Claims
- 1. A base metal or base-metal alloy having a tungsten alloyed barrier coating electrodeposited thereon and an electrodeposited gold or gold alloy plating on said barrier coating, wherein the metal alloyed with tungsten is cobalt or nickel and is alloyed therewith in an amount that will affect the electrodeposition of the tungsten in alloyed form on the base metal and containing a sufficient amount of tungsten to significantly inhibit diffusion of the base metal or base-metal alloy into the gold layer electrodeposited thereon at a thickenss of less than about 50 microinches.
- 2. The product of claim 1 in which the tungsten alloyed barrier coating contains at least about 40 percent tungsten.
Parent Case Info
This is a continuation of application Ser. No. 323,287, filed Jan. 12, 1973, now abandoned.
US Referenced Citations (5)
Continuations (1)
|
Number |
Date |
Country |
Parent |
323287 |
Jan 1973 |
|