Claims
- 1. A packaged product comprising (1) an integrated circuit or an electronic component comprising an integrated circuit, in a (2) container, wherein the container is made of an electroconductive resin composition consisting essentially of
- (A) a polystyrene resin, high impact polystyrene resin, or a mixture of thereof,
- (B) 5 to 50 parts by weight of carbon black per 100 parts by weight of (A); and
- (C) 1 to 30 parts by weight of an olefin resin per 100 parts by weight of (A);
- wherein said electroconductive resin composition has a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..
- 2. A packaged product comprising (1) an integrated circuit or an electronic component comprising an integrated circuit, in a (2) container, wherein the container is made of an electroconductive resin composition consisting essentially of
- (A) a polystyrene resin, high impact polystyrene resin, or a mixture of thereof,
- (B) carbon black,
- (C) an olefin resin, and
- (D) at least one block copolymer prepared from styrene and a conjugated diene,
- said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A),
- and from 1 to 30 parts by weight of (C) the olefin resin and from 0.2 to 10 parts by weight, of (D) the block copolymer prepared from styrene and a conjugated diene, per 100 parts by weight of the total amounts of (A) and (B) the carbon black,
- and wherein said electroconductive resin composition has a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..
- 3. A packaged product comprising (1) an integrated circuit or an electronic component comprising an integrated circuit, in a (2) container, wherein the container is made of an electroconductive resin composition, consisting essentially of
- (A) a polystyrene resin, high impact polystyrene resin, or a mixture of thereof,
- (B) carbon black,
- (C) an olefin resin, and
- (E) a resin obtained by hydrogenation of a block copolymer prepared from styrene and a conjugated diene and/or a resin obtained by graft polymerization of styrene to a polyolefin,
- said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A),
- and from 1 to 30 parts by weight of (C) the olefin resin and from 1 to 30 parts by weight, of (E) the resin obtained by hydrogenation of a block copolymerization prepared from styrene and a conjugated diene and/or the resin obtained by graft polymerization of styrene to a polyolefin, per 100 parts by weight of the total amount of (A) and (B) the carbon black,
- and wherein said electroconductive resin composition has a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..
- 4. A packaged product comprising (1) an integrated circuit or an electronic component comprising an integrated circuit, in a (2) container, wherein the container is made of an electroconductive resin composition consisting essentially of
- (A) a polystyrene resin, a high impact polystyrene resin, or a mixture thereof,
- (B) carbon black,
- (C) an olefin resin, and
- (D) at least two block copolymers prepared from styrene and a conjugated diene,
- wherein at least one of them is (D1) a star block copolymer having a styrene content of from 50 to 90 wt %, and at least one of other block copolymers is (D2) a star of linear block copolymer having a styrene content of from 10 to 50 wt %,
- said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A),
- and from 1 to 30 parts by weight of (C) the olefin resin and from 0.2 to 10 parts by weight, of (D) the block copolymers prepared from styrene and a conjugated diene, per 100 parts by weight of the total amounts of (A) and (B) the carbon black,
- and wherein said electroconductive resin composition has a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..
- 5. The packaged product according to claim 1, wherein (C) the olefin resin is a polyethylene resin.
- 6. The packaged product according to claim 2, wherein (C) the olefin resin is a polyethylene resin.
- 7. The packaged product according to claim 3, wherein (C) the olefin resin is a polyethylene resin.
- 8. The packaged product according to claim 4, wherein (C) the olefin resin is a polyethylene resin.
Priority Claims (3)
Number |
Date |
Country |
Kind |
7-10685 |
Jan 1995 |
JPX |
|
7-10686 |
Jan 1995 |
JPX |
|
7-87000 |
Apr 1995 |
JPX |
|
Parent Case Info
This application is a Continuation of application Ser. No. 08/917,606 Filed on Aug. 26, 1997, now U.S. Pat. No. 5,876,632, which is a Continuation of Ser. No. 08/834,297, filed Apr. 15, 1997, now U.S. Pat. No. 5,707,699, which is a Continuation of Ser. No. 08/578,480, filed Dec. 26, 1995, abandoned.
US Referenced Citations (7)
Continuations (3)
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Number |
Date |
Country |
Parent |
917606 |
Aug 1997 |
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Parent |
834297 |
Apr 1997 |
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Parent |
578480 |
Dec 1995 |
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