Claims
- 1. A replenisher composition for an electroless metal plating solution having evaporative losses of at least 1% per plating cycle in use and containing metal ions, a reducing agent for said metal ions and a complexing agent for said metal ions, said replenisher composition comprising at least two components separately or in admixture, said components being selected from the group of a source of the metal plating ions, a reducing agent, a complexing agent to maintain said ions in solution and a pH adjuster, said components being in a concentration by weight equal to about the amount of the component reacted in the plating solution per plating cycle plus an amount lost by drag-out plus an excess amount, said excess amount being from one one-hundredth to 60 one-hundredths by weight of the amount of the component originally present in said plating solution.
- 2. The replenisher composition of claim 1 where the excess is from 5 to 25 one-hundredths of the original amount.
- 3. The replenisher composition of claim 1 where the plating solution is a nickel-hypophosphite solution and the replenisher contains at least a nickel salt and a hypophosphite salt.
- 4. The replenisher composition of claim 1 where the plating solution is a nickel borane solution and the replenisher contains at least a nickel salt and an amine borane reducing agent.
- 5. The replenisher composition of claim 1 additionally containing a source of metal ions differing from the metal ions of the plating solution.
- 6. The replenisher composition of claim 5 where the additional metal ions are copper ions.
- 7. The replenisher composition of claim 5 where the additional metal ions are cuprous ions.
- 8. The replenisher composition of claim 5 where the additional ions are cobalt ions.
- 9. The replenisher composition of claim 1 in aqueous solution.
Parent Case Info
This is a division of application Ser. No. 680,188 filed Apr. 26, 1976.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
680188 |
Apr 1976 |
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