Patent Application
20220390190
The present invention relates to electrohydrodynamics (EHD), and more specifically to the use of EHD for thermal management of heat generating components.
Electronic components in, for example, computing systems, electric vehicles, satellites, electronics, etc., are constantly improved in terms of size and performance. The performance of electronic systems is however often limited by the thermal management techniques available. Smaller components with higher power dissipation mean greater heat generation in smaller areas. As a result, more efficient thermal management is required for keeping the components within an appropriate temperature range. In other words, there is a growing need for increased efficiency, both in terms of volume requirements and energy.
One attempt to address these issues is with the use of electrohydrodynamic thermal management systems, in which an electrical field is used to create a flow in a dielectric fluid. This may prove more efficient than, for example, a traditional fan cooling. However, even though the EHD system offers thermal management by circulating a thermal management fluid in a relatively energy efficient manner, there is a need for an increased efficiency in EHD thermal management systems.
An object of the present invention is to provide a method of altering one or more properties of a dielectric fluid for use in an EHD thermal management system. The system may comprise at least one EHD pump unit comprising at least two electrodes for pumping the dielectric fluid, and an enclosure for accommodating the fluid within the system. The method may comprise the steps of exposing the dielectric fluid to an ionizing process configured to ionize the dielectric fluid, and to operate the pump unit to circulate or at least cause the exposed fluid to flow in the EHD system. For example, the ionizing process may comprise an ionizing irradiation of the dielectric fluid.
The dielectric fluid is exposed to the ionizing process in at least one of: a part of the enclosure, wherein a wall portion of the enclosure is exposed to the ionizing process, a location separated from the EHD thermal management system, from which the fluid is added to the EHD thermal management system after exposure, and within the enclosure, wherein the dielectric fluid is exposed to the ionizing process by a substance located within said enclosure.
The present invention is based on the realization that by exposing the dielectric fluid to an ionizing process configured to ionize the dielectric fluid, the pumping efficiency may be improved. This allows for an increased flow rate compared to non-ionized liquid, and thus a better cooling effect.
The proposed EHD system may comprise at least one pump unit that may be arranged within, or connected to, the enclosure in which the dielectric fluid is held. A cooling effect may be achieved by allowing the dielectric fluid to flow in order to transport heat energy away from the component, or area, in need of cooling. Similarly, a heating effect may be achieved by allowing the dielectric fluid to flow in order to transport heat energy to the component or region to be heated. In one example, the EHD system may be arranged to allow the dielectric fluid to circulate between a heat generating side of the system and a cooling side of the system, which for example may comprise a heat exchanger or heat sink.
The pump unit may be configured to create a flow in the fluid. The pump unit may comprise at least two electrodes, which may be separated from each other such that a second one of the electrodes is located in a downstream direction from a first one of the electrodes. The two electrodes may be connectable to a voltage source to create a field that affects the dielectric fluid such that a flow is created. The flow rate may be changed by varying the voltage applied to the electrodes. By decreasing the voltage, the fluid may lose momentum and the flow be decreased. Thus, by controlling the voltage, the cooling effect of the system can be adjusted.
Preferably, at least one of the electrode(s), such as the emitter electrode, may be elongated in the flow direction, such that a height as seen in the flow direction is greater than a width as seen in a directions orthogonal to the flow direction. This configuration may improve the electric field properties with respect to the corona discharge, which is believed to be the underlying mechanism accelerating the fluid between the electrodes.
By the term “ionizing process”, it is here meant a process which is configured to ionize the dielectric fluid. More specifically, the ionizing process may encompass exposing the dielectric fluid to a radiation process that carries sufficient energy or is otherwise able to detach electrons from atoms or molecules. The ionizing process may comprise an ionizing irradiation of the dielectric fluid. The ionizing process may alternatively, or in combination with the (ir)radiation, comprise subjecting the dielectric fluid to one or more ionizing additives. Hence, without acquiescing to a particular physical model, exposing the dielectric fluid to an ionizing process is believed to cause the fluid to ionize and break down into other more easily ionizable chains of molecules. This altering of the characteristics of dielectric fluid may, when used in an EHD system, improve the pumping effect induced by the electrical field of the EHD unit and cause the fluid to flow at a higher velocity compared to what would have been achieved if the dielectric fluid were not exposed to such ionization process. The increased flow will in a thermal management system mean a greater cooling effect and improved power efficiency.
It will be appreciated that the dielectric fluid may be ionized at different stages of the EHD system's lifetime. Further, the ionization may also be carried out at different locations within or outside the EHD system. For example, the entire system, or only a part of it, such as the enclosure, could be exposed to a radiation from the outside, whilst the dielectric fluid is located within the system. In another example the dielectric fluid may be exposed to a radiation, or an ionizing additive, at a location separated from the enclosure and then added to the system at a later stage. Yet another example may be to add a small substance of radiating material, or an additive to the system, preferably within the enclosure, in order to expose the dielectric fluid to the ionization as it flows in the system. This may allow for the dielectric fluid to be exposed continuously, throughout the use of the system.
According to a second aspect of the invention, an EHD thermal management system comprising at least one pump unit is provided, configured in a manner as previously described. The system may comprise a dielectric fluid. The EHD thermal management system comprises at least two electrodes for pumping the dielectric fluid, and at least one enclosure for accommodating said dielectric fluid. The EHD thermal management system is configured to expose the dielectric fluid to an ionizing process configured to ionize the dielectric fluid.
The EHD system utilizes the characteristics of dielectric fluid exposed to the ionizing process. This may improve the pumping effect induced by the electrical field of the EHD unit and cause the fluid to flow at a higher velocity compared to what would have been achieved if the dielectric fluid was not exposed to such ionization process. The EHD thermal management system proposed may thus feature a greater cooling effect and an improved power efficiency. The ionizing process of the EHD system may comprise any steps of the ionizing process as previously described.
Thus, the first and second aspect of the present invention share a common general inventive concept or idea wherein dielectric fluid is exposed to an ionizing process.
By the term “dielectric fluid”, it is here meant a dielectric material in a liquid or fluid state. Examples of dielectric fluids that can be pumped by means of embodiments of the invention may encompass 3M™ Novec™ (7000, 7100, 7200, 7500, 7700, 72DE, 71DA), Galden®HT (70, 110, 135, 72DE, 71DA), fluorinated fluids, hydrocarbon fluids, etc., or a combination thereof.
According to an embodiment of the present invention, the dielectric fluid may further comprise at least one additive. The additive may be in a fluid form or a solid form. For example, the additive may comprise a salt or any other form of ions which may be added to, and preferably dissolved in, the dielectric fluid. This may advantageously further increase the ionizing process of the dielectric fluid.
According to an embodiment of the present invention, the ionizing process comprises an ionizing irradiation of the dielectric fluid. It will be appreciated that in the present embodiment, the dielectric fluid may be ionized in an efficient manner and/or during a relatively long period of time. This may, for example, be advantageous in areas where a continuous exposure to an ionizing process is desired.
According to an embodiment of the present invention, the ionizing irradiation is generated from at least one radioactive isotope. The radioactive isotope may for example comprise, but is not limited to, Cobolt 60 or Americum. The ionizing (ir)radiation may further be generated from an electrically generated X-ray radiation. This is advantageous as the source of the ionizing radiation may be selected, for example, depending on the intended use, availability and/or cost efficiency. Furthermore, different radioactive isotopes may offer different levels of ionizing radiation and may thus be suitable in different systems. This may allow for a more accessible and cost-efficient system which furthermore may be customized for specific preconditions.
According to an embodiment of the present invention, the dielectric fluid is selected from the group consisting of a fluorinated fluid and a hydrocarbon fluid. The dielectric fluid may alternatively comprise a combination of the dielectric fluid as exemplified and other molecules or additives. It will be appreciated that combinations thereof may further increase the efficiency of the dielectric fluid in an EHD thermal management system.
According to an embodiment of the present invention, the enclosure may take the form of an enclosed passage, for example, defining a closed loop, adapted to convey a circulating flow of fluid. This specific configuration of the enclosure may be advantageous as the specific enclosure may provide a more efficient flow, as all fluid within the enclosure will be encouraged to move in the same direction.
According to an embodiment of the present invention, the pump unit is arranged in order to cover an entire cross-section of the closed loop configured enclosure. This is advantageous as a maximal amount of dielectric fluid in the given cross section will be subject to the pump unit, in other words, all fluid has to pass through the pump unit in order to circulate. As a result, an increased efficiency of the circulation of the dielectric fluid, and thus also the cooling effect, may be achieved. Further, the pump unit may not only be capable of inducing a flow in the dielectric fluid, but also to impede or even prevent the flow. In other words, the pump unit may be configured to operate as a switch capable of opening and closing the passage, which allows for an improved control of the flow.
According to an embodiment of the present invention, the at least two electrodes of the pump unit are arranged in a grid structure. For example, electrodes may be positioned either in a common plane or in different layers. Utilizing a grid structure may allow a further increase in the efficiency of the pump unit and allows for an increased control of the thermal management system.
A few example embodiments of the invention will be described for illustrative purposes in the following.
It should be noted that the dielectric fluid may be exposed to radiation at different points in time, locations, to a certain amount, or using different radiating source materials and dielectric fluids, and that the examples discussed with reference to the appended drawings merely are illustrative examples. According to some embodiments of the invention the fluid may be exposed to radiation separately from the EHD system and added to the system at a later stage. It will be appreciated that not the entire amount of said fluid has to be exposed to radiation. In some examples, exposed fluid could be added to the fluid in the EHD system, thus forming a radiated additive to the total amount of fluid in the system. It is also appreciated that the radiation may be provided from within the enclosure as well as from a source positioned outside the enclosure and/or the entire system. One example of such arrangement is disclosed in
The pump unit 110 may be arranged to cover an entire cross section of the enclosure 120, as indicated in
As already mentioned, the irradiation 122 of the fluid may in this example be provided from outside of the system. As depicted, part of the enclosure may be subject to ionizing radiation 122, which may penetrate the wall of the enclosure and reach the dielectric fluid. Other embodiments may have the enclosure 120 exposed to radiation 122 in its entity. The radiating source 130 may be placed directly on the system or distanced from it.
| Number | Date | Country | Kind |
|---|---|---|---|
| 1951280-5 | Nov 2019 | SE | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2020/081239 | 11/6/2020 | WO |
