Patent Application
20190111250
This disclosure relates generally to the field of electrodes for neurological monitoring, and more specifically to electrodes for use during computerized tomography scanning and magnetic resonance imaging.
Neurological monitoring electrodes are used to obtain signals from the brain. Electrodes may be attached to the scalp of a patent by using adhesives or by insertion directly into the surface of the scalp. The electrodes are connected by wire conductors to a device that receives electrical signals, processes them and displays the processed signals for technicians and physicians to evaluate. The signals may be processed, for example, to provide two-dimensional images of the brain so that the sources of signals and their relative positions can be readily located.
Certain types of procedures, notably computerized tomography (CT) scans and magnetic resonance imaging (MRI) can detect metal and indeed react with it. CT scans are essentially a series of X-rays in the wavelength range of 10-0.01 nm. MRI's operate based on a rapidly changing magnetic field in the radio wave wavelength region of the electromagnetic spectrum, with a wavelength of about a meter. Copper is generally not magnetic; tin is not magnetic. Tin is less transparent to X-rays than copper.
To avoid artifacts in CT and MRI images, monitoring electrodes, which are made of tinned copper, may be temporarily removed during CT and MRI procedures. If electrodes or other metal objects are left in place, the presence of metal results in artifacts appearing in the CT and MRI images. Artifacts may interfere with the evaluation of the images and certainly degrade the quality of the images.
While removing the electrodes before CT and MRI procedures and reinstalling them afterwards involves additional time, expense and risk of mistakes, it can reduce the number of artifacts and thereby preserve the image quality.
A way to reduce artifacts without removal of the electrodes and their lead wires before beginning CT scans and MRI procedures would be an advantage.
Disclosed herein is an electrode assembly that provides significant reduction in artifacts when the electrode assembly remains attached to the scalp of a patient during CT scans and MRI. The reduction results from material selection and connection technique, the use of multiple, thinner wires in the conductor, and the use of copper electrodes that without tin.
An aspect of the disclosure is an electrode assembly including an electrical lead wire having a first end and a second end. The lead wire includes at least one conductor made of copper without a tin coating, save perhaps at its ends and an electrode attached to the second end of the lead wire. The electrical conductors in a lead wire are at least 39 gauge and may be 40 gauge. There may be as many as 19 conductors in lead wire.
Another aspect of the disclosure is that the lead wire may be welded or heat-staked to the electrode.
Another aspect of the disclosure is that the lead wire and electrode may be attached together using a copper crimp or a polymeric crimp.
An aspect of the disclosure is that the lead wire and the electrode may be attached together using heat-shrinkable tubing, which may be conductive shrinkable tubing, or a plastic tie.
Those skilled in neurological monitoring will appreciate these and other features of the disclosure from a careful reading of the Detailed Description accompanied by the drawings.
In the description of the present electrode assembly, the term “electrode assembly” refers to three components: the electrode, the lead wire that is connected to and runs from the electrode, and the plug on the other end of the lead wire, and also includes the connections between these three components.
The term lead wire refers to an insulated electrical conductor or bundle of electrical conductors. A bundle of electrical conductors may also be referred to herein as a plurality of electrical conductors.
Copper wire is generally tinned, covered with a layer of tin giving it a silver appearance rather than a copper appearance to make it easier to solder. The tin also helps to prevent corrosion. Other coatings may be used in place of tin, such as silver and gold.
The improvement in prior art electrode assemblies disclosed and described herein makes them suitable for leaving in place during a CT or MRI procedure, and thereby avoids having to remove them for the procedure and then reattach them afterwards. The removal and reattachment take time, which is expensive in the context of medical procedures, and also increased the possibility of errors or mistakes. The improvement directly results in fewer, smaller, less intrusive artifacts being visible in the images made by CT scans and MRI procedures. It is because of the artifacts left by prior art electrode assemblies during these procedures that the prior art electrodes are best removed prior to the commencement of these procedures.
In order to improve prior art electrodes and make them suitable for remaining attached to a patient's head during a CT scan or MRI procedure and reduce the impact of artifacts in the resulting images, a number of improvements are described herein to the basic materials and their connections over the prior art electrode assembly. The prior art electrode assembly may include an electrode soldered to a lead wire with a plug on the distal end of the lead wire. The plug is formed to insert into a neurological monitoring device and thereby be held there and have the electrode be in electrical connection with the device.
An improved electrode assembly, generally indicated by reference number 10, in
As shown in
Electrical conductors 34 in the present electrode assembly 10 are thinner than conductors in prior art electrode assemblies. The number of individual electrical conductors 34 may be at least the same as that used in the prior art. For example, prior art lead wires comprise 19 electrical conductors of 38-gauge tinned copper wire insulated from the surroundings by medical grade PVC. Lead wire 18 may also include 19 electrical conductors, or more, and are made of 40-gauge untinned copper wire insulated in medical grade PVC. The finer gauge results in a thinner diameter of electrical conductors 34, namely, 1 mm versus 1.18 mm. The absence of tin results in electrical conductors 34 having a copper-colored appearance rather than silver-colored copper electrical conductors. More importantly, the absence of tin reduces the operating temperature of electrical conductors 34 during CT and MRI procedures and the visibility of the wire to the wavelengths of electromagnetic radiation used in CT and MRI procedures. Thus, use of tin-free copper wire reduces the impact of artifacts and the temperature rise of the electrode assemblies during CT scans and MRI procedures.
Furthermore, in place of a brass electrode as done in prior art electrode assemblies, a silver-filled or silver-coated conductive epoxy electrode or a pure copper electrode may be used. Alternatively, in place of a brass crimp to hold electrode 14 to lead wire 18, a conductive epoxy or heat shrinkable polymeric tube may be used. Alternatively, electrical conductors 34 may be welded to electrode 14 using radio frequency welding or by heat staking, both of which are known means for attaching two members together. In radio frequency welding, a high frequency is used to cause two part to bond together. In heat staking, two or more parts are physically joined in which one of the parts is made of plastic. The plastic part deforms when heat is applied to an adjacent part and wraps around the part to which it is to be attached.
A prior art electrode assembly having electrically conducting lead wire (24 cm) with MR PRESSON electrode, sold by Persyst Development Corporation, was exposed in a CT scan. The observed temperature increase of the electrode was 1.6° C. (0.5° C. background) by 1.5 T and 4.9° C. by 3.0 T. A sample of the present electrically conducting wire (24 cm) with the same MR PRESSON electrode attached was also exposed in a CT scan. The observed temperature increase of the electrode was 2.1° C. at 1.5 T and a 2.2° C. at 3.0 T was observed. The difference between the two electrode assemblies is thinner gauge wire (39 gauge versus 38 gauge) and the absence of tin coating in the second electrode assembly. Although the difference in the gauge of the wire and the absence of tin increased the temperature initially, by 0.6° C. at 1.5 T over the prior art electrode assembly, however, thereafter the temperature did not continue to increase appreciably and was well below the 4.9° C. temperature at 3.0 T of the prior art conducting wire. This result for temperature corroborates the results of CT scan images shown in
Additional measures also reduce artifacts in addition to electrical conductor gauge and the absence of tin. These additional measures include eliminating the brass crimp that holds the electrical conductor to the electrode by using radio frequency welding or heat staking to connect the electrode with the electrical conductors of the lead wire directly. Also, a pure copper electrode or polymeric-based, silver-filled electrode in place of a brass electrode reduces the effect of artifacts on images made during CT and MRI procedures. Alternatively, a different type of mechanical connection may be used in place of a brass crimp, such as use of heat shrinkable tubing to connect lead wire to electrode, or by tying the electrode head to the lead wire electrical conductors.
Minimally, the electrical conductors of the lead wire are tin-free save for their ends and then using tin for effecting a soldered joint. If the gauge of the electrical conductors is increased beyond 39 gauge to 40 gauge, so that the electrical conductors are thinner, the effect on artifacts and temperature during CT or MRI procedures is further reduced. If, the connection between the lead wire and the electrode is not a soldered connection and based on use of electrically conductive, silver-filed epoxy, the improvement in the reduction of artifacts is greater still.
Those skilled in the art of electrodes used in neurological monitoring will appreciate that many substitutions and modifications may be made to the foregoing description of aspects of the disclosed electrode assembly without departing from the spirit and scope of the disclosure.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US17/41834 | 7/13/2017 | WO | 00 |
| Number | Date | Country | |
|---|---|---|---|
| 62361818 | Jul 2016 | US |
