetic field is placed in this magnetic field space, occurrence of Eddy Current attributed to the magnetic field is restrained or prevented. This restrains negative effects due to generation of heat. Further, since the magnetic field space formed in this antiphase resonance mode is formed on the inner circumference side of the power-supplying resonator 22 and the power-receiving resonator 32, assembling the electronic components such as the stabilizer circuit 7, the charging circuit 8, the rechargeable battery 9, and the like within this space makes the power-supplying module 2 and the power-receiving module 3 themselves more compact, and improves the freedom in designing.
As shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 1-1, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 1-1, as compared to cases where the power-source frequency was set in the band A1 or in the band A3, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized when the power-source frequency was set in the band A2, in particular at 1.0 MHz. For this reason, the power consumption of the power-supplying module 2 in the standby state was reduced in this case, as compared to cases where the power-source frequency was set in the band A1 or in the band A3. However, as described above, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, as indicated by the full line 52 in
As shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 1-2, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 1-2, when the power-source frequency was set in the band B1 or in the band B2, in particular at around 1.19 MHz, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was large, and the power consumption of the power-supplying module 2 in the standby state was reduced. Furthermore, as described above, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, as indicated by the full line 52 in
A power-supplying module 2 of Example 1-3 includes a power-supplying coil 21 as shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 1-3, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 1-3, when the power-source frequency was set around 0.84 MHz in the band C1 or around 1.32 MHz in the band C2, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was relatively large, and the power consumption of the power-supplying module 2 in the standby state was reduced. Furthermore, as described above, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, as indicated by the full line 52 in
In Example 2-1 to Example 2-3, being different from Example 1-1 to Example 1-3, the capacitor C1 in the RLC circuit (the resistor R1, the coil L1, and the capacitor C1) constituting the power-supplying coil 21 in the power-supplying module 2 was connected in a parallel manner, as shown in
As shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 2-1, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 2-1, when the power-source frequency was set in the band D1, in particular at around 0.88 MHz, or set in the band D2, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized, and hence the power consumption of the power-supplying module 2 in the standby state was reduced. Furthermore, as described above, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, as indicated by the full line 52 in
A power-supplying module 2 of Example 2-2 includes a power-supplying coil 21, a power-supplying resonator 22, and a power-receiving resonator 32 as shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 2-2, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 2-2, when the power-source frequency was set in the band E2, in particular at around 1.0 MHz, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized, and hence the power consumption of the power-supplying module 2 in the standby state was reduced. However, as described above, in the power-supplying module 2 and the power-receiving module 3 having the double-hump characteristic, as indicated by the full line 52 in
A power-supplying module 2 of Example 2-3 includes a power-supplying coil 21 as shown in
In the standby state, as shown in
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 2-3, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 2-3, when the power-source frequency was set in the band F1, in particular at 1.0 MHz, the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized, and hence the power consumption of the power-supplying module 2 in the standby state was minimized.
As described above, in Example 3-1 to Example 4-3, the transmission characteristic “S21” with respect to the power-source frequency of the power supplied to the power-supplying module 2 and the power-receiving module 3 in the power-supplying state has a single-hump characteristic. To be more specific, a power-supplying module 2 and a power-receiving module 3 used in Example 3-1 to Example 4-3 are identical with those used in Example 1-1 to Example 2-3, except that the coupling coefficient k23 between the coil L2 in the power-supplying resonator 22 and the coil L3 in the power-receiving resonator 32 is set at 0.03. (In other words, the coupling coefficient k23 is varied so that the transmission characteristic “S21” has the single-hump characteristic).
A power-supplying module 2 of Example 3-1 includes a power-supplying coil 21 and a power-supplying resonator 22. In the meanwhile, a power-receiving module 3 includes a power-receiving resonator 32 and a power-receiving coil 31. Except that the coupling coefficient k23 is set at 0.03 (i.e., was arranged to have the single-hump characteristic), Example 3-1 is identical with Example 1-1.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 3-1, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 3-1, when the power-source frequency was set in the band G1, in particular at around 1.0 MHz (resonance frequency band), the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized, and hence the power consumption of the power-supplying module 2 in the standby state was minimized. Furthermore, as described above, in the power-supplying module 2 and the power-receiving module 3 having the single-hump characteristic, as indicated by the dotted line 51 in
A power-supplying module 2 of Example 3-2 includes a power-supplying coil 21, a power-supplying resonator 22, and a power-receiving resonator 32. In the meanwhile, a power-receiving module 3 includes a power-receiving coil 31. As described above, except that the coupling coefficient k23 is set at 0.03 (i.e., was arranged to have the single-hump characteristic), Example 3-1 is identical with Example 1-2.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 3-2, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 3-2, when the power-source frequency was set in the band H1 or in the band H2, there was a difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and hence the power consumption of the power-supplying module 2 in the standby state was reduced.
A power-supplying module 2 of Example 3-3 includes a power-supplying coil 21. In the meanwhile, a power-receiving module 3 includes a power-supplying resonator 22, a power-receiving resonator 32, and a power-receiving coil 31. As described above, except that the coupling coefficient k23 is set at 0.03 (i.e., was arranged to have the single-hump characteristic), Example 3-1 is identical with Example 1-3.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 3-3, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 3-3, when the power-source frequency was set in the band I1 or in the band I2, there was a difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and hence the power consumption of the power-supplying module 2 in the standby state was reduced. However, as described above, in the power-supplying module 2 and the power-receiving module 3 having the single-hump characteristic, as indicated by the dotted line 51 in
In Example 4-1 to Example 4-3, being different from Example 3-1 to Example 3-3, a capacitor C1 of a RLC circuit (a resistor R1, a coil L1, and a capacitor C1) constituting a power-supplying coil 21 in a power-supplying module 2 is connected in a parallel manner as in Example 2-1 to Example 2-3.
A power-supplying module 2 of Example 4-1 includes a power-supplying coil 21 and a power-supplying resonator 22. In the meanwhile, a power-receiving module 3 includes a power-receiving resonator 32 and a power-receiving coil 31. Furthermore, as described above, the power-supplying coil 21 is a RLC circuit formed of a resistor R1m a coil L1, and a capacitor C1, and the capacitor C1 is connected in a parallel manner. Furthermore, in the same manner as Example 3-1, the coupling coefficient k23 between the coil L2 in the power-supplying resonator 22 and the coil L3 in the power-receiving resonator 32 is set at 0.03 (i.e., set in the single-hump). The arrangements other than the above are identical with those of Example 3-1.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 4-1, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 4-1, when the power-source frequency was set in the band J1 or in the band J2, there was a difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and hence the power consumption of the power-supplying module 2 in the standby state was reduced.
A power-supplying module 2 of Example 4-2 includes a power-supplying coil 21, a power-supplying resonator 22, and a power-receiving resonator 32. In the meanwhile, a power-receiving module 3 includes a power-receiving coil 31. The power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31 are structurally identical with those in Example 4-1.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 4-2, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 4-2, when the power-source frequency was set in the band K1, the band K2 or the band K3, there was a difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and hence the power consumption of the power-supplying module 2 in the standby state was reduced.
A power-supplying module 2 of Example 4-3 includes a power-supplying coil 21. In the meanwhile, a power-receiving module 3 includes a power-supplying resonator 22, a power-receiving resonator 32, and a power-receiving coil 31. The power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31 are structurally identical with those in Example 4-1.
In regard to the power-supplying module 2 and the power-receiving module 3 of Example 4-3, an analysis result of the input impedance Zin (indicated by a dotted line in
In Example 3-1, when the power-source frequency was set in the band L1, in particular at around 1.0 MHz (resonance frequency band), the difference between the input impedance Zin of the power-supplying module 2 in the standby state and the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state was maximized, and hence the power consumption of the power-supplying module 2 in the standby state was minimized. Furthermore, as described above, in the power-supplying module 2 and the power-receiving module 3 having the single-hump characteristic, as indicated by the dotted line 51 in
As explained in Example 1-1 to Example 4-3 above, the power-supplying module 2 of the present embodiment is arranged such that the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, and driving is performed with a power-source frequency band with which the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state. Because in this arrangement the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, the power consumption of the power-supplying module 2 in the standby state is arranged to be restrained as compared to the power consumption in the power-supplying state.
Examples of elements (parameters) with which the power-supplying module 2 and the power-receiving module 3 are arranged so that the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state include the resistance value, inductance, and capacity of R1, L1, and C1 of the RLC circuit of the power-supplying coil 21, the resistance value, inductance, and capacity of R2, L2, and C2 of the RLC circuit of the power-supplying resonator 22, the resistance value, inductance, and capacity of R3, L3, and C3 of the RLC circuit of the power-receiving resonator 32, the resistance value, inductance, and capacity of R4, L4, and C4 of the RLC circuit of the power-receiving coil 31, the coupling coefficients k12, k23, and k39, and load impedance (load resistance). Furthermore, whether the RLC circuit in each of the power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31 is connected in a serial manner or in a parallel manner and whether the capacitor is connected or not are also elements (parameters). Furthermore, which one or more of the power-supplying coil 21, the power-supplying resonator 22, and the power-receiving resonator 32 is included in the power-supplying module 2 is also an element (parameter).
In addition to the above, according to Example 1-2, Example 2-2, Example 3-2, and Example 4-2, the input impedance Zin of the power-supplying module 2 in the standby state can be used as the input impedance of the power-supplying module 2 including the power-supplying coil 21, the power-supplying resonator 22, and the power-receiving resonator 32. According to this arrangement, because the power-supplying module 2 is formed of at least three elements, i.e., the power-supplying coil 21, the power-supplying resonator 22, and the power-receiving resonator 32, the number of the elements for determining the input impedance Zin of the power-supplying module 2 is large. When the number of the elements for determining the input impedance Zin of the power-supplying module 2 is large, the number of the elements for determining the relationship of the input impedance Zin of the power-supplying module 2 with the power-source frequency of the AC power source 6 is also large, with the result that the design freedom of the power-supplying module 2 is enhanced. In addition to the above, because the power-receiving module 3 is arranged to include the power-receiving coil 31, the downsizing of the power-receiving module 3 is realized.
In addition to the above, according to Example 1-1, Example 2-1, Example 3-1, and Example 4-1, the input impedance Zin of the power-supplying module 2 in the standby state can be used as the input impedance Zin of the power-supplying module 2 including the power-supplying coil 21 and the power-supplying resonator 22.
According to this arrangement, because the power-supplying module 2 is formed of at least two elements, i.e., the power-supplying coil 21 and the power-supplying resonator 22, the number of the elements for determining the input impedance Zin of the power-supplying module 2 is large. When the number of the elements for determining the input impedance Zin of the power-supplying module 2 is large, the number of the elements for determining the relationship of the input impedance Zin of the power-supplying module 2 with the power-source frequency of the AC power source 6 is also large, with the result that the design freedom of the power-supplying module 2 is enhanced. In addition to the above, because the power-receiving module 3 is arranged to include the power-receiving resonator 32 and the power-receiving coil 31, the downsizing of the power-receiving module 3 is realized.
In addition to the above, according to Example 1-3, Example 2-3, Example 3-3, and Example 4-3, the input impedance Zin of the power-supplying module 2 in the standby state can be used as the input impedance Zin of the power-supplying coil 21.
According to this arrangement, because the power-supplying module 2 is formed mainly of one element, i.e., the power-supplying coil 21, the element for determining the input impedance Zin of the power-supplying module 2 is unified. When the element for determining the input impedance Zin of the power-supplying module 2 is unified, the element for determining the relationship of the input impedance Zin of the power-supplying module 2 with the power-source frequency of the AC power source 6 is also unified, with the result that the design of the power-supplying module 2 is simplified.
(Design Method)
Now, a design method (adjustment) which is one process in the manufacturing of the power-supplying module 2 and the power-receiving module 3 will be described with reference to
What are designed by this design method are a charger 101 including the power-supplying module 2 and a wireless headset 102 including the power-receiving module 3, which are shown in
To begin with, as shown in
Next, the distance between the power-supplying resonator 22 and the power-receiving resonator 32 is determined (S2). The distance is the distance d23 between the power-supplying resonator 22 and the power-receiving resonator 32, while the wireless headset 102 having therein the power-receiving module 3 is placed on the charger 101 having therein the power-supplying module 2, i.e., during the power-supplying state. To be more specific, the distance d23 between the power-supplying resonator 22 and the power-receiving resonator 32 is determined, taking into account the shapes and the structures of the wireless headset 102 and the charger 101.
In addition to the above, based on the size, shape, and structure of each of the wireless headset 102 and the charger 101, the coil diameters of the power-supplying coil 21, the power-supplying resonator 22, the power-receiving coil 31, and the power-receiving resonator 32 are determined (S3).
Through the steps of S2 and S3, the coupling coefficient K23 and the power transmission efficiency between the power-supplying resonator 22 (coil L2) and the power-receiving resonator 32 (coil L3) are determined.
Based on the power reception amount of the power-receiving module 3 determined in S1 and on the power transmission efficiency determined through S2 to S3, the minimum power supply amount required for the power-supplying module 2 is determined (S4).
Furthermore, based on the power reception amount of the power-receiving module 3, the power transmission efficiency, and the minimum power supply amount required by the power-supplying module 2, a design value of the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state is determined (S5).
In addition to the above, based on the design value of the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, which has been determined in S5, the elements (parameters) are determined so that the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state. Examples of elements (parameters) with which the power-supplying module 2 and the power-receiving module 3 are arranged so that the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state include the resistance value, inductance, and capacity of R1, L1, and C1 of the RLC circuit of the power-supplying coil 21, the resistance value, inductance, and capacity of R2, L2, and C2 of the RLC circuit of the power-supplying resonator 22, the resistance value, inductance, and capacity of R3, L3, and C3 of the RLC circuit of the power-receiving resonator 32, the resistance value, inductance, and capacity of R4, L4, and C4 of the RLC circuit of the power-receiving coil 31, the coupling coefficients k12, k23, and k34, and load impedance (load resistance). Furthermore, whether the RLC circuit in each of the power-supplying coil 21, the power-supplying resonator 22, the power-receiving resonator 32, and the power-receiving coil 31 is connected in a serial manner or in a parallel manner and whether the capacitor is connected or not are also elements (parameters). Furthermore, which one or more of the power-supplying coil 21, the power-supplying resonator 22, and the power-receiving resonator 32 is included in the power-supplying module 2 is also an element (parameter).
According to the method above, because the input impedance Zin of the power-supplying module 2 in the standby state is higher than the input impedance Zin of the power-supplying module 2 and the power-receiving module 3 in the power-supplying state, the power consumption of the power-supplying module 2 in the standby state is reduced as compared to the power consumption in the power-supplying state.
Although the above description of the manufacturing method deals with the wireless headset 102 as an example, the method is applicable to any devices having a rechargeable battery; e.g., tablet PCs, digital cameras, mobile phone phones, earphone-type music player, hearing aids, and sound collectors.
Further, the above description deals with a power-receiving module 3 in which the power-supplied electronic device 10 includes a rechargeable battery 9; however, it is possible to adopt, as the power-supplied electronic device 10, a machine that directly consumes power for its operation.
Further, although the above description assumes the power-supplying module 2 and the power-receiving module 3 are mounted in a portable electronic device, the use of such modules is not limited to small devices. For Example, with a modification to the specifications according to the required power amount, the power-supplying module 2 and the power-receiving module 3 are mountable to a relatively large system such as a wireless charging system in an electronic vehicle (EV), or to an even smaller device such as a wireless endoscope for medical use.
Although the above descriptions have been provided with regard to the characteristic parts so as to understand the present invention more easily, the invention is not limited to the embodiments and the Examples as described above and can be applied to the other embodiments and Examples, and the applicable scope should be construed as broadly as possible. Furthermore, the terms and phraseology used in the specification have been used to correctly illustrate the present invention, not to limit it. Further, it will be obvious for those skilled in the art that the other structures, systems, methods or the like are possible, within the spirit of the invention described in the present specification. Accordingly, it should be considered that claims cover equivalent structures, too, without departing from the technical idea of the present invention. In addition, it is desirable to sufficiently refer to already-disclosed documents and the like, in order to fully understand the objects and effects of the present invention.
2 POWER-SUPPLYING MODULE
3 POWER-RECEIVING MODULE
6 AC POWER SOURCE
7 STABILIZER CIRCUIT
8 CHARGING CIRCUIT
9 RECHARGEABLE BATTERY
10 POWER-SUPPLIED ELECTRONIC DEVICE
11 VARIABLE RESISTOR
21 POWER-SUPPLYING COIL
22 POWER-SUPPLYING RESONATOR
31 POWER-RECEIVING COIL
32 POWER-RECEIVING RESONATOR
102 WIRELESS HEADSET
101 CHARGER
Number | Date | Country | Kind |
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2013-122696 | Jun 2013 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2014/064089 | 5/28/2014 | WO | 00 |