ELECTROLYTIC POLISHING DEVICE, SYSTEM AND METHOD

Abstract

An electrolytic polishing device is provided and includes an electrolytic bath used for accommodating an electrolyte. A polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath. An anode plate assembly and a cathode plate assembly are arranged in the electrolytic bath along the extending direction of the polishing channel and are separated by a partition plate assembly. The anode plate assembly includes two anode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The cathode plate assembly includes two cathode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The partition plate assembly includes two partition plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The anode plate assembly and the cathode plate assembly can be connected with a power supply.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This patent application claims the benefit and priority of Chinese Patent Application No. 202310069459.6 filed with the China National Intellectual Property Administration on Jan. 13, 2023, the disclosure of which is incorporated by reference herein in its entirety as part of the present application.

TECHNICAL FIELD

The present disclosure relates to the technical field of electrolytic polishing, in particular to an electrolytic polishing device, system and method.

BACKGROUND

Electrolytic polishing technology is a method for selectively dissolving micro-protrusions on an anode by using an electrochemical dissolution phenomenon generated by the anode in an electrolytic bath so as to form a smooth surface. Through the technology, more uniform electric field distribution can be obtained through relative position control among electrodes, a baffle plate and a workpiece, so that a polished workpiece has better surface uniformity and brightness at the same time.

In the traditional electrolytic polishing technology, an electric connection manner is needed for polishing. When continuous products are treated, it is difficult to control the distribution of current density on the workpiece, so that it is difficult to control the surface uniformity of the workpiece.

SUMMARY

The present disclosure aims to provide an electrolytic polishing device, system and method so as to solve problems in the prior art, and the polishing effect and uniformity of a to-be-polished workpiece can be improved.

In order to achieve the purpose, the present disclosure provides the following scheme.

The present disclosure provides an electrolytic polishing device. The electrolytic polishing device includes an electrolytic bath. The electrolytic bath is used for accommodating an electrolyte, a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also arranged in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly. The anode plate assembly includes two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel. The cathode plate assembly includes two cathode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel. The partition plate assembly includes two partition plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly can be connected with a power supply.

Preferably, a plurality of anode plate assemblies and a plurality of cathode plate assemblies are arranged, and the anode plate assemblies and the cathode plate assemblies are alternately arranged.

Preferably, one anode plate assembly is arranged, two cathode plate assemblies are arranged, and the two cathode plate assemblies are respectively located on two sides of the anode plate assembly.

Preferably, a plurality of partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath.

Preferably, the electrolytic polishing device also includes an electrolyte tank, and the electrolyte tank is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank.

Preferably, the electrolyte tank is located below the electrolytic bath and can surround the bottom of the electrolytic bath. An opening is formed in a side wall, along the extending direction of the polishing channel, of the electrolytic bath, and the electrolyte in the electrolytic bath can fall into the electrolyte tank through the opening. The electrolyte tank is also connected with the electrolytic bath through a pipeline and an acid-resistant pump, thereby providing the electrolyte for the electrolytic bath.

Preferably, an electrolyte chamber is formed in the bottom of the electrolytic bath, the electrolyte tank is connected with the electrolyte chamber through the pipeline, and a plurality of jet holes for spraying the electrolyte into the electrolytic bath are formed in a top of the electrolyte chamber.

The present disclosure also provides an electrolytic polishing system. The electrolytic polishing system includes a cleaning device and the electrolytic polishing device. The cleaning device can clean the to-be-polished workpiece after polishing is completed.

The present disclosure also provides an electrolytic polishing method, using the electrolytic polishing device, including the following steps:

• • S1, putting a to-be-polished workpiece into the polishing channel to move along the polishing channel for polishing; and
  • S2, after the polishing is completed, taking out the to-be-polished workpiece.

Preferably, the electrolytic polishing method also includes the following steps after the step S2:

• • S21. cleaning the to-be-polished workpiece after the polishing is completed;
  • S22, drying the to-be-polished workpiece after the cleaning is completed; and
  • S23, measuring the surface roughness of the to-be-polished workpiece after the drying is completed.

Compared with the prior art, the present disclosure has the following beneficial technical effects.

The anode plate assembly includes two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel. Similarly, the cathode plate assembly includes two cathode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel. In the present disclosure, the to-be-polished workpiece moves in the polishing channel for polishing, and is not in contact with the anode plates or the cathode plates. Precise electrolytic polishing is carried out on different arc surfaces of the to-be-polished workpiece in a non-contact manner. When an electric field is applied in the electrolyte of the electrolytic bath and a metal workpiece passes through electrodes, bipolar induction current can be generated on a workpiece, and then electrolytic polishing is carried out on a rough and uneven surface of the metal workpiece, so that the surface of the metal workpiece becomes smooth and bright, and the polishing effect is improved.

BRIEF DESCRIPTION OF THE DRAWINGS

To more clearly illustrate the present embodiment of the present disclosure or the technical scheme in the prior art, the following briefly introduces the attached figures to be used in the present embodiment. Apparently, the attached figures in the following description show merely some embodiments of the present disclosure, and those skilled in the art may still derive other drawings from these attached figures without creative efforts.

FIG. 1 is a front view of an electrolytic polishing device in an embodiment of the present disclosure.

FIG. 2 is a top view of an electrolytic polishing device in an embodiment of the present disclosure.

FIG. 3 is a side view of an electrolytic polishing device mounted on a support in an embodiment of the present disclosure.

FIG. 4 is a side schematic diagram of opposite arrangement of a single pair of electrodes in an embodiment of the present disclosure.

FIG. 5 is a top view of a polarization working area in an embodiment of the present disclosure.

FIG. 6 is a top view of positions of cathode and anode electrodes, a baffle plate and a workpiece in an embodiment of the present disclosure.

FIG. 7 is a curve graph of influence of unit area electricity on polishing degree.

Reference signs: 1, cathode plate; 2, anode plate; 3, partition plate; 4, jet hole; 5, electrode plate assembly; 6, acid-resistant pump; 7, electrolyte tank; 8, polishing channel; 9, anode electrode; 10, cathode electrode; 11, workpiece; 12, path a that current is conducted through workpiece; 13, path b that current bypasses partition plate through electrolyte; 14, workpiece; 15, anode electrode; 16, cathode electrode; and 17, partition plate.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The following clearly and completely describes the technical scheme in the embodiments of the present disclosure with reference to the embodiments of the present disclosure. Apparently, the described embodiments are merely a part rather than all of the embodiments of the present disclosure. Based on the embodiment in the present disclosure, all other embodiments obtained by the ordinary technical staff in the art under the premise of without contributing creative labor belong to the scope protected by the present disclosure.

The present disclosure aims to provide an electrolytic polishing device, system and method so as to solve problems in the prior art, and the polishing effect and uniformity of a to-be-polished workpiece can be improved.

To make the foregoing objective, features and advantages of the present disclosure clearer and more comprehensible, the present disclosure is further described in detail below with reference to the attached figures and specific embodiments.

Embodiment I

As shown in FIGS. 1 to 3, the embodiment provides an electrolytic polishing device. The electrolytic polishing device includes an electrolytic bath. The electrolytic bath is used for accommodating an electrolyte. A polishing channel 8 for a to-be-polished workpiece to pass through is provided in the electrolytic bath. An anode plate assembly and a cathode plate assembly are also arranged in the electrolytic bath along the extending direction of the polishing channel 8. The anode plate assembly and the cathode plate assembly are separated by a partition plate assembly. Wherein, the anode plate assembly includes two anode plates 2, which are oppositely arranged and are respectively located on two sides of the polishing channel 8. The cathode plate assembly includes two cathode plates 1, which are oppositely arranged and are respectively located on two sides of the polishing channel 8. The partition plate assembly includes two partition plates 3, which are oppositely arranged and are respectively located on two sides of the polishing channel 8. Wherein, the anode plate assembly and the cathode plate assembly can be connected with a power supply.

In the embodiment, the to-be-polished workpiece moves in the polishing channel 8 for polishing, and is not in contact with the anode plate 2 or the cathode plate 1. Precise electrolytic polishing is carried out on different arc surfaces of the to-be-polished workpiece in a non-contact manner. When an electric field is applied in the electrolyte of the electrolytic bath and a metal workpiece passes through electrodes, bipolar induction current can be generated on a workpiece, and then electrolytic polishing is carried out on a rough and uneven surface of the metal workpiece, so that the surface of the metal workpiece becomes smooth and bright, and the polishing effect is improved. When the to-be-polished workpiece moves through the polishing channel 8, a bipolar phenomenon of high-potential and low-potential regions is generated simultaneously on the to-be-polished workpiece by means of a polarization effect between the cathode plate 1 and the anode plate 2, and the workpiece undergoes electrolytic oxidation in the high-potential region (a region near the anode plate 2) to dissolve the rough surface so as to achieve a better polishing effect.

In the embodiment, a plurality of anode plate assemblies and a plurality of cathode plate assemblies are arranged, and the anode plate assemblies and the cathode plate assemblies are alternately arranged. Wherein, the numbers of the anode plate assemblies and the cathode plate assemblies can be selected according to specific work needs. Specifically, the numbers can be adjusted according to production speed requirements. The higher the production speed, the more pairs of electrodes are needed.

As a preferred embodiment, in the embodiment, only one anode plate assembly is arranged and located at the middle position of the electrolytic bath. Two cathode plate assemblies are arranged. The two cathode plate assemblies are respectively located on two sides of the anode plate assembly.

In the embodiment, polishing is carried out in a non-contact polishing manner, and a plurality of pairs of electrodes are arranged. The current density between each pair of electrodes is uniform, and the to-be-polished workpiece is induced to generate a dual polarization phenomenon. Wherein, because electrolytic oxidation occurs in a region close to the anode plate 2, the effect of uniformly polishing rough places can be achieved. At the same time, the embodiment realizes a bipolar potential gradient effect of oxidization and reduction treatment simultaneously on the to-be-polished workpiece. Compared with the traditional anode electrolytic polishing process, the generation of oxides on a surface of a finished product is greatly reduced, and the next process is facilitated.

In the embodiment, the partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath. Wherein, the number of the partition plate assemblies can be adjusted according to work needs. As a preferred embodiment, one partition plate assembly is arranged between one cathode plate assembly and a side wall of the electrolytic bath, and two partition plate assemblies are arranged between the adjacent cathode plate assembly and the anode plate assembly.

In the embodiment, the electrolytic polishing device also includes an electrolyte tank 7, and the electrolyte tank 7 is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank. Specifically, the electrolyte tank 7 is located below the electrolytic bath and can surround the bottom of the electrolytic bath. An opening is formed in the side wall, along the extending direction of the polishing channel 8, of the electrolytic bath, and the electrolyte in the electrolytic bath can fall into the electrolyte tank 7 through the opening. The electrolyte tank 7 is also connected with the electrolytic bath through a pipeline and an acid-resistant pump 6, thereby providing the electrolyte for the electrolytic bath.

In the embodiment, an electrolyte chamber is formed in the bottom of the electrolytic bath. The electrolyte tank 7 is connected with the electrolyte chamber through the pipeline. Jet holes 4 for spraying the electrolyte into the electrolytic bath are formed in the top of the electrolyte chamber, so as to achieve uniform mass transfer of electrolysis products in the electrolyte.

The embodiment also provides an electrolytic polishing system. The electrolytic polishing system includes a cleaning device and the electrolytic polishing device. The cleaning device can clean the to-be-polished workpiece after polishing is completed. Wherein, the cleaning device is preferably a cleaning tank. The cleaning tank is filled with a cleaning solution for cleaning the to-be-polished workpiece.

The embodiment also provides an electrolytic polishing method, using the electrolytic polishing device, including the following steps:

• • S1, after anode and cathode of a power supply is connected, a to-be-polished workpiece is put into a polishing channel 8 filled with an electrolyte to move along the polishing channel 8 for polishing; wherein, during polishing, the electricity of 900-1000 kCm⁻² is used to control the passing time of the to-be-polished workpiece;
  • S2, after the polishing is completed, a circuit is disconnected, and the to-be-polished workpiece is taken out.

In the embodiment, the electrolytic polishing method also includes the following steps after the step S2:

• • S21, after the polishing is completed, the to-be-polished workpiece is immersed into a cleaning tank filled with a cleaning solution for cleaning;
  • S22, after cleaning for a certain period of time, the to-be-polished workpiece is taken out from the cleaning tank for drying; and
  • S23, after the drying is completed, the surface roughness of the to-be-polished workpiece is measured; and after polishing, the surface roughness Sa (um) of the metal workpiece is reduced to 0.07 to 0.09.

As shown in FIGS. 4 to 6, in the embodiment, through detail decomposition, according to the relative efficiency of each electrode in each electrolytic bath, the treatment effect is tested by means of opposite arrangement of a single pair of electrodes, parallel arrangement of multiple pairs of electrodes and parallel arrangement of a single pair of electrodes. The polishing effect is tested by means of cathode and anode polarized regions of the workpiece in a static state. FIG. 6 illustrates a relative position relationship among cathode and anode electrodes, a baffle plate and a workpiece. The surface difference is proved by the value of the roughness Sa measured by an optical surface profiler (Sensorfar) so as to show the polarization capacity and the polishing effect.

Specifically, as shown in FIG. 4, the workpiece is placed between two electrodes in a beaker to simulate the configuration of an independent electric field between each pair of electrodes in the electrolytic polishing device, so that an induction anode is generated on the surface facing the cathode electrode, the effect of electrolytic oxidation is generated, the purpose of surface polishing is achieved, and the polishing effect of different degrees is achieved according to electricity.

As shown in FIG. 5, when the workpiece is placed in the electrolytic polishing device and provides electricity of 900-1000 kCm⁻² in a static state, the region facing the cathode electrode can obtain the same result as that in the beaker in FIG. 4, thus proving that the polishing effect can be achieved through polarization capacity.

Electricity (kCm⁻²) is an important factor that mainly affects the polishing degree. At the same time, polishing efficiency also needs to be considered. As shown in FIG. 6, the relative positions among the electrodes, workpiece and the baffle plate affect the polishing efficiency. The electrolytic polishing device can also control the distance between the cathode and the anode and the relative position between the baffle plates. Current is conducted from the cathode 16 and is conducted to the anode 15 through a path a 12 and a path b 13 at the same time.

When the path a is smaller than the path b, because the path a has a shorter distance and a smaller resistance value, more current is transmitted to the workpiece through the path a so as to achieve higher polishing efficiency.

When the path a is larger than the path b, because the path a has a longer distance and a larger resistance value, more current passes through the path b and the polishing efficiency is reduced.

As shown in FIG. 7, when reaction electricity (kCm⁻²) is increased to 150, the value of the surface roughness Sa is firstly increased. When the reaction electricity reaches 750 kCm⁻², the value of the surface roughness Sa begins to decrease, and when the reaction electricity is greater than 900 kCm⁻², the roughness is reduced, and a polishing effect is achieved.

It needs to be noted that for those skilled in the art, obviously the present disclosure is not limited to the details of the exemplary embodiment, and the present disclosure can be achieved in other specific forms without departing from the spirit or essential characteristics of the present disclosure. Therefore, for every point, the embodiments should be regarded as exemplary embodiments and are unrestrictive, the scope of the present disclosure is restricted by the claims appended hereto, therefore, all changes, including the meanings and scopes of equivalent elements, of the claims are aimed to be included in the present disclosure, and any mark of attached figures in the claims should not be regarded as limitation to the involved claims.

Specific examples are used for illustration of the principles and implementation methods of the present disclosure. The description of the above-mentioned embodiments is used to help illustrate the method and its core principles of the present disclosure. In addition, those skilled in the art can make various modifications in terms of specific embodiments and scope of application in accordance with the teachings of the present disclosure. In summary, the contents of this specification should not be understood as the limitation of the present disclosure.

Claims

1. An electrolytic polishing device, comprising an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply.

2. The electrolytic polishing device according to claim 1, wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged.

3. The electrolytic polishing device according to claim 1, wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly.

4. The electrolytic polishing device according to claim 3, wherein a plurality of partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath.

5. The electrolytic polishing device according to claim 1, further comprising an electrolyte tank, and the electrolyte tank is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank.

6. The electrolytic polishing device according to claim 5, wherein the electrolyte tank is located below the electrolytic bath and is capable of surrounding a bottom of the electrolytic bath; an opening is formed in a side wall, along the extending direction of the polishing channel, of the electrolytic bath, and the electrolyte in the electrolytic bath is capable of falling into the electrolyte tank through the opening; and the electrolyte tank is connected with the electrolytic bath through a pipeline and an acid-resistant pump, thereby providing the electrolyte for the electrolytic bath.

7. The electrolytic polishing device according to claim 6, wherein an electrolyte chamber is formed in the bottom of the electrolytic bath, the electrolyte tank is connected with the electrolyte chamber through the pipeline, and a plurality of jet holes for spraying the electrolyte into the electrolytic bath are formed in a top of the electrolyte chamber.

8. An electrolytic polishing system, comprising a cleaning device and the electrolytic polishing device according to claim 1, wherein the cleaning device is capable of cleaning the to-be-polished workpiece after polishing is completed.

9. An electrolytic polishing method, using the electrolytic polishing device according to claim 1, and comprising: S1, putting a to-be-polished workpiece into the polishing channel to move along the polishing channel for polishing; andS2, after the polishing is completed, taking out the to-be-polished workpiece.

10. The electrolytic polishing method according to claim 9, further comprising the following steps after the step S2: S21, cleaning the to-be-polished workpiece after the polishing is completed;S22, drying the to-be-polished workpiece after the cleaning is completed; andS23, measuring a surface roughness of the to-be-polished workpiece after the drying is completed.

11. The electrolytic polishing system according to claim 8, wherein, the electrolytic polishing device comprises an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply

12. The electrolytic polishing system according to claim 11, wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged.

13. The electrolytic polishing system according to claim 11, wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly.

14. The electrolytic polishing system according to claim 13, wherein a plurality of partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath.

15. The electrolytic polishing system according to claim 11, further comprising an electrolyte tank, and the electrolyte tank is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank.

16. The electrolytic polishing system according to claim 15, wherein the electrolyte tank is located below the electrolytic bath and is capable of surrounding a bottom of the electrolytic bath; an opening is formed in a side wall, along the extending direction of the polishing channel, of the electrolytic bath, and the electrolyte in the electrolytic bath is capable of falling into the electrolyte tank through the opening; and the electrolyte tank is connected with the electrolytic bath through a pipeline and an acid-resistant pump, thereby providing the electrolyte for the electrolytic bath.

17. The electrolytic polishing system according to claim 16, wherein an electrolyte chamber is formed in the bottom of the electrolytic bath, the electrolyte tank is connected with the electrolyte chamber through the pipeline, and a plurality of jet holes for spraying the electrolyte into the electrolytic bath are formed in a top of the electrolyte chamber.

18. The electrolytic polishing method according to claim 9, wherein, the electrolytic polishing device comprises an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply.

19. The electrolytic polishing method according to claim 18, wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged.

20. The electrolytic polishing method according to claim 18, wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly.