Claims
- 1. A method for treating a substrate having an electrically conductive surface comprising:
contacting at least a portion of the surface with a medium comprising at least one oxygen containing water soluble and having a basic pH and wherein said medium is substantially free of chromates, drying the substrate, rinsing the substrate, and; again drying the substrate.
- 2. An aqueous medium for use in increasing the electrical resistance of a conductive surface comprising a combination comprising water, at least one member selected from the group of water soluble stannates, molybdates, vanadates and hydrated cerium compounds, wherein the medium has a basic pH and is substantially free of chromates.
- 3. The medium of claim 2 wherein said medium further comprises colloidal silica.
- 4. The method of claim 1 wherein the surface comprises at least one member selected from the group consisting of copper, nickel, tin, iron, zinc, aluminum, magnesium, stainless steel and steel and alloys thereof.
- 5. The method of claim 1 wherein said drying is conducted at a temperature of at least about 120 C.
- 6. The method of claim 1 further comprising applying at least one coating upon the last dried surface.
- 7. The method of claim 1 further comprising applying an adherent composition comprising at least one member chosen from the group of latex, silanes, epoxies, silicone, amines, alkyds, urethanes and acrylics.
- 8. The method of claim 1 wherein said medium comprises the medium of claim 2.
- 9. The method of claim 1 wherein said medium comprises the medium of claim 3.
- 10. The medium of claim 2 wherein said water soluble compounds comprise at least one member selected from the group consisting of sodium stannate hydrate, sodium molybdate hydrate, ammonium metavanadate and cerium nitrate hydrate.
- 11. The method of claim 1 wherein the pH is sufficient to at least partially dissolve the surface.
CROSS REFERENCE TO RELATED PATENTS AND PATENT APPLICATIONS
[0001] The subject matter herein claims benefit of prior filed U.S. Patent Application Ser. No. 60/310,006, filed on Aug. 3, 2001 and entitled “An Electrolytic And Electroless Process For Treating Metallic Surfaces and Products Formed Thereby”; the disclosure of which is hereby incorporated by reference.
[0002] The subject matter of the instant invention is related to copending and commonly assigned WIPO Patent Application Publication No. WO 98/33960, Non-Provisional U.S. patent application Ser. No. 08/850,323 (Now U.S. Pat. No. 6,165,257); Ser. No. 08/850,586 (Now U.S. Pat. No. 6,143,420); and Ser. No. 09/016,853 (now allowed), filed respectively on May 2, 1997 and Jan. 30, 1998; and Ser. No. 08/791,337 (now U.S. Pat. No. 5,938,976), filed on Jan. 31, 1997, in the names of Robert L. Heimann et al., as a continuation in part of Ser. No. 08/634,215 (filed on Apr. 18, 1996) in the names of Robert L. Heimann et al., and entitled “Corrosion Resistant Buffer System for Metal Products”, which is a continuation in part of Non-Provisional U.S. patent application Ser. No. 08/476,271 (filed on Jun. 7, 1995) in the names of Heimann et al., and corresponding to WIPO Patent Application Publication No. WO 96/12770, which in turn is a continuation in part of Non-Provisional U.S. patent application Ser. No. 08/327,438 (filed on Oct. 21, 1994), now U.S. Pat. No. 5,714,093.
[0003] The subject matter of this invention is related to Non-Provisional patent application Ser. No. 09/016,849 (Attorney Docket No. EL004RH-1), filed on Jan. 30, 1998 and entitled “Corrosion Protective Coatings”. The subject matter of this invention is also related to Non-Provisional patent application Ser. No. 09/016,462 (Attorney Docket No. EL005NM-1), filed on Jan. 30, 1998 and entitled “Aqueous Gel Compositions and Use Thereof” (now U.S. Pat. No. 6,033,495).
[0004] The subject matter of this invention is also related to Non-Provisional patent application Ser. No. 09/814,641 (Attorney Docket No. EL008RH-6), filed on Mar. 22, 2001, and entitled “An Energy Enhanced Process For Treating A Conductive Surface And Products Formed Thereby” (and corresponds to PCT Patent Application Serial No. PCT/US01/09293), and Non-Provisional patent application Ser. No. ______ (Attorney Docket No. EL022RH-1), filed on Aug. 3, 2002 and entitled “An Electroless Process For Treating Metallic Surfaces And Products Formed Thereby”, and Ser. No. ______ (Attorney Docket No. EL021RH-1), filed on Aug. 3, 2002 and entitled “An Electroless Process For Treating Metallic Surfaces And Products Formed Thereby”.
[0005] The disclosure of the previously identified patents, patent applications and publications is hereby incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60310006 |
Aug 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
10211029 |
Aug 2002 |
US |
Child |
10816988 |
Apr 2004 |
US |