Patent Application
20210226151
The present application relates to display technology, and more particularly to an anode structure used for an organic electroluminescent device and a manufacturing method, as well as application of the anode structure.
Organic light-emitting diode (OLED) display technology have become a new generation flat display technology since they have many excellent characteristics such as self-illumination, low energy consumption, wide viewing angles, rich color, quick response times, and flexible screen applications.
An indium tin oxide (ITO) conductive film serves as an ideal transparent electrode and is widely used in an organic electroluminescent device due to its low resistance, high transmittance, good thermal stability, and the process for manufacturing and patterning the ITO conductive film is simple.
Referring to
During manufacturing of the above organic electroluminescent device 1, it is necessary to wet-etch the conductive film of the three-layer superimposed ITO/Ag/ITO for manufacturing a required pattern of the electrodes.
Refer to
In addition, over-etching is likely to occur when the first ITO film is etched, and over-etching of the ITO film causes the Ag film to be exposed, thereby causing undesirable effects such as vulcanization of the Ag film.
Moreover, since the crystallized ITO can improve the transmittance characteristics of the ITO film, as shown in
In order to solve the problem that the ITO film and the Ag film need to be etched separately, an ITO/Ag/ITO etching solution dedicated to the AM-OLED display has been developed. The specific etching solution is mainly prepared by filtering and mixing the phosphoric acid, acetic acid, nitric acid, a surfactant, an additive, and pure water. However, the specific etching solution is not stable, and it is difficult to control the etching angle and the etching amount of the Ag film during the etching process, thereby affecting repeatability of the etching effect.
It is therefore necessary to provide a novel electrode material and an organic electroluminescent device using the novel electrode material to solve the problems as described above.
An object of the present invention is to provide a display panel and a method of producing the same to promote the display quality of the display panel.
An object of the present application is to provide an electrode and a manufacturing method of the electrode. The electrode is applicable to an OLED display technology or a flexible OLED display technology. In the organic electroluminescent device, since the indium zinc oxide film of the electrode 3 in this embodiment is an amorphous film which can be etched fast, and the electrode of the organic electroluminescent device can be wet-etched by using only an etching solution and an apparatus of an Ag alloy, so that the etching of the electrode 3 is completed by using the same etching solution on the same etching device, thereby achieving the purpose of simplifying the OLED manufacturing process. In addition, although the indium zinc oxide film is an amorphous film, it has similar transmittance characteristics to the crystallized ITO. Therefore, no annealing treatment is required in the manufacturing process of the electrode 3, thereby avoiding the Hillock phenomenon of the Ag film caused by the high temperature reaction during the annealing treatment.
To achieve above objects, the present application firstly provides an electrode, including a first indium zinc oxide film, a metal film, and a second indium zinc oxide film which are laminated in sequence, wherein the metal film is made of an Ag alloy.
In one embodiment, the first indium zinc oxide film has a thickness ranging from 5 nm to 40 nm; the metal film has a thickness ranging from 80 nm to 160 nm; and the second indium zinc oxide film has a thickness ranging from 5 nm to 40 nm.
In one embodiment, the Ag alloy is a silver palladium copper alloy (Ag—Pd—Cu).
The present application further provides a manufacturing method of the abovementioned electrode, comprising the following steps: step (S1) of providing a film formation substrate; step (S2) of forming a first indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the film formation substrate; step (S3) of forming a metal film having a thickness ranging from 80 nm to 160 nm on the first indium zinc oxide film; and step (S4) of forming a second indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the metal film; wherein the metal film is made of an Ag alloy.
In one embodiment, in the step (S1), the film formation substrate is a glass substrate, a polyimide substrate, or a film substrate.
In one embodiment, the Ag alloy is a silver palladium copper alloy (Ag—Pd—Cu).
In one embodiment, the first indium zinc oxide film, the metal film, and the second indium zinc oxide film are formed by a direct current magnetron sputtering process.
In one embodiment, a direct current ranging from 2 kW to 8 kW and a sputtering pressure ranging from 0.2 Pa to 1 Pa are carried out during the direct current magnetron sputtering process.
The skilled person in the art can understand that the direct current magnetron sputtering process can be executed by any known apparatus. For example, in one embodiment, the direct current magnetron sputtering process is carried out in a vacuum coating apparatus. The vacuum coating apparatus can be, but not limited to, a monomer coating equipment, a continuous coating equipment, or an integrated coating equipment.
In one embodiment, the direct current magnetron sputtering process is completed in a film forming chamber of the vacuum coating apparatus. The vacuum degree of the film forming chamber is below 4×10−5 Pa. An inert gas is used for the sputtering gas, for example, but not limited to, argon (Ar) gas. In addition, alternatively, in the step (S2) and the step (S4) of forming the first indium zinc oxide film and the second indium zinc oxide film, the Ar gas can be added with oxygen (O2) or hydrogen (H2), and control a volume percentage of the oxygen to be 0.1% to 5% and the flow rate of the hydrogen to be 1-10 standard ml/min (sccm).
in one embodiment, in the step (S2) and the step (S4) of performing the direct current magnetron sputtering process by using indium zinc oxide target. The indium zinc oxide target contains Zn, the content of Zn is 1-10 wt %. In the step (S3), the direct current magnetron sputtering process is performed by using silver palladium copper alloy target.
Therefore, an specific embodiment of the present application is to provide a manufacturing method of an electrode, comprising following steps: step (S1) of providing a film formation substrate; step (S2) of using indium oxide target to carry out a direct current magnetron sputtering process, so as to form a first indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the film formation substrate; step (S3) of using silver palladium copper alloy target to carry out a direct current magnetron sputtering process, so as to form a metal film having a thickness ranging from 80 nm to 160 nm on the first indium zinc oxide film; and step (S4) of using indium zinc oxide target to carry out a direct current magnetron sputtering process, so as to form a second indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the metal film; wherein a direct current ranging from 2 kW to 8 kW and a sputtering pressure ranging from 0.2 Pa to 1 Pa are carried out during the direct current magnetron sputtering process. In addition, the step (S1) to the step (S4) are carried out in a film forming chamber of the vacuum coating apparatus. The vacuum degree of the film forming chamber is below 4×10−5 Pa.
The present application further provides an organic electroluminescent device, using the above electrode as an anode of the organic electroluminescent device, organic electroluminescent device organic electroluminescent device
In one embodiment of the present application, the organic electroluminescent device comprises a substrate; and a first electrode, an organic layer, and a second electrode which are disposed in sequence on the substrate, wherein the first electrode is an anode; the second electrode is a cathode. The organic layer comprises an electron injection layer, an electron transmission layer, a light emitting layer, a hole transmission layer, and a hole injection layer which are disposed in sequence. The anode is a IZO/APC/IZO conductive film including a first indium zinc oxide film (In—Zn-Oxide film, IZO film), a metal film (silver palladium copper alloy, Ag—Pd—Cu, APC), and a second indium zinc oxide film. The cathode is made of any known material of cathode, such as a Mg/Ag alloy. The organic layer can also include other functional layers according to specific performances of different organic electroluminescent devices. The different composition of the organic layer does not affect the structure of the anode.
In addition, the present application further provides a display panel, comprising:
a substrate being a glass substrate, a polyimide substrate, or a film substrate;
a thin film transistor device layer formed on the substrate and having a drain; and
an organic electroluminescent device layer formed on the thin film transistor device layer;
wherein the organic electroluminescent device layer comprises a first electrode as being an anode, an organic layer, and a second electrode as being a cathode, the first electrode contact with the drain of the thin film transistor device layer; and
the first electrode comprises a first indium zinc oxide film, a metal film, and a second indium zinc oxide film which are laminated in sequence, wherein the metal film is made of an Ag alloy.
In one embodiment of the present application, the first indium zinc oxide film has a thickness ranging from 5 nm to 40 nm; the metal film has a thickness ranging from 80 nm to 160 nm; and the second indium zinc oxide film has a thickness ranging from 5 nm to 40 nm.
In one embodiment of the present application, the Ag alloy is a silver palladium copper alloy (Ag—Pd—Cu). The skilled person in the art can understand that the silver palladium copper alloy is a well-known and commercially available material. Usually, the silver palladium copper alloy contains silver element of 90-95 wt %, palladium element of 4-8 wt %, and copper element of about 1 wt %.
In order to more clearly illustrate the technical solutions in the embodiment or in the present invention, the following drawings, which are intended to be used in the description of the embodiment or of the present invention, will be briefly described.
The technology of the present application will be described in detail below in combination with specific embodiments. It should be understood that the following specific embodiments are only used to assist those skilled in the art to understand this application and not to limit the application.
In this embodiment, an electrode 3 is provided. As shown in
The first indium zinc oxide film 31 has a thickness ranging from 5 nm to 40 nm; the metal film 32 has a thickness ranging from 80 nm to 160 nm; and the second indium zinc oxide film 31 has a thickness ranging from 5 nm to 40 nm. The metal film 32 is made of a silver palladium copper alloy (Ag—Pd—Cu). The silver palladium copper alloy is a well-known and commercially available material. Usually, the silver palladium copper alloy contains silver element of 90-95 wt %, palladium element of 4-8 wt %, and copper element of about 1 wt %.
As shown in
Step S1 of providing a film formation substrate. The film formation substrate is a glass substrate, a polyimide substrate, or a film substrate. It can be understood that the film formation substrate has structures formed by several previous processes thereon, for example, it is possible to include an inorganic layer, some layers of a thin film transistor, or a completed thin film transistor and traces. Specifically, the structures are determined according to the film to be formed by the corresponding process in the whole process flow.
Step S2 of placing the substrate obtained by the step S1 in a film forming chamber of a vacuum coating apparatus, and controlling a vacuum degree of the film forming chamber below 4×10−5 Pa to performing a direct current magnetron sputtering process by using an indium zinc oxide target, so as to form a first indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the film formation substrate.
Step S3 of using a silver palladium copper alloy target to perform a direct current magnetron sputtering process under same vacuum degree of the step S2, so as to form a metal film having a thickness ranging from 80 nm to 160 nm on the film formation substrate, wherein the Zn content of the indium zinc oxide target is 1-10 wt %.
Step S4 of using an indium zinc oxide target to perform a direct current magnetron sputtering process under same vacuum degree of the step S2, so as to form a second indium zinc oxide film having a thickness ranging from 5 nm to 40 nm on the metal film.
In the direct current magnetron sputtering process, a direct current ranging from 2 kW to 8 kW, a sputtering gas is argon, and a sputtering pressure ranging from 0.2 Pa to 1 Pa are carried out.
The vacuum coating apparatus can be, but not limited to, a monomer coating equipment, a continuous coating equipment, or an integrated coating equipment.
In the step (S2) and the step (S4) of forming the first indium zinc oxide film and the second indium zinc oxide film, the Ar gas can be added with oxygen (O2) or hydrogen (H2), and control a volume percentage of the oxygen to be 0.1% to 5% and the flow rate of the hydrogen to be 1-10 standard ml/min (sccm).
Furthermore, this embodiment provides an organic electroluminescent device 5 as shown in
As shown in
The organic layer 54 of the electroluminescent device 5 has a structure known in the art, or further includes other accessibility layers. For example, as shown in
The skilled person in the art can understand that the abovementioned layers is formed by materials known in the art, and the specific selection of these materials does not affect the implementation of the technical solutions and obtain of the technical effects in the present application.
The cathode 52 is made of metals with lower work functions, such as lithium, magnesium, calcium, strontium, aluminum, or indium, or alloys formed by the metals and copper, gold, or silver, for example but not limited to Al, Mg/Ag alloy. Alternatively, the cathode 52 can be an electrode layer formed by a metal and a metal fluoride alternately, for example but not limited to an electrode formed by lithium fluoride and aluminum layer alternately. Of course, the cathode 52 can also be made of ITO or IZO.
The electron injection layer 541 can be formed by, for example but not limited to, one of graphene, carbon nanotube, ZnO, TiO2, and Cs2CO3.
The electron transmission layer 543 can be formed by, for example but not limited to, one of 4,7-diphenyl-1,10-phenanthroline (Bphen), 1,3,5-tris(N-phenylbenzimidazol-2-yl)benzene (TPBi), Bathocuproine (BCP), Tris(8-hydroxyquinoline)aluminum (Alq3).
The hole transmission layer 547 can be formed by, but not limited thereto, one of aromatic diamines, aromatic triamines, carbazoles, triphenylamines, furan based compounds, spiral compounds, polymer materials.
Refer to
Furthermore, a display panel 7 is provided in this embodiment as referred to
a substrate 70, wherein the substrate 70 is a glass substrate, a polyimide substrate, or film substrate;
a thin film transistor device layer 72 formed on the substrate 70 and having a drain 721; and
an organic electroluminescent device layer 74 formed on the thin film transistor device layer 72.
In this embodiment, the organic electroluminescent device layer includes the electrode 3 as being an anode, an organic layer 741, and a second electrode 742 as being a cathode. The electrode 3 contacts with the drain 721 of the thin film transistor device layer 72.
One skilled in the art can understand that the display panel 7 has an essential structure of OLDE display panel as known in the art. for example, as shown in
The present application has been described by the above related embodiments, but the above embodiments are merely examples for implementing the present application. It must be noted that the disclosed embodiments do not limit the scope of the present application. Rather, modifications and equivalent arrangements included in the spirit and scope of the claims are intended to be included within the scope of the present application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201810605063.8 | Jun 2018 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2018/099399 | 8/8/2018 | WO | 00 |
