Claims
- 1. A liquid crystal device, comprising: a pair of oppositely disposed substrates each having thereon an indium-tin-oxide film, and a liquid crystal disposed between the substrates, one of the substrates further having thereon in the order named (i) a color filter layer comprising a photosensitive polyamide resin containing a colorant dispersed therein, (ii) a protective layer comprising a photosensitive polyamide resin, and (iii) an alignment control film.
- 2. A device according to claim 1, wherein said protective layer comprises a cured film of a photosensitive polyamide including a photosensitive unit selected from the group consisting of:
- (1) benzoate units represented by ##STR4## wherein R.sub.1 is CHX.dbd.C Y--COO--Z--, X is --H or --C.sub.6 H.sub.5, Y is --H or --CH.sub.3 and Z is --C.sub.2 H.sub.5 ;
- (2) benzoate acrylate units represented by ##STR5## wherein Y is --H or --CH.sub.3, and (3) diphenyl ether units represented by ##STR6## wherein R.sub.2 is independently CHX.dbd.CY--CONH--, CH.sub.2 .dbd.CY--COO--(CH.sub.2).sub.2 --OCO--, or CH.sub.2 .dbd.CY--COO--CH.sub.2 ; X is --H or --C.sub.6 H.sub.5 and Y is --H or --CH.sub.3.
- 3. A devise according to claim 1, wherein said indium tin oxide film has been patterned by etching with a hydroiodic acid solution (containing hydroiodic acid at 55-58 wt. %) and a ferric chloride aqueous solution at a ratio of 2:1 to 3:1.
- 4. A device according to claim 1, wherein said indium tin oxide film has been patterned by etching with a mixture of a hydroiodic acid solution (containing hydroiodic acid at 55-58 wt. %) and a ferric chloride aqueous solution at a ratio of 2:1 to 3:1.
- 5. A device according to claim 1, wherein said indium tin oxide film has been patterned by etching following an annealing treatment which comprises heating at a temperature of 200.degree.-300.degree. C. and cooling at a rate of at most 100.degree. C./hour.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-87936 |
Jul 1990 |
JPX |
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Parent Case Info
This application is a division of U.S. application Ser. No. 728,707, filed Jul. 11, 1991, now U.S. Pat. No. 5,185,059, issued Feb. 9, 1993.
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Number |
Name |
Date |
Kind |
4838656 |
Stoddard |
Jun 1989 |
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4948706 |
Sugihara et al. |
Aug 1990 |
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5185059 |
Nishida et al. |
Feb 1993 |
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Entry |
Dietrich, Thin Solid Films, vol. 122, No. 1 (1984) 19:29. |
Patent Abstracts of Japan, vol. 6, No. 174 (1982) 089479. |
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Divisions (1)
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Number |
Date |
Country |
Parent |
728707 |
Jul 1991 |
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