The present invention relates to an electrode material for thermal fuses used in electronic equipment and home appliances to prevent abnormal increase in temperature for these devices, a manufacturing method thereof and a thermal fuse comprising the electrode material.
Thermal fuses used to prevent devices from developing abnormally high temperature, will shut off electrical current by the following mechanism: a temperature sensitive pellet is melted at an operating temperature to release a strong compressed spring, and then the extension of the strong compressed spring will separate an electrode material and a lead wire which are press-contacted by the strong compressed spring. An Ag—CdO alloy is commonly used as the electrode material. However, use of an Ag—CdO alloy is limited in view of environmental problems because Cd is a toxic substance.
Further, in the case of an Ag—CdO alloy, a melt adhesion phenomenon with a metal housing may occur because an electrode material is used as a thin plate, and the passage of electrical current through the contacting surface with a lead wire is maintained for a long time. In that case, a problem is that the Ag—CdO alloy cannot function as a thermal fuse. To address the above problem, melt adhesion resistance can be improved by increasing the content of CdO in the Ag—CdO alloy. However, the function of a thermal fuse will be adversely affected because contact resistance increases as the content of CdO increases, which causes increase in temperature at the contact portion.
Accordingly, in recent years, an Ag—CuO alloy has been used for an electrode material for thermal fuses (for example, see Patent Literature 1, Patent Literature 2).
Such an Ag—CuO alloy is becoming the mainstream for electrode materials for thermal fuses, but there are demands for increasing the content of CuO in order to lower the price and also for reducing a plate thickness.
However, in the Ag—CuO alloy, rolling workability is significantly reduced as the content of CuO is increasing, and processing into a thin plate may be difficult at the rolling process after internal oxidation. In particular, conventionally, a material having a Cu content of more than 20 mass % can not be processed by 50% or more in terms of the cross-sectional reduction rate.
An object of the present invention is to solve the above problem.
According to the present invention, an electrode material is provided having a structure in which an internally oxidized layer 3 is formed at each of the front and back surfaces of an internally oxidizable alloy comprising 50 to 99 mass % of Ag and 1 to 50 mass % of Cu, and having a non-oxidized layer in the central portion.
Internal oxidation treatment involves a process in which Cu contained in Ag by pre-dissolution precipitates as oxides in the Ag matrix by binding to oxygen which is occluded into Ag through a surface layer of the material. At this time, a phenomenon occurs in which Cu, a solute element, diffuses toward the surface layer from the central portion of the material.
This diffusion phenomenon refers to a phenomenon in which Cu diffuses toward a surface layer from a non-oxidized layer to counteract a concentration gradient created by difference in the concentrations between an internally oxidized layer comprising oxides precipitated from the surface of the material toward the interior portion, and the non-oxidized layer, not showing precipitation over time.
The present invention is characterized in that only a surface layer of a material forms an internally oxidized structure in the internal oxidation treatment, and conditions for achieving this are adjusted so that they fall in 600° C. to 750° C., 1 to 5 hours and 1 to 5 atm of oxygen pressure in an internal oxidation furnace. By this, a layer which is not oxidized, i.e., a non-oxidized layer can be formed in the central portion of the material (
A thin plate material of 0.1 mm or less is used for an electrode material for thermal fuses based on the structure of thermal fuses, and therefore, a material after internal oxidation needs to be rolled into 0.1 mm or less.
Further, increased oxide content and a reduced plate thickness are demanded for the purpose of cost reduction. However, according to the conventionl manufacturing methods, a material having a Cu content of mroe than 20 mass % can not be rolled by 50% or more in terms of the corss-sectional reduction rate as described above. This is because rolling workability is significantly reduced as oxides are increasing.
According to the present invention, by forming a non-oxidized layer between internally oxidized layers, increase in contact resistance can be controlled, and rolling process can be successfully performed by 70% or more in terms of the cross-sectional reduction rate even if 50 mass % of Cu is contained.
The reasons for adding 1 to 50 mass % of Cu herein are as follows: an internally oxidized alloy good enough for use as an electrode material for thermal fuses can not be obtained in a case where the content of Cu is less than 1 mass %; and in the case of more than 50 mass %, temperature will increase due to increased contact resistance, which is not suitable for an electrode material for thermal fuses and a thermal fuse comprising the electrode material.
Further, provided is a structure in w3hich an internally oxidized layer is formed at each of the front and back surfaces of an internally oxidizable alloy comprising 50 to 99 mass % of Ag, 1 to 50 mass % of Cu and 0.1 to 5 mass % of at least one of Sn and In, and having a non-oxidized layer in the central portion.
By adding Sn and/or In, a composite oxide with Cu, for exampie (Cu—Sn)Ox can be obtained, showing an effect of improving melt adhesion resistance.
The reasons for having 0.1 to 5 mass % of at least one of Sn and In herein are as follows: in the case of less than 0.1 mass %, and effect of improving melt adhesion resistance can not be shown; and in the case of more than 5%, contact resistance is increased.
Further, provided is a structure in which an internally oxidized layer is formed at each of the front and back surfaces of an internally oxidizable alloy comprising 50 to 99 mass % of Ag, 1 to 50 mass % of Cu and 0.01 to 1 mass % of at least one of Fe, Ni and Co, and having a non-oxidized layer in the central portion.
In the process of the aforementioned diffusion, the diffusion phenomenon due to the concentration gradient can be controlled by adding at least one of Fe, Ni and Co. As a result of this, an oxidized structure can be micronized by controlling aggregation due to the movement of precipitated oxides to obtain homogeneous dispersion.
The reasons for having 0.01 to 1 mass % of at least one of Fe, Ni and Co herein are as follows: in the case of less thatn 0.01 mass %, the movement of dissolved elements upon internally oxidation treatment can not be sufficiently controlled, and the homogeneous dispersion of oxides can not be obtained; and in the case of more than 1 mass %, coarse oxides may be formed at a crystal grain boundary and the like, causing increased contact resistance.
Further, provided is a structure in which an internally oxidized layer is formed at each of the front and back surfaces of an internally oxidizable alloy comprising 50 to 99 mass % of Ag, 1 to 50 mass % of Cu, 0.1 to 5 mass % of at least one of Sn and In and further 0.01 to 1 mass % of at least one of Fe, Ni and Co, and having a non-oxidized layer in the central portion.
Moreover, provided is a thermal fuse having a temperature sensitive pellet wherein the above electrode material is used therein.
According to the electrode material of the present invention, an inexpensive electrode material for thermal fuses and a thermal fuse comprising the electrode material can be obtained having the following advantages: the content of Cu is allowed up to 50 mass %; in the process after internal oxidation, rolling process can be performed by 70% or more in terms of the cross-sectional rejection rate; even in a case where the plate thickness is reduced by rolling process, internally oxidized layers and a non-oxidised layer are present; and there are no risks such as abnormal abrasion and melt adhesion when used as an electrode material for thermal fuses.
Examples of the present invention are showa in Tables 1 and 2, and the processing steps of these electrode materials for thermal fuses will be described below.
First, a predetermined material was dissolved, and an internally oxidizable alloy 11 having a plate thickness of 0.5 mm was obtained by rolling process (
The internally oxidizable alloy 11 is subjected to internal oxidation in an internal oxidation furnace under the following conditions of 600° C. to 750° C. 1 to 5 hours and 1 to 5 atm of oxygen pressure (
The electrode materials described above can be suitably used for a commercially available typical thermal fuse having a temperature-sensitive pellet. For example, as shown in
The electrode materials described above are incorporated into thermal fuses (
Examples 1 to 15 each show Example of the present invention. Used are the electrode materials having a structure in which an internally oxidized layer is formed at each of the front and back surfaces of an internally oxidized alloy, and having a non-oxidized layer in the central portion of the alloy.
Cxomparative Examples 1 to 8 each show Comparative Example according to the conventional manufacturing method. Used are the electrode materials in which internal oxidation treatment was performed without leaving a non-oxidized layer in the central portion of an internally oxidized alloy.
In Table 1, with regard to workability, “Good” was assigned to those which was able be rolled to a final processing rate of 70% or more in terms of the cross-sectional reduction rate, and “poor” was assigned to those which was not. Workability “poor” indicates that a crack and fracture in the electrode materials, a crack in the internally oxidized layers or the like occurred during rolling process.
Energization tests: “Good” was assigned to those which did not show more than 10° C. increase in temperature when energized for 10 minutes under the conditions of DC 30 V and 10 A, and “poor” was assigned to those which showed.
Shut-off tests: the shut-off tests were performed as follows: energization was performed for 10 minutes under the conditions of DC 30 V and 10 A, and then the temperature of the measurement environment was raised to a temperature higher than the operating temperature by 10° C. while continuing energization. “Good” was assigned to those which did not show melt adhesion, and “poor” was assigned to those which showed.
Table 2 corresponds to Table 1, and each shows the conditions of the internal oxidation treatment, the final processing rate from the intermediate plate thickness to the final plate thickness in Examples 1 to 15 and Comparative Examples 1 to 8 of the present invention.
Number | Date | Country | Kind |
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2011-150483 2011 | Jul 2011 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2012/067211 | 7/5/2012 | WO | 00 | 5/28/2014 |