Claims
- 1. A method for treating a substrate having an electrically conductive surface comprising:contacting at least a portion of the surface with an aqueous medium comprising at least one member selected from the group consisting of water soluble stannates, molybdates, vanadates and cerium compounds and having a basic pH, heating the substrate, rinsing the substrate, and; drying the substrate; wherein the method is substantially free of chromates.
- 2. The method of claim 1 wherein the aqueous medium comprises a combination comprising water, at least one member selected from the group consisting of water soluble stannates, vanadates and hydrated cerium compounds, wherein the medium has a basic pH and is substantially free or chromates.
- 3. The method of claim 2 wherein said medium further comprises colloidal silica.
- 4. The method of claim 1 wherein the surface comprises at least one member selected from the group consisting of copper, nickel, tin, iron, zinc, aluminum, magnesium, stainless steel and steel and alloys thereof.
- 5. The method of claim 1 wherein said heating is to a temperature of at least about 120° C.
- 6. The method of claim 1 further comprising applying at least one coating upon the dried surface.
- 7. The method of claim 1 further comprising applying an adherent composition comprising at least one member chosen from the group of latex, silanes, epoxies, silicone, amines, alkyds, urethanes and acrylics, after said drying.
- 8. The method of claim 1 wherein said medium is heated ac a temperature of about 50 to about 100° C.
- 9. The method of claim 1 wherein said rinsing comprises contacting with a second medium comprising at least one dopant.
- 10. The method of claim 2 wherein said water soluble compounds comprise at least one member selected from the group consisting of sodium stannate hydrate, ammonium metavanadate and cerium nitrate hydrate.
- 11. The method of claim 1 further comprising treating the substrate prior to said contacting with at least one process selected from the group consisting of contacting with an acidic medium, a basic medium and an oxidizing medium, and anodizing the substrate.
- 12. The method of claim 4 wherein the substrate comprises steel.
- 13. The method of claim 4 wherein the substrate comprises zinc or zinc alloys.
- 14. The method of claim 1 wherein the water soluble compound comprises at least one member selected from the group consisting of stannates, vanadates and cerium compounds.
- 15. The method of claim 14 wherein the water soluble compound comprises a cerium compound.
- 16. The method of claim 14 wherein the water soluble compound comprises a stannate compound.
- 17. The method of claim 14 wherein the water soluble compound comprises a vanadate compound.
- 18. The method of claim 1 wherein the aqueous medium comprises water, sodium hydroxide, at least one member selected from the group consisting of water soluble stannates, molybdates, vanadates and cerium compounds; wherein the medium has a basic pH and is substantially free of chromates.
- 19. The method of claim 18 wherein the water soluble compound comprises at least one member selected from the group consisting of stannates, vanadates and cerium compounds.
- 20. The method of claim 18 further comprising at least one water dispersible polymer.
CROSS REFERENCE TO RELATED PATENTS AND PATENT APPLICATIONS
The subject matter herein claims benefit of prior filed U.S. Patent Application Serial No. 60/310,006, filed on Aug. 03, 2001 and entitled “An Electrolytic And Electroless Process For Treating Metallic Surfaces and Products Formed Thereby”; the disclosure of which is hereby incorporated by reference.
The subject matter of the instant invention is related to copending and commonly assigned WIPO Patent Application Publication No. WO 98/33960, Non-Provisional U.S. patent application Ser. No. 08/850,323 (Now U.S. Pat. No. 6,165,257); Ser. No. 08/850,586 (Now U.S. Pat. No. 6,143,420); and Ser. No. 09/016,853 (now allowed), filed respectively on May 2, 1997 and Jan. 30, 1998; and Ser. No. 08/791,337 (now U.S. Pat. No. 5,938,976), filed on Jan. 31, 1997, in the names of Robert L. Heimann et al., as a continuation in part of Ser. No. 08/634,215 (filed on Apr. 18, 1996) in the names of Robert L. Heimann et al., and entitled “Corrosion Resistant Buffer System for Metal Products”, which is a continuation in part of Non-Provisional U.S. patent application Ser. No. 08/476,271 (filed on Jun. 7, 1995) in the names of Heimann et al., and corresponding to WIPO Patent Application Publication No. WO 96/12770, which in turn is a continuation in part of Non-Provisional U.S. patent application Ser. No. 08/327,438 (filed on Oct. 21, 1994), now U.S. Pat. No. 5,714,093.
The subject matter of this invention is related to Non-Provisional patent application Ser. No. 09/016,849, filed on Jan. 30, 1998 and entitled “Corrosion Protective Coatings”. The subject matter of this invention is also related to Non-Provisional patent application Ser. No. 09/016,462, filed on Jan. 30, 1998 and entitled “Aqueous Gel Compositions and Use Thereof” (now U.S. Pat. No. 6,033,495).
The subject matter of this invention is also related to Non-Provisional patent application Ser. No. 09/814,641, filed on Mar. 22, 2001, and entitled “An Energy Enhanced Process For Treating A Conductive Surface And Products Formed Thereby” (and corresponds to PCT Patent Application Serial No. PCT/US01/09293), and Non-Provisional patent application Ser. No. 10/211,094, filed on Aug. 3, 2002 and entitled “An Electroless Process For Treating Metallic Surfaces And Products Formed Thereby”, and Ser. No. 10/211,051, filed on Aug. 3, 2002 and entitled “An Electroless Process For Treating Metallic Surfaces And Products Formed Thereby”.
The disclosure of the previously identified patents, patent applications and publications is hereby incorporated by reference.
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Provisional Applications (1)
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Number |
Date |
Country |
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60/310006 |
Aug 2001 |
US |