Claims
- 1. A method of enhancing heat and mass transfer in dielectric fluids, said method comprising the steps of:embedding a set of electrodes comprising a first electrode and a second electrode in a heat transfer wall material having an interior heat transfer surface and an exterior heat transfer surface, the heat transfer wall material being electrically nonconductive; insulating the set of electrodes with the heat transfer wall material along said interior and exterior heat transfer surfaces; exposing said heat transfer wall material to a dielectric fluid; and supplying high voltage to said set of electrodes.
- 2. The method of claim 1 further comprising the steps of supplying a high negative voltage to said first electrode and a high positive voltage to said second electrode.
- 3. The method of claim 2 which said wall material has a first end and a second end and said method includes the further step of arranging said set of electrodes within said wall material such that said first electrode and said second electrode alternate in polarity from said first end of said wall material to said second end of said wall material.
- 4. The method of claim 3 wherein high voltage is simultaneously supplied to said first and second electrodes.
- 5. The method of claim 4 in which said wall material is tube-shaped and wherein said first and second electrodes are helically disposed within said wall material.
- 6. The method of claim 4 which said wall material is planar and wherein said first and second electrodes are interdigitatedly arranged within said wall material.
- 7. The method of claim 3 further comprising the step of embedding two sets of electrodes within said wall material.
- 8. The method of claim 7, wherein said two sets of electrodes are alternately disposed within said wall material.
- 9. The method of claim 8 including the step of sequentially supplying high voltage to said two sets of electrodes.
- 10. An apparatus for enhancing heat and mass transfer when exposed to dielectric fluids, comprising:a heat transfer wall formed from a heat transfer wall material, the heat transfer wall material being electrically nonconductive; an interior heat transfer surface defined by the heat transfer wall; an exterior heat transfer surface defined by the heat transfer wall; and a plurality of high voltage electrodes encased within the heat transfer wall, the heat transfer wall material insulating the high voltage electrodes.
- 11. The apparatus of claim 10, further comprising an electric field produced by the application of a high voltage to the high voltage electrodes, the electric field extending beyond the exterior and interior heat transfer surfaces, the electric field having an intense electric field gradient in close proximity to the interior and exterior heat transfer surfaces.
- 12. The apparatus as claimed in claim 11, wherein each of the high voltage electrodes is capable of being alternatively excited to a high positive voltage and a high negative voltage.
- 13. The apparatus as claimed in claim 11, wherein the high voltage electrodes are capable of being excited to high voltage simultaneously.
- 14. The apparatus as claimed in claim 11, further comprising:the heat transfer wall having a first end and a second end; and a high voltage connection disposed on each of the high voltage electrodes at the first end of the heat transfer wall.
- 15. The apparatus as claimed in claim 11, wherein the plurality of high voltage electrodes are capable of being electrified sequentially.
- 16. The apparatus as claimed in claim 11, wherein the heat transfer wall is tube-shaped and the high voltage electrodes are encased within the heat transfer wall in a helical orientation.
- 17. The apparatus as claimed in claim 11, wherein the heat transfer wall is planar and the high voltage electrodes are encased within the heat transfer wall in an interdigitated orientation.
- 18. The apparatus as claimed in claim 11, wherein the plurality of high voltage electrodes further comprises a first electrode and a second electrode alternatively encased within the heat transfer wall.
CROSS REFERENCES TO RELATED APPLICATIONS
This application claims the benefit of U.S. Provisional Application No. 60/001,781 filed Aug. 2, 1995.
US Referenced Citations (17)
Foreign Referenced Citations (2)
Number |
Date |
Country |
879241 |
Nov 1981 |
SU |
879249 |
Nov 1981 |
SU |
Non-Patent Literature Citations (1)
Entry |
Author Unknown, “Dielectrics in Electric Fields”, C & EN, May 14, 1956, pp. 2370-2372. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/001781 |
Aug 1995 |
US |