Claims
- 1. An electrode-based pump comprising, in a substrate,
- (a) a first electrode and a second electrode intersecting with a channel of capillary dimensions, wherein the first and second electrodes have a diameter from about 25 microns to about 100 microns and are spaced from about 100 microns to about 2,500 microns apart, and wherein the pump operates to move liquid in the channel as a result of a potential applied between the first and second electrodes; and
- (b) a voltage driver for applying voltage across the electrodes,
- wherein the pump in one mode of operation is adapted to pump fluid by having the driver apply voltage to just said first and second electrodes.
- 2. The electrode-based pump of claim 1, wherein the first and second electrodes are from about 150 microns to about 1000 microns apart.
- 3. The electrode-based pump of claim 1, wherein the first and second electrodes are from about 150 microns to about 250 microns apart.
- 4. The electrode-based pump of claim 1, wherein the electrodes are formed of fused via ink.
- 5. The electrode-based pump of claim 4, wherein the channel intersecting portion of the fused via ink is plated with metal.
- 6. The electrode-based pump of claim 5, wherein the plated metal is nickel, silver, gold, platinum or rhodium.
- 7. The electrode-based pump of claim 4, wherein the fused via ink extends through a via in the substrate that intersects with the channels, and wherein the fused via ink seals the vias against liquid leakage from the channel.
- 8. The electrode-based pump of claim 1, wherein the voltage driver is for applying voltage pulses across the electrodes.
- 9. The electrode-based pump of claim 8, wherein the driver is a digital driver.
- 10. An electrode-based pump comprising:
- a substrate in which a channel of capillary dimensions is formed;
- electrical conduits through the substrate intersecting with the channel at points separated by from about 100 microns to about 2,500 microns formed of fused via ink, wherein the fused via ink seals the conduits against liquid leakage from the channel; and
- metal plating on ends of the fused via ink intersecting the channel, wherein the metal platings and associated conduits define electrodes.
- 11. The electrode-based pump of claim 10, wherein the first and second electrodes are from about 150 microns to about 1000 microns apart.
- 12. The electrode-based pump of claim 10, wherein the first and second electrodes are from about 150 microns to about 250 microns apart.
Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 08/469,238, titled "Apparatus and Methods for Controlling Fluid Flow in Microchannels," filed Jun. 6, 1995, now U.S. Pat. No. 5,632,876 and a continuation-in-part of U.S. application Ser. No. 08/483,331, titled "Method and System for Inhibiting Cross-Contamination in Fluids of Combinatorial Chemistry Device," filed Jun. 7, 1995, now U.S. Pat. No. 5,603,351.
US Referenced Citations (7)
Non-Patent Literature Citations (2)
Entry |
Fuhr et al. ("Microfabricated electrohydrodynamic (EHD) pumps for liquids of higher conductivity", J. Microelectromech. Syst. (1992), 1(3), 141-6) |
Andreas Manz et al., Trends in Analytical Chemistry , 10(5): 144-148 (1991). |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
469238 |
Jun 1995 |
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