Claims
- 1. A transmission valve module, comprising:
a valve body having a top surface and at least one channel that routes transmission fluid; at least one circuit disposed on the top surface; and a cover disposed over at least a portion of said at least one circuit and attached to the valve body.
- 2. The transmission valve module of claim 1, wherein said at least one circuit is selected from the group consisting of a flexible circuit and a low temperature co-fired ceramic (LTCC) circuit.
- 3. The transmission valve module of claim 1, wherein said at least one circuit comprises a flexible circuit and a low temperature co-fired ceramic (LTCC) circuit.
- 4. The transmission valve module of claim 3, wherein the flexible circuit and the LTCC circuit are coupled together.
- 5. The transmission valve module of claim 3, wherein the flexible circuit is laminated to the top surface of the valve body.
- 6. The transmission valve module of claim 3, wherein a portion of the flexible circuit is not attached to the top surface of the valve body.
- 7. The transmission valve module of claim 3, wherein the LTCC circuit is attached to the top surface with adhesive.
- 8. The transmission valve module of claim 1, further comprising at least one solenoid attached to the top surface and coupled to said at least one circuit.
- 9. A transmission valve module, comprising:
a valve body having a top surface and a plurality of channels that route transmission fluid; a flexible circuit having a first portion attached to the top surface and a second portion that is not attached to the top surface; a second circuit attached to the top surface and coupled to the flexible circuit; a cover attached to the valve body, wherein the cover covers the second circuit and the first portion of the flexible circuit; a connector attached to the second portion of the flexible circuit and the cover; and a plurality of solenoids attached to the top surface and the flexible circuit.
- 10. The transmission valve module of claim 9, wherein the first portion of the flexible circuit includes a plurality of contact pads that are not covered by the cover, and wherein the plurality of solenoids contact the plurality of contact pads when the solenoids are attached to the top surface.
- 11. The transmission valve module of claim 9, wherein the first portion of the flexible circuit is attached to the top surface via lamination.
- 12. The transmission valve module of claim 9, wherein the second circuit is a low temperature co-fired ceramic (LTCC) circuit.
- 13. The transmission valve module of claim 9, further comprising at least one pressure switch disposed in the cover.
- 14. A method of manufacturing a transmission valve module, comprising:
attaching at least one circuit to a top surface of a valve body; attaching a cover covering said at least one circuit to the valve body, leaving at least one portion of said at least one circuit exposed; and attaching at least one solenoid to at least one exposed portion of said at least one circuit.
- 15. The method of claim 14, wherein the act of attaching at least one circuit comprises:
laminating a flexible circuit to the top surface; attaching a second circuit to the top surface with adhesive; and coupling the flexible circuit and the second circuit together.
- 16. The method of claim 14, further comprising:
attaching a connector to one of said at least one exposed portions of the flexible circuit; and attaching the connector to the cover.
- 17. The method of claim 16, wherein the act of attaching the connector is conducted via laser welding.
REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to provisional application No. 60/313,868 filed on Aug. 21, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
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60313868 |
Aug 2001 |
US |