Claims
- 1. A method for treating a substrate having an electrically conductive surface comprising:
contacting at least a portion of the surface with a medium comprising at least one oxygen containing water soluble and having a basic pH and wherein said medium is substantially free of chromates, drying the substrate, rinsing the substrate, and; again drying the substrate.
- 2. An aqueous medium for use in increasing the electrical resistance of a conductive surface comprising a combination comprising water, at least one member selected from the group of water soluble stannates, molybdates, vanadates and hydrated cerium compounds, wherein the medium has a basic pH and is substantially free of chromates.
- 3. The medium of claim 2 wherein said medium further comprises colloidal silica.
- 4. The method of claim 1 wherein the surface comprises at least one member selected from the group consisting of copper, nickel, tin, iron, zinc, aluminum, magnesium, stainless steel and steel and alloys thereof.
- 5. The method of claim 1 wherein said drying is conducted at a temperature of at least about 120 C.
- 6. The method of claim 1 further comprising applying at least one coating upon the last dried surface.
- 7. The method of claim 1 further comprising applying an adherent composition comprising at least one member chosen from the group of latex, silanes, epoxies, silicone, amines, alkyds, urethanes and acrylics.
- 8. The method of claim 1 wherein said medium comprises the medium of claim 2.
- 9. The method of claim 1 wherein said medium comprises the medium of claim 3.
- 10. The medium of claim 2 wherein said water soluble compounds comprise at least one member selected from the group consisting of sodium stannate hydrate, sodium molybdate hydrate, ammonium metavanadate and cerium nitrate hydrate.
- 11. The method of claim 1 wherein the pH is sufficient to at least partially dissolve the surface.
Parent Case Info
[0001] The subject matter herein claims benefit of prior filed U.S. patent application Ser. No. 60/310,006, filed on Aug. 03, 2001 and entitled “An Electrolytic And Electroless Process For Treating Metallic Surfaces and Products Formed Thereby”; the disclosure of which is hereby incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60310006 |
Aug 2001 |
US |